摘要:
A 3D package has: a three-dimensional (3D) package substrate, a land grid array (LGA) or quad flat no-lead (QFN) package mounted on the 3D package substrate, the LGA or QFN package having an LGA or QFN die on a first side of an LGA or QFN package substrate, and a second die mounted directly on a second side of the LGA or QFN package substrate opposite the first side.
摘要:
A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.
摘要:
A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.
摘要:
A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.
摘要:
A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.
摘要:
A method for operating computer objects and the computer program product thereof are disclosed, and they are utilized to a computer. The computer includes an operating interface which comprises defining a work region, function instruction list and a plurality of computer objects, and parts of the computer objects are chosen. The steps of the method comprises: an input device which is connected to a processing device in the computer for defining the position information of the input device, and a computer object which is chosen on the work region of the operating interface is clicked for operating the computer object; wherein a function instruction, which comprises actions of rotation, zoom in/zoom out, movement, of the computer object, is clicked for users to operate the computer object.
摘要:
A method of operating presentation through a multi-touch panel, comprises steps of providing a presenting module having a format transformation module, user interface generator and presenting/reading mode switching module to a system; activating the presenting module and display interface generated by the user interface generator on a multiple-touch panel of the system, wherein the interface generated by the user interface generator includes a shrinkage image area to display the non-activated file, an operation area to display file which is activated and a buffer zoon to allow a user drag file in the shrinkage image area to the operation area, thereby activating the dragged file.
摘要:
A multi-user operating system through a multi-touch panel comprises a processor; a storage medium coupled to the processor; a multiple touch panel coupled to the processor to sense multi-touch event by at least one user, followed by displaying instruction result corresponding to the multi-touch event; a display dividing module coupled to the processor to divide the multiple touch panel into at least two sub-display areas; multiple user operation module being stored in the storage medium to instruct the display dividing module to execute a multiple user mode or a single user mode, thereby allowing the multiple user manipulate virtual objects on the at least two sub-display areas, simultaneously.
摘要:
A data source circuit and a complementary data recovery circuit which can transmit and receive data at a higher rate than a conventional data source circuit which uses similar fabrication technology. A data source circuit of the present invention has an input for receiving a periodic source clock signal having a period T; a synchronization signal generator for generating, based on said downstream-clock signal, a series of one or more periodic synchronization signals having periods substantially equal to T, each synchronization signal being delayed from a previous synchronization signal; and a transmitter for transmitting one or more sub-words of a multi-bit data word, each sub-word having one or more bits, separate ones of said one or more sub-words being transmitted responsive to separate progressively delayed combined pairs of said synchronization signals. In a preferred embodiment of the present invention particularly suited for use in a point to point (e.g. a ring-type) data network, a recovery circuit and a source circuit are integrated as a receiver/retransmission node.
摘要:
A circuit is for re-synchronizing an event indication signal received from a foreign domain to generate a result indication signal that is re-synchronized to a host clock signal. The event indication signal is received from the foreign domain at a first input terminal; and a host clock signal is received at a second input terminal. Edge-triggered flip flop circuitry of the circuit has a clock input, a data input, and a data output. The clock input is coupled to the second input terminal and the data input is coupled to receive a latch output signal. The edge-triggered flip flop circuitry clocks the latch output signal to the data output of the flip flop circuitry, to generate a result event indication signal, in response to a transition in the host clock signal. Delay circuitry is coupled to the first input terminal to receive the event indication signal. The delay circuitry provides a delayed event indication signal having a phase that is delayed from the event indication signal. Transparent latch circuitry latches the delayed event indication signal responsive to a latch control signal, and combination circuitry is coupled to receive the event indication signal and the result event indication signal, and provides a combination thereof as the latch control signal.