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    Silicone composition and electrically conductive silicone adhesive formed therefrom
    5.
    发明授权
    Silicone composition and electrically conductive silicone adhesive formed therefrom 失效
    有机硅组合物和由其形成的导电硅氧烷粘合剂

    公开(公告)号：US06534581B1

    公开(公告)日：2003-03-18

    申请号：US09620397

    申请日：2000-07-20

    申请人： Don Lee Kleyer ,  Michael Andrew Lutz

    发明人： Don Lee Kleyer ,  Michael Andrew Lutz

    IPC分类号： C08K505

    CPC分类号： H01B1/22 ,  C08K5/04 ,  C08K5/05 ,  C08K5/053 ,  C08K5/098 ,  C08K5/54 ,  C08K9/02 ,  C08L2666/28 ,  C08L2666/44 ,  C08L2666/54 ,  C09J183/04 ,  C08L83/04

    摘要： A silicone composition for preparing a silicone adhesive, the composition prepared by mixing (A) an organopolysiloxane containing an average of at least two silicon-bonded hydroxy groups per molecule; (B) a crosslinking agent in an amount sufficient to cure the composition; wherein the agent is selected from (i) at least one silane having the formula R2nSiX4−n wherein each R2 is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups having from 1 to about 8 carbon atoms, n is 0 or 1, and X is —OR2 or —OCH2CH2OR2; (ii) a partial hydrolyzate of (i), and (iii) mixtures comprising (i) and (ii); (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from the group consisting of silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition; and (E) a catalytic amount of a condensation catalyst comprising a metal salt of a carboxylic acid. A silicone adhesive and a multi-part curable silicone composition.

    摘要翻译： 一种用于制备硅氧烷粘合剂的硅氧烷组合物，所述组合物通过混合（A）每分子平均含有至少两个硅键合的羟基的有机聚硅氧烷制备; （B）足以固化组合物的量的交联剂; 其中所述试剂选自（i）至少一种具有式R 2 n SiX 4-n的硅烷，其中每个R 2独立地选自具有1至约8个碳原子的一价烃和一价卤代烃基，n为0或1，X 是-OR2或-OCH2CH2OR2; （ii）（i）的部分水解产物和（iii）包含（i）和（ii）的混合物; （C）足以赋予硅氧烷粘合剂导电性的导电填料，其中填料包括至少具有选自银，金，铂，钯和合金的金属外表面的颗粒 的; （D）有效量的分子量高达约1000且每分子含有至少一个羟基的羟基官能有机化合物，条件是该化合物基本上不能抑制组合物的固化; 和（E）催化量的包含羧酸金属盐的缩合催化剂。 硅氧烷粘合剂和多部分可固化的硅氧烷组合物。

    Silicone composition and cured silicone product
    8.
    发明授权
    Silicone composition and cured silicone product 失效
    有机硅组合物和固化硅胶产品

    公开(公告)号：US06482888B1

    公开(公告)日：2002-11-19

    申请号：US09874025

    申请日：2001-06-06

    申请人： Dongchan Ahn ,  Michael Andrew Lutz

    发明人： Dongchan Ahn ,  Michael Andrew Lutz

    IPC分类号： C08L8305

    CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08L83/00

    摘要： A silicone composition prepared by mixing (A) 100 parts by weight of an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, (C) 0.5 to 50 parts by weight of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group and at least one aliphatic carbon-carbon multiple bond per molecule, (D) 1 to 10 parts by weight of a titanium chelate, and (E) a catalytic amount of a hydrosilylation catalyst; and a cured product formed from the composition.

    摘要翻译： 通过混合（A）100重量份每分子平均含有至少两个与硅键合的烯基的有机聚硅氧烷（A），每分子含有平均至少两个硅键合的氢原子的有机氢聚硅氧烷制备的有机硅组合物 （C）0.5至50重量份的分子量高达约1000且含有至少一个羟基和至少一个脂族碳 - 碳多重键的羟基官能有机化合物 （D）1〜10重量份的钛螯合物，（E）催化量的氢化硅烷化催化剂; 和由该组合物形成的固化物。

    Silicone composition and silicone pressure sensitive adhesive formed therefrom
    9.
    发明授权
    Silicone composition and silicone pressure sensitive adhesive formed therefrom 有权
    硅胶组合物和由其形成的硅氧烷压敏粘合剂

