公开(公告)号：US20150270200A1

公开(公告)日：2015-09-24

申请号：US14314150

申请日：2014-06-25

Applicant: Quanta Computer Inc.

Inventor： Li-Cheng Shen

IPC: H01L23/495 ,  H01L25/065 ,  H01L25/00 ,  H01L21/50

CPC classification number: H01L23/433 ,  H01L23/367 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/73267 ,  H01L2224/75745 ,  H01L2224/83191 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15321 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/37001 ,  H01L2224/19 ,  H01L2224/37099

Abstract: A system-in-package (SiP) module is disclosed. The SiP module includes a substrate and a dam on the substrate. The dam defines a cavity. At least one chip is on the substrate inside the cavity. A printed circuit board (PCB) is bonded to the dam and covers the cavity. A thermal conductive sheet is in the cavity and is disposed between the chip and the PCB. The chip is in thermal contact with the PCB through the thermal conductive sheet. The disclosure also provides a method for manufacturing the SiP module.

Abstract translation: 公开了一种系统级封装（SiP）模块。 SiP模块包括衬底和衬底上的阻挡层。 大坝定义一个空腔。 至少一个芯片位于腔内的基板上。 印刷电路板（PCB）结合到坝上并覆盖空腔。 导热片位于空腔中并且设置在芯片和PCB之间。 芯片通过导热片与PCB热接触。 本公开还提供了一种制造SiP模块的方法。

公开(公告)号：US09601407B2

公开(公告)日：2017-03-21

申请号：US14314150

申请日：2014-06-25

Applicant: Quanta Computer Inc.

Inventor： Li-Cheng Shen

IPC: H01L23/498 ,  H01L23/433 ,  H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L25/18

CPC classification number: H01L23/433 ,  H01L23/367 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/73267 ,  H01L2224/75745 ,  H01L2224/83191 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15321 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/37001 ,  H01L2224/19 ,  H01L2224/37099

Abstract: A system-in-package (SiP) module is disclosed. The SiP module includes a substrate and a dam on the substrate. The dam defines a cavity. At least one chip is on the substrate inside the cavity. A printed circuit board (PCB) is bonded to the dam and covers the cavity. A thermal conductive sheet is in the cavity and is disposed between the chip and the PCB. The chip is in thermal contact with the PCB through the thermal conductive sheet. The disclosure also provides a method for manufacturing the SiP module.

公开(公告)号：US09119320B2

公开(公告)日：2015-08-25

申请号：US13783722

申请日：2013-03-04

Applicant: Quanta Computer Inc.

Inventor： Li-Cheng Shen

IPC: H05K1/18 ,  H05K13/00 ,  H01L23/13 ,  H01L25/16 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49551 ,  H01L23/49805 ,  H01L23/49827 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/182 ,  H05K1/184 ,  H05K3/3426 ,  H05K3/3436 ,  H05K13/00 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10T29/49147 ,  H01L2924/00

Abstract: A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins. The system in package assembly is embedded into the opening of the printed circuit board.

Abstract translation: 公开了一种印刷电路板组件，其包括包括至少一个开口的印刷电路板和封装组件中的系统，其中封装组件中的系统包括封装模块中的系统和与封装模块中的系统结合的引线框架。 引线框架包括多个引脚。 封装组件中的系统嵌入印刷电路板的开口中。

公开(公告)号：US20130271924A1

公开(公告)日：2013-10-17

申请号：US13783722

申请日：2013-03-04

Applicant: QUANTA COMPUTER INC.

Inventor： Li-Cheng Shen

IPC: H05K1/18 ,  H05K13/00

CPC classification number: H05K1/181 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49551 ,  H01L23/49805 ,  H01L23/49827 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/182 ,  H05K1/184 ,  H05K3/3426 ,  H05K3/3436 ,  H05K13/00 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10T29/49147 ,  H01L2924/00

Abstract: A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins. The system in package assembly is embedded into the opening of the printed circuit board

Abstract translation: 公开了一种印刷电路板组件，其包括包括至少一个开口的印刷电路板和封装组件中的系统，其中封装组件中的系统包括封装模块中的系统和与封装模块中的系统结合的引线框架。 引线框架包括多个引脚。 封装组件中的系统嵌入印刷电路板的开口中

公开(公告)号：US09960501B2

公开(公告)日：2018-05-01

申请号：US14883936

申请日：2015-10-15

Applicant: Quanta Computer Inc.

Inventor： Tsung-Ying Hsieh ,  Li-Cheng Shen ,  Chung-Ting Hung

IPC: H01Q21/00 ,  H01Q21/28 ,  H01Q1/22

CPC classification number: H01Q21/28 ,  H01Q1/2275

Abstract: The present invention presents an electronic device. The electronic device includes a socket and a supplementary antenna. The socket is disposed on the electronic device, wherein the socket includes an accommodating portion for accommodating an external wireless communication module inserted from the outside. The supplementary antenna is disposed in the electronic device, wherein when the wireless communication module is completely inserted into the accommodating portion, the main antenna of the wireless communication module and the supplementary antenna become electromagnetically coupled; and wherein when the wireless communication module is completely inserted into the accommodating portion, the electronic device transmits/receives wireless signals using the main antenna and the supplementary antenna together.