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27 条记录 (耗时 0.018 秒)

    Apparatus for conditioning processing pads
    1.
    发明申请
    Apparatus for conditioning processing pads 有权
    用于调理加工垫的装置

    公开(公告)号：US20050282477A1

    公开(公告)日：2005-12-22

    申请号：US11102052

    申请日：2005-04-08

    申请人： Paul Butterfield ,  Sen-Hou Ko

    发明人： Paul Butterfield ,  Sen-Hou Ko

    IPC分类号： B24B1/00 ,  B24B37/04 ,  B24B53/007 ,  B24B53/12

    CPC分类号： B24B53/017 ,  B24B53/12

    摘要： Embodiments of a flexible pad conditioner for conditioning a processing pad are provided. The pad conditioner includes an arc-shaped member having an abrasive bottom surface configured for conditioning the processing pad. Means are provided to apply a downward force as well as to oscillate the pad conditioner. Further means may be provided to vary the downward force along the length of the pad conditioner. In one embodiment, a plurality of actuators may be coupled to a top surface of the member and adapted to selectively provide an independently controllable force against the member to finely control the conditioning profile.

    摘要翻译： 提供了一种用于调理处理垫的柔性垫调节器的实施例。 垫调节器包括具有用于调理处理垫的研磨底面的弧形构件。 提供装置以施加向下的力以及使垫调节器振荡。 可以提供另外的装置来改变沿衬垫调节器的长度的向下的力。 在一个实施例中，多个致动器可以联接到构件的顶表面并且适于选择性地提供抵靠构件的独立可控的力以精细地控制调节轮廓。

    Polishing media stabilizer
    8.
    发明授权
    Polishing media stabilizer 有权
    抛光介质稳定剂

    公开(公告)号：US07381116B2

    公开(公告)日：2008-06-03

    申请号：US11394255

    申请日：2006-03-30

    申请人： Phillip R. Sommer ,  Paul Butterfield

    发明人： Phillip R. Sommer ,  Paul Butterfield

    IPC分类号： B24B21/00

    CPC分类号： B24B37/26 ,  B24B37/20 ,  H01L21/30625 ,  Y10S451/921

    摘要： A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.

    摘要翻译： 一种抛光装置，其采用抛光介质保持装置，以防止抛光过程中抛光介质中的滑动或褶皱。 通过施加在抛光介质和支撑表面之间的真空将抛光介质拉到支撑表面上。 此外，多孔层可以放置在抛光介质和支撑表面之间，以在施加真空时在抛光介质中形成凹坑。 一种替代方案是将抛光介质吸附在载体和待抛光的基底上。

    SYSTEM AND METHOD FOR IN-SITU HEAD RINSE
    9.
    发明申请
    SYSTEM AND METHOD FOR IN-SITU HEAD RINSE 审中-公开
    用于现场头部冲洗的系统和方法

    公开(公告)号：US20080003931A1

    公开(公告)日：2008-01-03

    申请号：US11562811

    申请日：2006-11-22

    申请人： Antoine Manens ,  Alain Duboust ,  Paul Butterfield ,  Yan Wang ,  Shi-Ping Wang ,  Zhihong Wang ,  Andrew Nagengast ,  Wei-Yung Hsu ,  Liang-Yuh Chen

    发明人： Antoine Manens ,  Alain Duboust ,  Paul Butterfield ,  Yan Wang ,  Shi-Ping Wang ,  Zhihong Wang ,  Andrew Nagengast ,  Wei-Yung Hsu ,  Liang-Yuh Chen

    IPC分类号： B24B53/007

    CPC分类号： B24B37/30 ,  B24B55/00 ,  H01L21/67219

    摘要： A carrier head and a method of cleaning the carrier head are disclosed. The carrier head may have one or more openings through a sidewall that extend into a cavity within the carrier head using a fluid passage. The openings may each have a lip. The lip may have a chamfered edge. Additionally, a fluid passage may slope generally downward from the openings to the cavity. The chamfered lips and the sloped fluid passage reduce back splashing and help ensure that sufficient rinsing fluid reaches the cavity to rinse polishing fluid and particles from the carrier head. The present invention relates to carrier heads for polishing or planarizing semiconductor substrates by chemical mechanical polishing (CMP) or electrochemical mechanical polishing (ECMP). The cavities in the carrier head are cleaned by rinsing fluid (i.e., liquid or gas) from inside the cavity towards a substrate receiving side of the carrier head.

    摘要翻译： 公开了载体头和清洁载体头的方法。 载体头部可以具有穿过侧壁的一个或多个开口，该侧壁使用流体通道延伸到载体头部内的空腔中。 开口可以各自具有唇缘。 唇缘可以具有倒角边缘。 此外，流体通道可以从开口大致向下倾斜到空腔。 倒角的唇缘和倾斜的流体通道减少了飞溅，并有助于确保足够的冲洗流体到达腔体以从载体头部漂洗抛光液和颗粒。 本发明涉及用于通过化学机械抛光（CMP）或电化学机械抛光（ECMP）对半导体衬底进行抛光或平面化的载体头。 载体头部中的空腔通过从空腔内部朝向承载头的基板接收侧的冲洗流体（即，液体或气体）来清洁。

    Systems and methods for reducing edge effects
    10.
    发明申请
    Systems and methods for reducing edge effects 有权
    降低边缘效应的系统和方法

    公开(公告)号：US20070134561A1

    公开(公告)日：2007-06-14

    申请号：US11297294

    申请日：2005-12-09

    申请人： Paul Butterfield ,  Michael Diehl

    发明人： Paul Butterfield ,  Michael Diehl

    IPC分类号： G03F1/00

    CPC分类号： G03F7/2014 ,  G03F1/50 ,  G03F1/68

    摘要： systems, methods, and programs for reducing edge effects, the systems, methods, and programs include inputting an image mask, the image mask defining the location of a boundary to recieve a coating , modifying an edge of the image mask to reduced the thickness of the coating at the modified edge; creating a printing plate base on the modifide image mask; and using the printing plate to print the coating on a substrate.

    摘要翻译： 用于减少边缘效应的系统，方法和程序，系统，方法和程序包括输入图像掩模，图像掩模限定边界的位置以接收涂层，修改图像掩模的边缘以减小图像掩模的厚度 改性边缘的涂层; 在修饰图像掩模上创建印版; 并使用印版将涂层印刷在基材上。