    公开(公告)号：US6121368A

    公开(公告)日：2000-09-19

    申请号：US391874

    申请日：1999-09-07

    申请人： Michael David Heying ,  Michael Andrew Lutz ,  Patricia Kathryn Moline ,  Michael John Watson

    发明人： Michael David Heying ,  Michael Andrew Lutz ,  Patricia Kathryn Moline ,  Michael John Watson

    IPC分类号： C09J183/07 ,  C08L83/04 ,  C09J105/00 ,  C09J129/04 ,  C09J171/00 ,  C09J183/04 ,  C09J183/05 ,  C09J183/08 ,  C08K5/01 ,  C08K3/36

    CPC分类号： C08L83/04 ,  C09J183/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/16 ,  C08G77/20 ,  C08G77/24 ,  C08G77/42 ,  C08G77/46

    摘要： A silicone composition for preparing a silicone pressure sensitive adhesive, the composition comprising (A) 20 to 55 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 45 to 80 parts by weight of an organopolysiloxane resin comprising R.sup.3.sub.3 SiO.sub.1/2 units and SiO.sub.4/2 units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups, the mole ratio of R.sup.3.sub.3 SiO.sub.1/2 units to SiO.sub.4/2 units is from 0.6:1 to 1.5:1, the resin contains less than about 2 mole percent of alkenyl groups, and the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) a thixotropic agent in an amount sufficient to impart thixotropy to the composition; and (E) a catalytic amount of a hydrosilylation catalyst; wherein the sum of the average number of silicon-bonded alkenyl groups per molecule in component (A) and the average number of silicon-bonded hydrogen atoms per molecule in component (C) is greater than 4. A silicone pressure sensitive adhesive comprising a reaction product of the silicone composition. A multi-part silicone composition comprising components (A) through (E) in two or more parts, provided neither component (A) nor component (B), when components (B) contains alkenyl groups, are present with components (C) and (E) in the same part.

    摘要翻译： 一种用于制备硅氧烷压敏粘合剂的硅氧烷组合物，该组合物包含（A）每分子含有平均至少两个硅键合链烯基的聚二有机硅氧烷20至55重量份; （B）45〜80重量份包含R 33 SiO 1/2单元和SiO 4/2单元的有机聚硅氧烷树脂，其中每个R 3独立地选自一价烃和一价卤代烃基，R 33 SiO 1/2单元的摩尔比 至SiO 4/2单元的比例为0.6:1至1.5:1，树脂含有小于约2摩尔％的烯基，组分（A）和（B）的总量为100重量份; （C）每分子平均具有至少两个与硅键合的氢原子的有机氢聚硅氧烷，其量足以固化该组合物; （D）触变剂，其量足以赋予组合物触变性; 和（E）催化量的氢化硅烷化催化剂; 其中组分（A）中每分子的硅键合链烯基的平均数和组分（C）中每分子的与硅键合的氢原子的平均数之和大于4.一种包含反应的硅氧烷压敏粘合剂 硅酮组合物的产品。 当组分（B）含有烯基时，包含组分（A）至（E）的两部分或多份的多部分有机硅组合物既不含组分（A）也不包含组分（B）），其组分（C）和 （E）同一部分。

    Silicone composition and electrically conductive, cured silicone product
    10.
    发明授权
    Silicone composition and electrically conductive, cured silicone product 失效
    有机硅组合物和导电固化的硅氧烷产品

    公开(公告)号：US06831145B2

    公开(公告)日：2004-12-14

    申请号：US10226396

    申请日：2002-08-23

    申请人： Don Lee Kleyer ,  Michael Andrew Lutz

    发明人： Don Lee Kleyer ,  Michael Andrew Lutz

    IPC分类号： C08G7708

    CPC分类号： C08L83/06 ,  C09D183/06 ,  C08L2666/34 ,  C08L2666/54

    摘要： A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecule; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.

    摘要翻译： 一种用于制备固化的硅氧烷产品的硅氧烷组合物，该组合物通过混合：（A）每分子平均含有至少两个环氧官能的有机基团的有机聚硅氧烷; （B）固化剂的量足以固化组合物，只要固化剂不含酚羟基; （C）足以赋予硅氧烷产品导电性的导电填料，其中填料包括至少具有选自银，金，铂，钯及其合金的金属外表面的颗粒; 和（D）有效量的分子量高达约1000且每分子含有至少一个羟基的羟基官能的有机化合物，只要该化合物基本上不抑制组合物的固化。 固化的硅氧烷产品和多部分有机硅组合物。