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    Process for preparing .alpha.-L-aspartyl-L-phenylalanine methyl ester
    1.
    发明授权
    Process for preparing .alpha.-L-aspartyl-L-phenylalanine methyl ester 失效
    制备α-L-天冬氨酰-L-苯丙氨酸甲酯的方法

    公开(公告)号：US4613460A

    公开(公告)日：1986-09-23

    申请号：US661390

    申请日：1984-10-16

    申请人： Paolo Casati ,  Biagio Elefante ,  Claudio Fuganti

    发明人： Paolo Casati ,  Biagio Elefante ,  Claudio Fuganti

    IPC分类号： C07K1/113 ,  C07K5/075 ,  C07K5/06

    CPC分类号： C07K5/0613

    摘要： A process for preparing .alpha.-L-aspartyl-L-phenylalanine methyl ester: ##STR1## in which: (a) the compound methyl N(.alpha.-L-aspartyl).alpha.-aminocinnamate, protected at the nitrogen, of formula: ##STR2## where R is a protector group at the nitrogen, is subjected to hydrogenation at the olefin bond by means of gaseous hydrogen in the presence of a hydrogenation catalyst, to give the compound of formula: ##STR3## where R has the aforesaid meaning, in the form of a mixture of .alpha.-L-aspartyl-L-phenylalanine methyl ester protected at the nitrogen, and .alpha.-L-aspartyl-D-phenylalanine methyl ester protected at the nitrogen;(b) the protector group is removed from the .alpha.-L-aspartyl-L-phenylalanine and .alpha.-L-aspartyl-D-phenylalanine methyl esters protected at the nitrogen;(c) the .alpha.-L-aspartyl-L-phenylalanine methyl ester is separated and recovered from the deprotection reaction product.

    摘要翻译： 制备α-L-天冬氨酰基-L-苯丙氨酸甲酯的方法：其中：（a）在氮保护下的式（A）化合物甲基N（α-L-天冬氨酰基）α-氨基肉桂酸酯 ：其中R是氮的保护基，在氢化催化剂存在下，通过气态氢在烯烃键上进行氢化，得到下式的化合物：（IV） ）其中R具有上述含义，以氮保护的α-L-天冬氨酰基-L-苯丙氨酸甲酯和氮保护的α-L-天冬氨酰-D-苯丙氨酸甲酯的混合物形式; （b）保护基团从α-L-天冬氨酰基-L-苯丙氨酸和α-L-天冬氨酰-D-苯丙氨酸甲酯在氮气保护下除去; （c）从脱保护反应产物中分离并回收α-L-天冬氨酰基-L-苯丙氨酸甲酯。

    Process for the preparation of L-carnitine
    2.
    发明授权
    Process for the preparation of L-carnitine 失效
    制备左旋肉碱的方法

    公开(公告)号：US4664852A

    公开(公告)日：1987-05-12

    申请号：US866144

    申请日：1986-05-22

    申请人： Paolo Casati ,  Claudio Fuganti

    发明人： Paolo Casati ,  Claudio Fuganti

    IPC分类号： C07C69/675 ,  C07C20060101 ,  C07C67/00 ,  C07C227/00 ,  C07C227/08 ,  C07C227/18 ,  C07C229/22 ,  C07C231/00 ,  C07C231/04 ,  C07C231/12 ,  C07C235/12 ,  C07C235/80 ,  C07C101/12

    CPC分类号： C07C229/22

    摘要： A process for preparing L-carnitine (I) wherein(a) diketene (II) is reacted with chlorine, and the chlorination product thus obtained is submitted to amidation by the methylester of an optically-active aminoacid, having formula: ##STR1## wherein R=CH.sub.2 A.sub.r or A.sub.r wherein Ar is a substituted or not-substituted aromatic group, to yield the compound 4-chloro-3-ketobutyrylamide of the methylester of the optically-active aminoacid: (IV)(b) the compound (IV) is reduced in the presence of a reducing agent to yield a mixture (V) of (3R)-4-chloro-3-hydroxybutyrylamide of the methylester of an optically-active acid (VI), and (3S)-4-chloro-3-hydroxybutyrylamide of the methylester of an optically active aminoacid (VII),(c) the compound (VI) is separated and recovered from the reduction reaction product,(d) the compound (VI) is submitted to methanolysis by hydrogen chloride gas in methanol,(e) the methylester of the optically-active aminoacid (III) is precipitated and recovered from the methanolysis reaction product,(f) from the mother liquors the methylester of (3R)-4-chloro-3-hydroxybutyric acid (VIII) is recovered,(g) the compound (VIII) thus obtained is treated with trimethylamine in ethanol, is hydrolyzed with hydrochloric acid and L-carnitine is separated and recovered.

