摘要:
An interlocking panel, and structures formed therefrom, are described herein. Embodiments of the present invention provide a panel including a protruding end including a receiving member for engaging a complementary engaging member of a first adjacent panel, and a receiving end including two flanges, at least one of the two flanges including an engaging member for engaging a complementary receiving member of a second adjacent panel, one or both of the two flanges configured to flex to allow the complementary receiving member of the second adjacent panel to engage the engaging member.
摘要:
A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion which extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member which substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface. Assemblies that include the support structure and a semiconductor substrate are also within the scope of the present invention, as are methods for forming the support structures and thinning and post-thinning processes that include use of the support structures.
摘要:
Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
摘要:
A method and software for managing pointers to external objects in a run-time environment are described in which eager external references are provided that allow session memory objects to point directly to certain call memory objects with machine pointers. The eager external references contain enough information to recreate the call memory objects in call memory at the beginning of the call and fix the session memory objects to point to the new locations of the recreated call memory objects.
摘要:
Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
摘要:
Microelectronic devices, microfeature workpieces, and methods of forming and stacking the microelectronic devices and the microfeature workpieces. In one embodiment, a microfeature workpiece includes a plurality of first microelectronic dies. The individual first dies have an integrated circuit, a plurality of pads electrically coupled to the integrated circuit, and a plurality of first conductive mating structures at least proximate to corresponding pads. The first conductive mating structures project away from the first dies and are configured to interconnect with corresponding complementary second conductive mating structures on second dies which are to be mounted to corresponding first dies.
摘要:
Methods of memory management in a run-time environment are described. A mechanism is provided for registering a routine to deinitialize or deallocate a large object at the end of a call (e.g. by setting it to null to unreference the object), which prevents the large object from being migrated into session memory, e.g. when live objects are migrated at the end of the call. This routine is called after the finalization of garbage collected objects that may use the large object. In a subsequent call, the large object is checked before use to determine if the object is deinitialized and re-initialized if the large object was deinitialized.
摘要:
Objects that are managed within a run-time environment are stored on N-bit aligned addresses. Due to the alignment restriction, the N least significant bits of a reference to an object are available for storing information about the storage properties of the object. This information is extractable by fast register operations. The storage properties can include the lifetime, format, and contiguity of the object, or a combination of these properties. If the run-time environment implements a generational garbage collector, the reference tags are used to encode whether or not the object is recently allocated.
摘要:
A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion that extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member that substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface.
摘要:
A programmed material consolidation apparatus includes at least one fabrication site and a material consolidation system associated with the at least one fabrication site. The at least one fabrication site may be configured to receive one or more fabrication substrates, such as semiconductor substrates. A machine vision system with a translatable or locationally fixed camera may be associated with the at least one fabrication site and the material consolidation system. A cleaning component may also be associated with the at least one fabrication site. The cleaning component may share one or more elements with the at least one fabrication site, or may be separate therefrom. The programmed material consolidation apparatus may also include a substrate handling system, which places fabrication substrates at appropriate locations of the programmed material consolidation apparatus.