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9 条记录 (耗时 0.029 秒)

    Method for patterning flexible substrate
    1.
    发明授权
    Method for patterning flexible substrate 有权
    图案柔性基板的方法

    公开(公告)号：US08859055B2

    公开(公告)日：2014-10-14

    申请号：US13103943

    申请日：2011-05-09

    申请人： Pao-Ming Tsai ,  Yu-Yang Chang ,  Liang-You Jiang ,  Yu-Jen Chen

    发明人： Pao-Ming Tsai ,  Yu-Yang Chang ,  Liang-You Jiang ,  Yu-Jen Chen

    IPC分类号： B05D3/06 ,  B05D1/36 ,  B05D1/32 ,  G03F7/20 ,  G02F1/00 ,  G03F7/34 ,  G02F1/1333

    CPC分类号： G03F7/343 ,  G02F1/00 ,  G02F1/133305 ,  G03F7/2016 ,  G03F7/34

    摘要： The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.

    摘要翻译： 本发明提供了一种用于图案化柔性基板的方法。 图案化柔性基板的方法包括提供载体基板。 在载体基板上形成剥离层。 在剥离层上形成柔性基材膜。 形成多个UV阻挡掩模图案，覆盖柔性基底膜和释放层的各个部分。 执行紫外线照射工艺以将柔性基底膜和未被UV阻挡掩模图案覆盖的剥离层暴露于UV光。 进行剥离步骤，使得柔性基材薄膜的不暴露于紫外光的各个部分的正上方的各个部分与载体基板分离。

    METHOD FOR PATTERNING FLEXIBLE SUBSTRATE
    2.
    发明申请
    METHOD FOR PATTERNING FLEXIBLE SUBSTRATE 有权
    用于绘制柔性衬底的方法

    公开(公告)号：US20120052214A1

    公开(公告)日：2012-03-01

    申请号：US13103943

    申请日：2011-05-09

    申请人： Pao-Ming Tsai ,  Yu-Yang Chang ,  Liang-You Jiang ,  Yu-Jen Chen

    发明人： Pao-Ming Tsai ,  Yu-Yang Chang ,  Liang-You Jiang ,  Yu-Jen Chen

    IPC分类号： B05D5/00 ,  B05D1/36 ,  B05D3/04 ,  B05D3/06

    CPC分类号： G03F7/343 ,  G02F1/00 ,  G02F1/133305 ,  G03F7/2016 ,  G03F7/34

    摘要： The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.

    摘要翻译： 本发明提供了一种用于图案化柔性基板的方法。 图案化柔性基板的方法包括提供载体基板。 在载体基板上形成剥离层。 在剥离层上形成柔性基材膜。 形成多个UV阻挡掩模图案，覆盖柔性基底膜和释放层的各个部分。 执行紫外线照射工艺以将柔性基底膜和未被UV阻挡掩模图案覆盖的剥离层暴露于UV光。 进行剥离步骤，使得柔性基材薄膜的不暴露于紫外光的各个部分的正上方的各个部分与载体基板分离。

    METHOD FOR DE-BONDING FLEXIBLE DEVICE
    3.
    发明申请
    METHOD FOR DE-BONDING FLEXIBLE DEVICE 审中-公开
    用于去粘合柔性装置的方法

    公开(公告)号：US20120216961A1

    公开(公告)日：2012-08-30

    申请号：US13466542

    申请日：2012-05-08

    申请人： Pao-Ming Tsai ,  Liang-You Jiang ,  Yu-Yang Chang

    发明人： Pao-Ming Tsai ,  Liang-You Jiang ,  Yu-Yang Chang

    IPC分类号： B32B38/10

    CPC分类号： H01L21/67092 ,  G02F1/1303 ,  G02F1/133305 ,  G09F3/208 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1184 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1967

    摘要： The disclosure provides a method for de-bonding a flexible device. The method for de-bonding a flexible device includes providing a first carrier to mount a carrier substrate thereon, a release layer thereon and a flexible device covering the release layer and a portion of the carrier substrate. A vacuum suction process is performed to suction the flexible device using a vacuum device. A separation process is performed with air entering into an interface between the flexible device and the release layer to separate a portion of the flexible device from the release layer and the carrier substrate using a separation device. A first release process is performed so that the portion of the flexible device is separated from the vacuum device.

    摘要翻译： 本公开提供了一种用于去耦合柔性装置的方法。 用于去粘合柔性器件的方法包括提供第一载体以在其上安装载体衬底，其上的剥离层和覆盖释放层的柔性器件和载体衬底的一部分。 进行真空抽吸处理，以使用真空装置抽吸柔性装置。 使用进入柔性装置和释放层之间的界面的空气进行分离处理，以使用分离装置将柔性装置的一部分与脱离层和载体基板分开。 执行第一释放过程，使得柔性装置的部分与真空装置分离。

    APPARATUS FOR DE-BONDING FLEXIBLE DEVICE AND METHOD FOR DE-BONDING FLEXIBLE DEVICE
    5.
    发明申请
    APPARATUS FOR DE-BONDING FLEXIBLE DEVICE AND METHOD FOR DE-BONDING FLEXIBLE DEVICE 审中-公开
    用于去粘合柔性装置的装置和用于去粘合柔性装置的方法

    公开(公告)号：US20100224320A1

    公开(公告)日：2010-09-09

    申请号：US12488934

    申请日：2009-06-22

    申请人： Pao-Ming Tsai ,  Liang-You Jiang ,  Yu-Yang Chang

    发明人： Pao-Ming Tsai ,  Liang-You Jiang ,  Yu-Yang Chang

    IPC分类号： B32B38/10 ,  B29C63/00

    CPC分类号： H01L21/67092 ,  G02F1/1303 ,  G02F1/133305 ,  G09F3/208 ,  Y10T156/1132 ,  Y10T156/1158 ,  Y10T156/1184 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1967

    摘要： The invention provides an apparatus for de-bonding a flexible device and method thereof. The apparatus for de-bonding a flexible device includes a carrier to mount a carrier substrate thereon, a release layer thereon and a flexible device covering the release layer. A separation device disposed over the carrier is used to separate the flexible device from the release layer and the carrier substrate with air entering into an interface between the flexible device and the release layer. A vacuum device disposed over the carrier is used to suction the flexible device.

    摘要翻译： 本发明提供了一种用于去粘合柔性装置的装置及其方法。 用于去粘合柔性装置的装置包括载体，用于在其上安装载体基材，其上具有剥离层，以及覆盖释放层的柔性装置。 设置在载体上的分离装置用于将柔性装置与释放层和载体基板分离，空气进入柔性装置和释放层之间的界面。 使用设置在载体上的真空装置来抽吸柔性装置。