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1.发明授权
公开(公告)号：US4703289A
公开(公告)日：1987-10-27
申请号：US809984
申请日：1985-12-17
CPC分类号： H01P1/387 , Y10T29/49016 , Y10T29/49126
摘要： A distributed resonator stripline circulator is disclosed wherein a geometrically shaped resonator pattern is deposited upon a like geometrically shaped ferrite substrate. A ground plane is deposited upon the opposing side of the substrate which includes grounding wrap-arounds that extend partially onto the resonator face of the substrate. Two such resonators are assembled, resonator patterns facing, to form a stripline circulator. The grounding wrap-arounds provide electrical connection from the top ground plane to the bottom ground plane to provide superior isolation and control of circulator loading factors.
摘要翻译： 公开了一种分布式谐振器带状线环行器，其中几何形状的谐振器图案沉积在类似几何形状的铁氧体衬底上。 接地平面沉积在基板的相对侧上，其包括部分延伸到基板的谐振器面上的接地环绕。 两个这样的谐振器被组装，谐振器图案面向，以形成带状线循环器。 接地环绕提供从顶部接地平面到底部接地平面的电气连接，以提供卓越的隔离和循环器负载系数的控制。
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公开(公告)号：US5136122A
公开(公告)日：1992-08-04
申请号：US699019
申请日：1991-05-13
CPC分类号： H01R13/03 , H01R12/52 , H05K3/3405 , H01L2224/4847 , H01L2924/01039 , H01L2924/3025 , H05K1/148 , H05K2201/0281 , H05K2201/1034 , H05K3/3421 , H05K3/36 , Y10T29/49149 , Y10T29/49224
摘要： An improved omega connector for electrically coupling components of a multicomponent electronic assembly comprises first and second flat end sections each formed of nonporous copper plate adapted for solder bonding to components, and an intermediate loop section formed of interwoven copper fibers extending between the end sections to provide a continous electrically conductive network therebetween. The fibers in the loop section carry a solder nonwettable coating to avoid interference with bonding operations to attach the end section to the components. Preferably, the loop section is composed of nickel-clad copper fibers. The fibrous loop section exhibits enhanced flexibility to reduce stresses attributed to shifting of the components during operation and thereby extend the useful life of the assembly.
摘要翻译： 用于电耦合多组分电子组件的组件的改进的Ω连接器包括第一和第二平端部，每个平端部由适合于焊接到部件的无孔铜板形成，以及由交织的铜纤维形成的中间环部分，其在端部之间延伸以提供 其间连续的导电网络。 环路部分中的纤维携带焊料不可润湿的涂层，以避免对粘接操作的干扰，以将端部部分附着到部件上。 优选地，环部由镍包铜铜纤维构成。 纤维环部分显示出增强的柔性，以减少在操作过程中归因于部件移动的应力，从而延长组件的使用寿命。
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公开(公告)号：US5742007A
公开(公告)日：1998-04-21
申请号：US695813
申请日：1996-08-05
CPC分类号： H01L21/6835 , H05K5/0091 , H05K5/0095
摘要： An electronic device package (10) is resistant to rupture at high temperatures. The electronic device package (10) includes a cap (14) having side-walls (18) coupled to a support structure (11) via an adhesive (15). The cap (14) is permeable to gases including water vapor. The side-walls (18) of the cap (14) are made of a porous ceramic material which absorbs a portion of the adhesive (15) via capillary action while curing the adhesive (15).
摘要翻译： 电子器件封装（10）耐高温破裂。 电子器件封装（10）包括具有经由粘合剂（15）联接到支撑结构（11）的侧壁（18）的盖（14）。 盖（14）可渗透包括水蒸气的气体。 盖（14）的侧壁（18）由多孔陶瓷材料制成，其在固化粘合剂（15）的同时通过毛细管作用吸收一部分粘合剂（15）。
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公开(公告)号：US5523260A
公开(公告)日：1996-06-04
申请号：US435555
申请日：1995-05-05
申请人： Carl Missele
发明人： Carl Missele
IPC分类号： H01L23/367 , H01L23/373 , H01L21/60
CPC分类号： H01L23/367 , H01L23/373 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/12044
摘要： A controlled collapse chip connection device can be heat sinked in the following manner. A carbon composition heat sink (102) having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the controlled collapse connection chip device (101) is positioned in a proximate location to a fabricated thermal mating area (104) of the controlled collapse chip connection device (101). The carbon composition heat sink (102) is then thermally bonded to the thermal mating area (104) of the controlled collapse connection chip device (101).
摘要翻译： 控制的崩溃芯片连接装置可以以下列方式散热。 具有基本上等于受控塌缩连接芯片装置（101）的热膨胀系数的热膨胀系数的碳组合物散热器（102）位于受控塌陷芯片的制造的热配合区域（104）的邻近位置 连接装置（101）。 然后将碳组合物散热器（102）热粘合到受控塌缩连接芯片装置（101）的热配合区域（104）。
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公开(公告)号：US5327013A
公开(公告)日：1994-07-05
申请号：US91937
申请日：1993-07-15
申请人： Kevin D. Moore , Carl Missele
发明人： Kevin D. Moore , Carl Missele
IPC分类号： B05D7/00 , C23C26/00 , H01L21/60 , H01L23/485 , H05K3/34 , H01L23/48 , H01L29/40 , H01L29/44 , H01L29/52
CPC分类号： H01L24/16 , H01L24/11 , H01L24/13 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , Y10T29/49144 , Y10T29/49149
摘要： A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.
