摘要:
A heat-curable adhesive composition comprising an epoxy-resin, a toughening agent, a curing agent and an acetoacetoxy-functionalized compound wherein the composition can be cured to form structural adhesives of high impact strength.
摘要:
The invention provides an assembly comprising at least one substrate being bonded to a structural adhesive wherein the structural adhesive is obtained by curing a precursor comprising a cross-linkable polymer, wherein a surface area of the substrate bonded to the structural adhesive comprises at least one metal, said surface area being treated with a liquid activator.
摘要:
The invention provides an assembly comprising at least one substrate being bonded to a structural adhesive wherein the structural adhesive is obtained by curing a precursor comprising a cross-linkable polymer, wherein a surface area of the substrate bonded to the structural adhesive comprises at least one metal, said surface area being treated with a liquid activator.
摘要:
The present invention relates to a method of preparing a pressure-sensitive adhesive comprising the steps of: (i) providing an essentially solvent-free mixture comprising one or more free radically polymerizable monomers having one ethylenically unsaturated group and at least one free-radical polymerization initiator, (ii) partially polymerizing said mixture to provide a partially polymerized mixture exhibiting a Brookfield viscosity of between 1,000 and 125,000 mPa·s at 20° C. and a degree of conversion of monomers to polymer of between 30-60 wt. % with respect to the initial mass of the monomers prior to polymerization, (iii) adding one or more free-radical radiation polymerization initiators to the partially polymerized mixture to provide a radiation-curable precursor, (iv) applying the radiation-curable precursor to a substrate, and (v) further polymerizing the radiation-curable precursor by subjecting it to actinic irradiation to provide said pressure-sensitive adhesive.
摘要:
A process for crosslinking a melt-processed polymer composition comprises the steps of (a) forming a polymerizable mixture comprising (i) at least one monoethylenically-unsaturated monomer or prepolymer and (ii) at least one monoethylenically-unsaturated, blocked mono- or polyisocyanate that is thermally stable at a selected melt processing temperature range and that is thermally deblockable at and above a deblocking temperature that is higher than the selected melt processing temperature range; (b) exposing the polymerizable mixture to transmissive energy to polymerize the mixture to form a polymer composition comprising polymerized units derived from the blocked mono- or polyisocyanate; (c) melt processing the polymer composition at the selected melt processing temperature range to form a melt-processed polymer composition; and (d) during melt processing or thereafter, increasing the temperature of the melt-processed polymer composition to the deblocking temperatures in the presence of at least one isocyanate-reactive crosslinking agent, to effect crosslinking of the melt-processed polymer composition.
摘要:
The present invention relates to a free-radically radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive, the precursor comprising: (i) 30-75 wt. % of one or more mono(meth)acrylate functional oligomer compounds at least one of said oligomer compounds comprising at least one urethane bond, (ii) 0-15 wt % of one or more poly(meth)acrylate functional oligomer compounds, (iii) 5-45 wt. % of one or more monomer compounds comprising one ethylenically unsaturated group, (iv) 0-5 wt. % of one or more monomer compounds comprising two or more ethylenically unsaturated groups, and (v) an effective amount of one or more free radical photoinitiators, wherein the percentages which are percentages by weight with respect to the mass of the precursor, are selected so that the precursor has a dynamic viscosity at 20° C. and at a shear rate of 100 s−1 of between 300 to 15,000 mPa·s.
摘要:
The present invention relates to a curable adhesive composition comprising a first part and a second part, the curable adhesive composition comprising: in the first part at least one epoxy resin and in the second part at least one curing agent in the form of an epoxy-amine and/or epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group.