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98 条记录 (耗时 0.02 秒)

    Resonator frequency correction by modifying support structures
    1.
    发明授权
    Resonator frequency correction by modifying support structures 失效

    公开(公告)号：US06650204B2

    公开(公告)日：2003-11-18

    申请号：US10307053

    申请日：2002-11-27

    申请人： Qing Ma ,  Peng Cheng ,  Valluri Rao

    发明人： Qing Ma ,  Peng Cheng ,  Valluri Rao

    IPC分类号： H03H924

    CPC分类号： H03H3/0077 ,  H03H9/2463 ,  Y10S977/70 ,  Y10S977/721 ,  Y10S977/733 ,  Y10S977/888 ,  Y10S977/889

    摘要： A method including to a resonator coupled to at least one support structure on a substrate, the resonator having a resonating frequency in response to a frequency stimulus, modifying the resonating frequency by modifying the at least one support structure. A method including forming a resonator coupled to at least one support structure on a chip-level substrate, the resonator having a resonating frequency; and modifying the resonating frequency of the resonator by modifying the at least one support structure. A method including applying a frequency stimulus to a resonator coupled to at least one support structure on a chip-level substrate determining a resonating frequency; and modifying the resonating frequency of the resonator by modifying the at least one support structure. An apparatus including a resonator coupled to at least one support structure on a chip-level substrate, the resonator having a resonating frequency tuned by the modification of the at least one support structure to a selected frequency stimulus.

    Tunable inductor using microelectromechanical switches
    2.
    发明授权
    Tunable inductor using microelectromechanical switches 有权
    可调电感采用微机电开关

    公开(公告)号：US06573822B2

    公开(公告)日：2003-06-03

    申请号：US09884738

    申请日：2001-06-18

    申请人： Qing Ma ,  Peng Cheng ,  Valluri Rao

    发明人： Qing Ma ,  Peng Cheng ,  Valluri Rao

    IPC分类号： H01F500

    CPC分类号： H01F5/003 ,  H01F17/0006 ,  H01F21/12 ,  H01H59/0009 ,  H01L24/19 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

    摘要： A tunable inductor is disclosed. The tunable inductor comprises a helical or spiral inductor formed on a semiconductor substrate having an input and an output. The helical inductor has a full length that provides a full inductance. Also, a full inductance switch is disposed between the output and the full length of the helical inductor. Finally, at least one microelectromechanical (MEMS) switch is disposed between the output and an intermediate location of the helical inductor.

    摘要翻译： 公开了一种可调电感器。 可调电感器包括形成在具有输入和输出的半导体衬底上的螺旋或螺旋形电感器。 螺旋电感器具有提供全电感的全长。 此外，全电感开关设置在螺旋电感器的输出端和全长之间。 最后，至少一个微机电（MEMS）开关设置在螺旋电感器的输出端和中间位置之间。

    Vacuum-cavity MEMS resonator
    3.
    发明授权
    Vacuum-cavity MEMS resonator 失效
    真空腔MEMS谐振器

    公开(公告)号：US06808954B2

    公开(公告)日：2004-10-26

    申请号：US09949368

    申请日：2001-09-07

    申请人： Qing Ma ,  Peng Cheng ,  Valluri Rao

    发明人： Qing Ma ,  Peng Cheng ,  Valluri Rao

    IPC分类号： H01L2100

    CPC分类号： B81B7/0077 ,  H03H3/0072 ,  H03H9/1057 ,  H03H9/2405 ,  H03H9/2431 ,  H03H9/2457 ,  H03H9/2463 ,  H03H2009/02503 ,  H03H2009/02511

    摘要： A microelectromechanical (MEMS) resonator with a vacuum-cavity is fabricated using polysilicon-enabled release methods. A vacuum-cavity surrounding the MEMS beam is formed by removing release material that surrounds the beam and sealing the resulting cavity under vacuum by depositing a layer of nitride over the structure. The vacuum-cavity MEMS resonators have cantilever beams, bridge beams or breathing-bar beams.