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公开(公告)号：US5281684A
公开(公告)日：1994-01-25
申请号：US876147
申请日：1992-04-30
申请人： Kevin D. Moore , Carl Missele
发明人： Kevin D. Moore , Carl Missele
IPC分类号： B05D7/00 , C23C26/00 , H01L21/60 , H01L23/485 , H05K3/34
CPC分类号： H01L24/16 , H01L24/11 , H01L24/13 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , Y10T29/49144 , Y10T29/49149
摘要： A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.
摘要翻译： 用于在集成电路管芯上形成焊料凸点的方法利用由铜颗粒和聚合物粘合剂构成的导电性，可焊接润湿的复合材料形成的端子（12）。 端子包括覆盖在模具上的钝化层（20）的接合焊盘（24）和将接合焊盘连接到金属接触件（16）的流道部分（26）。 端子通过丝网印刷例如作为油墨施加到模具，之后，焊接体的一部分与接合焊盘接触而形成凸块。 端子的优选材料由镀银铜颗粒和甲阶型酚醛粘合剂组成。
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公开(公告)号：US5088007A
公开(公告)日：1992-02-11
申请号：US680472
申请日：1991-04-04
申请人： Carl Missele
发明人： Carl Missele
CPC分类号： H05K3/3442 , B23K35/0222 , H05K3/3436 , H05K3/4015 , H05K2201/0281 , H05K2201/029 , H05K2201/10636 , H05K2203/0415 , H05K2203/0455 , Y02P70/611 , Y02P70/613 , Y10T428/12486
摘要： An improved interconnection for mounting an electrical component to a substrate, such as a printed circuit board or the like, comprises an interwoven copper film mat embedded within a solder alloy matrix. The solder alloy is bonded to the component and to the substrate and extends continuously therebetween to provide a strong mechanical joint. The copper mat enhances electrical and thermal conductivity through the interconnection and improves compliant to relieve stresses of the type generated by differential thermal expansion of the component and the substrate during use.
摘要翻译： 用于将电气部件安装到基板（例如印刷电路板等）上的改进的互连包括嵌入在焊料合金基体内的交织铜膜垫。 焊料合金结合到部件和基板上并连续延伸，以提供强大的机械接头。 铜垫通过互连提高了导电性和导热性，并且改善了顺应性以减轻在使用期间由部件和基板的不同热膨胀产生的类型的应力。
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公开(公告)号：US5248848A
公开(公告)日：1993-09-28
申请号：US355572
申请日：1989-05-22
申请人： Robert R. Kornowski , Carl Missele
发明人： Robert R. Kornowski , Carl Missele
CPC分类号： H01L23/564 , H01L23/10 , H05K5/0095 , H01L2924/0002 , Y10S220/27
摘要： An electronic device package includes a portion that functions as a membrane to allow small molecules, such as gas molecules, to relatively freely traverse the housing boundary, while simultaneously substantially preventing large molecules, such as liquid molecules, from entering the confines of the housing. As a result, the package can be readily used in reflow processing without risking damage to the boundary integrity between the housing and the support surface that supports both the electronic device and the housing.
摘要翻译： 电子器件封装包括用作膜的部分，以允许诸如气体分子的小分子相对自由地穿过壳体边界，同时基本上防止诸如液体分子的大分子进入壳体的界限。 结果，该封装件可以容易地用于回流处理中，而不会损害外壳与支撑电子设备和外壳之间的支撑表面之间的边界完整性。
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公开(公告)号：US5015972A
公开(公告)日：1991-05-14
申请号：US395240
申请日：1989-08-17
IPC分类号： H03H7/38
CPC分类号： H03H7/38
摘要： A broadband RF transformer design is described that facilitates the construction of a broadband impedance transformer in a compact, planar format, while retaining ease of assembly and manufacture. Broadband operation is achieved through the use of a slotted low-impedance winding structure, common-manufacture ferrite elements, and the optional placement of reactive elements between winding turns. By virtue of construction, thermal performance is enhanced, allowing operation at power levels not previously possible. The invention accommodates functional tuning via laser or abrading techniques. Also, the winding configuration eliminates the need to access the center of a spiral for the purposes of establishing a ground connection.
摘要翻译： 描述了宽带RF变压器设计，其便于以紧凑的平面格式构造宽带阻抗变压器，同时保持组装和制造的容易性。 通过使用开槽的低阻抗绕组结构，共同制造的铁素体元件以及在绕组匝之间可选地布置无功元件来实现宽带操作。 凭借结构，热性能得到提高，允许以前的功率水平运行。 本发明通过激光或研磨技术适应功能调谐。 此外，为了建立接地连接的目的，绕组配置消除了进入螺旋中心的需要。
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