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    Sacrificial layer technique to make gaps in MEMS applications
    2.
    发明申请
    Sacrificial layer technique to make gaps in MEMS applications 有权
    牺牲层技术在MEMS应用中产生空白

    公开(公告)号：US20060027891A1

    公开(公告)日：2006-02-09

    申请号：US11241024

    申请日：2005-09-30

    Applicant: Qing Ma ,  Peng Cheng

    Inventor： Qing Ma ,  Peng Cheng

    IPC: H01L29/00

    CPC classification number: B81C1/00126 ,  B81C2201/0109 ,  H03H3/0072

    Abstract: A method comprising over an area of a substrate, forming a plurality of three dimensional first structures; following forming the first structures, conformally introducing a sacrificial material over the area of the substrate; introducing a second structural material over the sacrificial material; and removing the sacrificial material. An apparatus comprising a first structure on a substrate; and a second structure on the substrate and separated from the first structure by an unfilled gap defined by the thickness of a removed film.

    Abstract translation: 一种方法，包括在衬底的一个区域上，形成多个三维第一结构; 在形成第一结构之后，在衬底的区域上保形地引入牺牲材料; 在牺牲材料上引入第二结构材料; 并去除牺牲材料。 一种装置，包括在基板上的第一结构; 以及第二结构，并且通过由去除膜的厚度限定的未填充间隙与第一结构分离。

    Vacuum-cavity MEMS resonator
    3.
    发明授权
    Vacuum-cavity MEMS resonator 失效
    真空腔MEMS谐振器

    公开(公告)号：US06808954B2

    公开(公告)日：2004-10-26

    申请号：US09949368

    申请日：2001-09-07

    Applicant: Qing Ma ,  Peng Cheng ,  Valluri Rao

    Inventor： Qing Ma ,  Peng Cheng ,  Valluri Rao

    IPC: H01L2100

    CPC classification number: B81B7/0077 ,  H03H3/0072 ,  H03H9/1057 ,  H03H9/2405 ,  H03H9/2431 ,  H03H9/2457 ,  H03H9/2463 ,  H03H2009/02503 ,  H03H2009/02511

    Abstract: A microelectromechanical (MEMS) resonator with a vacuum-cavity is fabricated using polysilicon-enabled release methods. A vacuum-cavity surrounding the MEMS beam is formed by removing release material that surrounds the beam and sealing the resulting cavity under vacuum by depositing a layer of nitride over the structure. The vacuum-cavity MEMS resonators have cantilever beams, bridge beams or breathing-bar beams.

    Abstract translation: 具有真空腔的微机电（MEMS）谐振器是使用多晶硅启用释放方法制造的。 围绕MEMS光束的真空腔通过去除围绕光束的释放材料并通过在结构上沉积氮化层而在真空下密封所得空腔来形成。 真空腔MEMS谐振器具有悬臂梁，桥梁或呼吸杆梁。

    Variable tunable range MEMS capacitor
    5.
    发明授权
    Variable tunable range MEMS capacitor 失效
    可变可调范围的MEMS电容器

    公开(公告)号：US06980412B2

    公开(公告)日：2005-12-27

    申请号：US09992796

    申请日：2001-11-05

    Applicant: Peng Cheng ,  Qing Ma

    Inventor： Peng Cheng ,  Qing Ma

    IPC: H01G5/16 ,  H01G5/00 ,  H01G7/00

    CPC classification number: H01G5/16 ,  Y10T29/435

    Abstract: The invention relates to a variable capacitor and method of making it. The variable capacitor comprises a fixed charge plate disposed in a substrate, a movable charge plate disposed above the fixed charge plate, and a stiffener affixed to the movable charge plate. The movable charge plate may be patterned to form a movable actuator plate where the fixed charge plate is elevated above a fixed actuator plate.

    Abstract translation: 本发明涉及一种可变电容器及其制造方法。 可变电容器包括设置在基板中的固定充电板，设置在固定充电板上方的可移动充电板和固定到可移动充电板的加强件。 可移动充电板可以被图案化以形成可动致动器板，其中固定的充电板在固定的致动器板上方升高。

    Center-mass-reduced microbridge structures for ultra-high frequency MEM resonator
    6.
    发明授权
    Center-mass-reduced microbridge structures for ultra-high frequency MEM resonator 失效
    用于超高频MEM谐振器的中心质量减小的微桥结构

    公开(公告)号：US06630871B2

    公开(公告)日：2003-10-07

    申请号：US09967732

    申请日：2001-09-28

    Applicant: Qing Ma ,  Peng Cheng

    Inventor： Qing Ma ,  Peng Cheng

    IPC: H03B530

    CPC classification number: B81B3/0078 ,  B81B2201/016 ,  B81B2203/019 ,  H03H3/0077 ,  H03H9/2463

    Abstract: A micro-electromechanical (MEM) resonator is described that includes a substrate, a microbridge beam structure coupled to the substrate and at least one electrode disposed adjacent to the microbridge beam structure to induce vibration of the beam. The microbridge beam structure includes support sections and a beam formed between the support sections. The center region of the beam has a mass that is less than the mass of regions of the beam adjacent to the support sections.