    摘要翻译： 一种制备左旋肉碱（I）的方法，其中（a）双烯酮（II）与氯反应，由此获得的氯化产物经过具有下式的光学活性氨基酸的甲酯进行酰胺化： III）其中R = CH 2 Ar或Ar，其中Ar是取代或未取代的芳族基团，得到光学活性氨基酸的甲酯的化合物4-氯-3-酮丁酰胺：（IV）（b）化合物（ IV）在还原剂存在下还原，得到光学活性酸（VI）的甲酯的（3R）-4-氯-3-羟基丁酰胺的混合物（V），和（3S）-4- 光学活性氨基酸（VII）的甲酯的氯-3-羟基丁酰胺，（c）化合物（VI）从还原反应产物中分离回收，（d）化合物（VI）通过氯化氢进行甲醇分解 在甲醇中的气体，（e）光学活性氨基酸（III）的甲酯沉淀并从甲烷中回收 （f）从母液中回收（3R）-4-氯-3-羟基丁酸（VIII）的甲酯，（g）将所得化合物（Ⅷ）用乙醇中的三甲胺处理， 用盐酸水解并分离和回收L-肉碱。

    Insulated power multichip package
    3.
    发明授权
    Insulated power multichip package 有权
    绝缘电源多芯片封装

    公开(公告)号：US06473310B1

    公开(公告)日：2002-10-29

    申请号：US09507558

    申请日：2000-02-18

    申请人： Paolo Casati ,  Carlo Cognetti

    发明人： Paolo Casati ,  Carlo Cognetti

    IPC分类号： H05K710

    CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014

    摘要： The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.

    摘要翻译： 本发明包括具有彼此电隔离的至少两个芯片的多芯片集成电路封装。 在多芯片集成电路封装内是直接耦合到至少两个芯片的芯片，没有任何中间绝缘层。 芯片在两个芯片之间的适当位置物理分离，从而有效地消除了两个芯片之间的电气干扰。 使集成电路封装开始于将两个芯片直接连接到散热片上。 散热片可以在芯片之间运行预切割槽。 一旦芯片连接到芯块上，芯块就被模制成多芯片集成电路封装。 然后，将塞子从下侧物理分离成两片，分离沿着预切槽延伸。 通常，锯屑将被锯切割而分离。

    Optical communication module
    5.
    发明申请
    Optical communication module 有权
    光通信模块

    公开(公告)号：US20060072882A1

    公开(公告)日：2006-04-06

    申请号：US11235770

    申请日：2005-09-27

    申请人： Paolo Casati ,  Guido Chiaretti

    发明人： Paolo Casati ,  Guido Chiaretti

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4277 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4246

    摘要： The optical communication module can be coupled to at least one optical fiber and includes at least one optoelectronic device, a base portion, and a cover portion which can be connected to the base portion to define an internal chamber to house the optoelectronic device. The cover portion includes at least one window to couple at least one optical signal between the at least one device and the optical fiber. The module further includes a plate, substantially transparent to the optical signal, having a first side facing the cover portion and a second side facing the internal chamber, the first plate substantially enabling sealing of the window. A shielding plate can be connected to the second side and provided with at least one opening substantially aligned with the window to enable passage of the optical signal.

    摘要翻译： 光通信模块可以耦合到至少一个光纤并且包括至少一个光电子器件，基底部分和盖部分，其可以连接到基部以限定用于容纳光电子器件的内部腔室。 盖部分包括至少一个窗口，用于在至少一个设备和光纤之间耦合至少一个光信号。 模块还包括对光信号基本透明的板，具有面向盖部的第一面和面对内室的第二侧，第一板基本上能够密封窗。 屏蔽板可以连接到第二侧并且设置有至少一个与窗口大致对准的开口，以使得光信号能够通过。

    Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device
    9.
    发明授权
    Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device 失效
    用于组装和树脂封装散热器安装的半导体功率器件的装置

    公开(公告)号：US5370517A

    公开(公告)日：1994-12-06

    申请号：US45983

    申请日：1993-04-09

    申请人： Paolo Casati ,  Carlo C. De Martiis ,  Giuseppe Marchisi

    发明人： Paolo Casati ,  Carlo C. De Martiis ,  Giuseppe Marchisi

    IPC分类号： H01L21/56 ,  H01L23/433 ,  B29C ,  B29C45/14

    CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L2924/0002 ,  Y10S425/228 ,  Y10T29/49121

    摘要： A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.

    摘要翻译： 模压框架通过将柔性突片楔入接收底板的凹槽中而紧固到散热器金属底板上，同时保持框架基本上与基板的表面接触。 然后，线焊接操作可以在图案化的金属框架的指状物的端部上发生，同时固定在基板的表面上，从而便于焊接。 金属框架从散热器基板表面的脱落发生在用于封装在树脂中的模具的封闭件上。 树脂的注入及其固化在关闭时由模具施加的退回位置中的销钉“冻结”，从而确保销和整体式散热器基板之间的电气隔离。