Methods for making wafers with low-defect surfaces, wafers obtained thereby and electronic components made from the wafers
    2.
    发明授权
    Methods for making wafers with low-defect surfaces, wafers obtained thereby and electronic components made from the wafers 失效
    制造具有低缺陷表面的晶片的方法,由此获得的晶片和由晶片制成的电子部件

    公开(公告)号:US07367865B2

    公开(公告)日:2008-05-06

    申请号:US11069118

    申请日:2005-03-01

    IPC分类号: H01L21/70

    CPC分类号: B24B37/30 B24B37/042

    摘要: The electronic semiconductor component has a crystalline wafer substrate with an active surface and a semiconductor layer coating the active surface. So that the semiconductor layer has a few surface defects the crystalline wafer substrate is a sapphire or silicon carbide single crystal and the active surface has a pit density of less than 500 pit/cm2, preferably less than 100 pit/cm2. The polishing method for obtaining the active surface with these pit densities includes polishing with a polishing agent, such as a silicon suspension, and a polishing tool, which is pressed on the active surface with a pressure of preferably from 0.05 to 0.2 kg/cm2 and moved over the active surface with polishing motions distributed statistically and uniformly over a 360° angle during polishing.

    摘要翻译: 电子半导体部件具有具有有源面的晶片基板和涂覆有源面的半导体层。 为了使半导体层具有几个表面缺陷,晶片衬底是蓝宝石或碳化硅单晶,并且活性表面的凹坑密度小于500凹坑/ cm 2,优选小于100 凹坑/ cm 2。 用于获得具有这些凹坑密度的活性表面的抛光方法包括用抛光剂如硅悬浮液和抛光工具进行抛光,抛光工具以优选0.05-0.2kg / cm 2的压力压在活性表面上, SUP> 2并且在抛光期间在360°角度上统计均匀地分布抛光运动而在有源表面上移动。

    Method for determining the temperature of an electrical component with the aid of a temperature model
    4.
    发明授权
    Method for determining the temperature of an electrical component with the aid of a temperature model 有权
    借助温度模型确定电气部件的温度的方法

    公开(公告)号:US07865327B2

    公开(公告)日:2011-01-04

    申请号:US12286709

    申请日:2008-09-30

    IPC分类号: G01K7/16

    CPC分类号: G01K7/42 G01K7/16 G01K13/00

    摘要: A method for determining the temperature or the ohmic resistance of an electrical component, especially of a coil of a magnetic valve. The component temperature is estimated with the aid of a temperature model, which is able to determine the curve of the component temperature even during a control of the valve. The temperature model is corrected regularly based on the measured value, in this context.

    摘要翻译: 一种用于确定电气部件,特别是电磁阀的线圈的温度或欧姆电阻的方法。 借助于温度模型来估算组件温度,即使在控制阀时也能够确定组件温度的曲线。 在这种情况下,基于测量值定期校正温度模型。

    Edge deletion of thin-layer solar modules by etching
    9.
    发明授权
    Edge deletion of thin-layer solar modules by etching 失效
    通过蚀刻边缘删除薄层太阳能电池组件

    公开(公告)号:US08497215B2

    公开(公告)日:2013-07-30

    申请号:US13061274

    申请日:2009-08-05

    摘要: The present invention relates to a method for the wet-chemical edge deletion of solar cells. An etching paste is applied to the edge of a solar cell substrate surface and after the reaction is complete, the paste residue is removed. Optionally, the substrate surface is cleaned and dried. The etching paste comprises 85% H3PO4, NH4HF2 and 65% HNO3 in a ratio in the range from 7:1:1.5 to 10:1:3.5, based on the weight.

    摘要翻译: 本发明涉及太阳能电池湿化学边缘缺失的方法。 将蚀刻膏施加到太阳能电池基板表面的边缘,反应完成后,除去糊状残留物。 任选地,清洁和干燥基底表面。 基于重量,蚀刻浆料包含85%H 3 PO 4,NH 4 HF 2和65%HNO 3,其比例为7:1:1.5至10:1:3.5。