    Abstract translation: 描述了一种微机电（MEM）谐振器，其包括衬底，耦合到衬底的微桥梁结构和邻近微桥梁结构设置的至少一个电极以引起梁的振动。 微桥梁结构包括支撑部分和形成在支撑部分之间的梁。 梁的中心区域的质量小于与支撑部分相邻的梁的区域的质量。

    Sacrificial layer technique to make gaps in MEMS applications
    8.
    发明授权
    Sacrificial layer technique to make gaps in MEMS applications 有权
    牺牲层技术在MEMS应用中产生空白

    公开(公告)号：US07358580B2

    公开(公告)日：2008-04-15

    申请号：US11241024

    申请日：2005-09-30

    Applicant: Qing Ma ,  Peng Cheng

    Inventor： Qing Ma ,  Peng Cheng

    IPC: H01L27/14 ,  H01L29/82 ,  H01L29/84 ,  B81B3/00

    CPC classification number: B81C1/00126 ,  B81C2201/0109 ,  H03H3/0072

    Abstract: A method comprising over an area of a substrate, forming a plurality of three dimensional first structures; following forming the first structures, conformally introducing a sacrificial material over the area of the substrate; introducing a second structural material over the sacrificial material; and removing the sacrificial material. An apparatus comprising a first structure on a substrate; and a second structure on the substrate and separated from the first structure by an unfilled gap defined by the thickness of a removed film.

    Abstract translation: 一种方法，包括在衬底的一个区域上，形成多个三维第一结构; 在形成第一结构之后，在衬底的区域上保形地引入牺牲材料; 在牺牲材料上引入第二结构材料; 并去除牺牲材料。 一种装置，包括在基板上的第一结构; 以及第二结构，并且通过由去除膜的厚度限定的未填充间隙与第一结构分离。

    MEMS device integrated chip package, and method of making same
    9.
    发明授权
    MEMS device integrated chip package, and method of making same 有权
    MEMS器件集成芯片封装及其制造方法

    公开(公告)号：US07291561B2

    公开(公告)日：2007-11-06

    申请号：US10623965

    申请日：2003-07-21

    Applicant: Qing Ma ,  Peng Cheng ,  Valluri Rao

    Inventor： Qing Ma ,  Peng Cheng ,  Valluri Rao

    IPC: H01L21/461 ,  H01L21/311 ,  H01L29/00 ,  H01L27/108

    CPC classification number: B81C1/00333 ,  H01G5/16 ,  H01G5/40 ,  H01L2224/48091 ,  Y10T428/24248 ,  H01L2924/00014

    Abstract: The present invention relates to a chip package that includes a semiconductor device and at least one micro electromechanical structure (MEMS) such that the semiconductor device and the MEMS form an integrated package. One embodiment of the present invention includes a semiconductor device, a first MEMS device disposed in a conveyance such as a film, and a second MEMS device disposed upon the semiconductor device through a via in the conveyance.The present invention also relates to a process of forming a chip package that includes providing a conveyance such as a tape automated bonding (TAB) structure, that may hold at least one MEMS device. The method is further carried out by disposing the conveyance over the active surface of the device in a manner that causes the at least one MEMS to communicate electrically to the active surface. Where appropriate, a sealing structure such as a solder ring may be used to protect the MEMS.

    Abstract translation: 本发明涉及包括半导体器件和至少一个微机电结构（MEMS）的芯片封装，使得半导体器件和MEMS形成集成封装。 本发明的一个实施例包括半导体器件，设置在诸如膜的输送器中的第一MEMS器件，以及通过输送中的通孔设置在半导体器件上的第二MEMS器件。 本发明还涉及一种形成芯片封装的方法，其包括提供诸如胶带自动键合（TAB）结构的输送，其可以保持至少一个MEMS器件。 该方法进一步通过以使得至少一个MEMS与活性表面电连通的方式布置在器件的有效表面上的输送来进行。 在适当的情况下，可以使用诸如焊环的密封结构来保护MEMS。

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