    摘要翻译： 具有真空腔的微机电（MEMS）谐振器是使用多晶硅启用释放方法制造的。 围绕MEMS光束的真空腔通过去除围绕光束的释放材料并通过在结构上沉积氮化层而在真空下密封所得空腔来形成。 真空腔MEMS谐振器具有悬臂梁，桥梁或呼吸杆梁。

    MEMS device integrated chip package, and method of making same
    7.
    发明授权
    MEMS device integrated chip package, and method of making same 有权
    MEMS器件集成芯片封装及其制造方法

    公开(公告)号：US07291561B2

    公开(公告)日：2007-11-06

    申请号：US10623965

    申请日：2003-07-21

    申请人： Qing Ma ,  Peng Cheng ,  Valluri Rao

    发明人： Qing Ma ,  Peng Cheng ,  Valluri Rao

    IPC分类号： H01L21/461 ,  H01L21/311 ,  H01L29/00 ,  H01L27/108

    CPC分类号： B81C1/00333 ,  H01G5/16 ,  H01G5/40 ,  H01L2224/48091 ,  Y10T428/24248 ,  H01L2924/00014

    摘要： The present invention relates to a chip package that includes a semiconductor device and at least one micro electromechanical structure (MEMS) such that the semiconductor device and the MEMS form an integrated package. One embodiment of the present invention includes a semiconductor device, a first MEMS device disposed in a conveyance such as a film, and a second MEMS device disposed upon the semiconductor device through a via in the conveyance.The present invention also relates to a process of forming a chip package that includes providing a conveyance such as a tape automated bonding (TAB) structure, that may hold at least one MEMS device. The method is further carried out by disposing the conveyance over the active surface of the device in a manner that causes the at least one MEMS to communicate electrically to the active surface. Where appropriate, a sealing structure such as a solder ring may be used to protect the MEMS.

    摘要翻译： 本发明涉及包括半导体器件和至少一个微机电结构（MEMS）的芯片封装，使得半导体器件和MEMS形成集成封装。 本发明的一个实施例包括半导体器件，设置在诸如膜的输送器中的第一MEMS器件，以及通过输送中的通孔设置在半导体器件上的第二MEMS器件。 本发明还涉及一种形成芯片封装的方法，其包括提供诸如胶带自动键合（TAB）结构的输送，其可以保持至少一个MEMS器件。 该方法进一步通过以使得至少一个MEMS与活性表面电连通的方式布置在器件的有效表面上的输送来进行。 在适当的情况下，可以使用诸如焊环的密封结构来保护MEMS。

    MEMS device integrated chip package, and method of making same
    10.
    发明授权
    MEMS device integrated chip package, and method of making same 有权
    MEMS器件集成芯片封装及其制造方法

    公开(公告)号：US06621137B1

    公开(公告)日：2003-09-16

    申请号：US09687907

    申请日：2000-10-12

    申请人： Qing Ma ,  Peng Cheng ,  Valluri Rao

    发明人： Qing Ma ,  Peng Cheng ,  Valluri Rao

    IPC分类号： H01L2900

    CPC分类号： B81C1/00333 ,  H01G5/16 ,  H01G5/40 ,  H01L2224/48091 ,  Y10T428/24248 ,  H01L2924/00014

    摘要： The present invention relates to a chip package that includes a semiconductor device and at least one micro electromechanical structure (MEMS) such that the semiconductor device and the MEMS form an integrated package. One embodiment of the present invention includes a semiconductor device, a first MEMS device disposed in a conveyance such as a film, and a second MEMS device disposed upon the semiconductor device through a via in the conveyance. The present invention also relates to a process of forming a chip package that includes providing a conveyance such as a tape automated bonding (TAB) structure that may bold at least one MEMS device. The method is further carried out by disposing the conveyance over the active surface of the device in a manner that causes the at least one MEMS to communicate electrically to the active surface. Where appropriate, a sealing structure such as a solder ring may be used to protect the MEMS.

    摘要翻译： 本发明涉及包括半导体器件和至少一个微机电结构（MEMS）的芯片封装，使得半导体器件和MEMS形成集成封装。 本发明的一个实施例包括半导体器件，设置在诸如膜的输送器中的第一MEMS器件，以及通过输送中的通孔设置在半导体器件上的第二MEMS器件。 本发明还涉及一种形成芯片封装的方法，其包括提供输送，例如可以使至少一个MEMS器件粗化的带自动键合（TAB）结构。 该方法进一步通过以使得至少一个MEMS与活性表面电连通的方式布置在器件的有效表面上的输送来进行。 在适当的情况下，可以使用诸如焊环的密封结构来保护MEMS。