CURABLE ADHESIVE COMPOSITION
    1.
    发明申请
    CURABLE ADHESIVE COMPOSITION 审中-公开
    可固化粘合剂组合物

    公开(公告)号:US20130255879A1

    公开(公告)日:2013-10-03

    申请号:US13993201

    申请日:2011-12-05

    IPC分类号: C09J163/00

    摘要: The present invention relates to a curable adhesive composition comprising a first part and a second part, the curable adhesive composition comprising: in the first part at least one epoxy resin and in the second part at least one curing agent in the form of an epoxy-amine and/or epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group.

    摘要翻译: 本发明涉及包含第一部分和第二部分的可固化粘合剂组合物,该可固化粘合剂组合物包括:在第一部分中至少一种环氧树脂,在第二部分中至少一种环氧树脂形式的固化剂, 胺和/或环氧 - 硫醇加成物,其通过使至少一种伯胺,仲胺和/或硫醇与至少一种包含至少一个末端环氧基的多元醇化合物反应而获得。

    Method for preparing a pressure-sensitive adhesive
    3.
    发明授权
    Method for preparing a pressure-sensitive adhesive 有权
    压敏粘合剂的制备方法

    公开(公告)号:US07691437B2

    公开(公告)日:2010-04-06

    申请号:US10698201

    申请日:2003-10-31

    CPC分类号: C09J4/00 C08F220/00

    摘要: The present invention relates to a method of preparing a pressure-sensitive adhesive comprising the steps of: (i) providing an essentially solvent-free mixture comprising one or more free radically polymerizable monomers having one ethylenically unsaturated group and at least one free-radical polymerization initiator, (ii) partially polymerizing said mixture to provide a partially polymerized mixture exhibiting a Brookfield viscosity of between 1,000 and 125,000 mPa·s at 20° C. and a degree of conversion of monomers to polymer of between 30-60 wt. % with respect to the initial mass of the monomers prior to polymerization, (iii) adding one or more free-radical radiation polymerization initiators to the partially polymerized mixture to provide a radiation-curable precursor, (iv) applying the radiation-curable precursor to a substrate, and (v) further polymerizing the radiation-curable precursor by subjecting it to actinic irradiation to provide said pressure-sensitive adhesive.

    摘要翻译: 本发明涉及一种制备压敏粘合剂的方法,包括以下步骤:(i)提供基本上无溶剂的混合物,其包含一种或多种具有一个烯键式不饱和基团的自由基可自由基单体和至少一种自由基聚合 引发剂,(ii)部分聚合所述混合物以提供部分聚合的混合物,其在20℃下的布氏粘度为1,000至125,000mPa·s,单体向聚合物的转化度为30-60wt。 (iii)将一种或多种自由基辐射聚合引发剂加入到部分聚合的混合物中以提供可辐射固化的前体,(iv)将可辐射固化的前体施加到 基材,和(v)通过使其辐射固化的前体进行光化辐射以提供所述压敏粘合剂来进一步聚合可辐射固化的前体。

    Crosslinking process
    5.
    发明授权
    Crosslinking process 失效
    交联过程

    公开(公告)号:US06340719B1

    公开(公告)日:2002-01-22

    申请号:US09474532

    申请日:1999-12-29

    IPC分类号: C08F246

    摘要: A process for crosslinking a melt-processed polymer composition comprises the steps of (a) forming a polymerizable mixture comprising (i) at least one monoethylenically-unsaturated monomer or prepolymer and (ii) at least one monoethylenically-unsaturated, blocked mono- or polyisocyanate that is thermally stable at a selected melt processing temperature range and that is thermally deblockable at and above a deblocking temperature that is higher than the selected melt processing temperature range; (b) exposing the polymerizable mixture to transmissive energy to polymerize the mixture to form a polymer composition comprising polymerized units derived from the blocked mono- or polyisocyanate; (c) melt processing the polymer composition at the selected melt processing temperature range to form a melt-processed polymer composition; and (d) during melt processing or thereafter, increasing the temperature of the melt-processed polymer composition to the deblocking temperatures in the presence of at least one isocyanate-reactive crosslinking agent, to effect crosslinking of the melt-processed polymer composition.

    摘要翻译: 用于交联熔融加工的聚合物组合物的方法包括以下步骤:(a)形成可聚合混合物,其包含(i)至少一种单烯属不饱和单体或预聚物和(ii)至少一种单烯属不饱和的封端单或多异氰酸酯 其在选定的熔融加工温度范围内是热稳定的,并且在高于所选择的熔融加工温度范围的解封装置温度以上时可热解封; (b)将可聚合混合物暴露于透射能量以聚合该混合物以形成聚合物组合物,其包含衍生自封端单或多异氰酸酯的聚合单元; (c)在选定的熔融加工温度范围内熔融加工聚合物组合物以形成熔融加工的聚合物组合物; 和(d)在熔融加工过程中或之后,在至少一种异氰酸酯反应性交联剂的存在下将熔融加工的聚合物组合物的温度提高到解封温度,以实现熔融加工聚合物组合物的交联。

    Free-radically radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive
    6.
    发明授权
    Free-radically radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive 有权
    可自由基辐射固化,无溶剂和可印刷的压敏粘合剂前体

    公开(公告)号:US07268173B2

    公开(公告)日:2007-09-11

    申请号:US10513125

    申请日:2003-05-01

    IPC分类号: C08F2/46 B32B7/12

    摘要: The present invention relates to a free-radically radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive, the precursor comprising: (i) 30-75 wt. % of one or more mono(meth)acrylate functional oligomer compounds at least one of said oligomer compounds comprising at least one urethane bond, (ii) 0-15 wt % of one or more poly(meth)acrylate functional oligomer compounds, (iii) 5-45 wt. % of one or more monomer compounds comprising one ethylenically unsaturated group, (iv) 0-5 wt. % of one or more monomer compounds comprising two or more ethylenically unsaturated groups, and (v) an effective amount of one or more free radical photoinitiators, wherein the percentages which are percentages by weight with respect to the mass of the precursor, are selected so that the precursor has a dynamic viscosity at 20° C. and at a shear rate of 100 s−1 of between 300 to 15,000 mPa·s.

    摘要翻译: 本发明涉及一种可自由基辐射固化的无溶剂和可印刷的压敏粘合剂前体,前体包括:(i)30-75wt。 %的一种或多种单(甲基)丙烯酸酯官能低聚物化合物,至少一种包含至少一个氨基甲酸酯键的所述低聚物化合物,(ii)0-15重量%的一种或多种聚(甲基)丙烯酸酯官能低聚物化合物,(iii )5-45重量% %的一种或多种单体化合物包含一个烯属不饱和基团,(iv)0-5wt。 %的一种或多种包含两个或更多个烯键式不饱和基团的单体化合物,和(v)有效量的一种或多种自由基光引发剂,其中相对于前体质量的重量百分比被选择为 该前体在20℃下的剪切速率为300至15,000mPa·s的剪切速率下具有动态粘度。