MULTILAYERED CERAMIC CAPACITOR WITH IMPROVED LEAD FRAME ATTACHMENT
    1.
    发明申请
    MULTILAYERED CERAMIC CAPACITOR WITH IMPROVED LEAD FRAME ATTACHMENT 审中-公开
    多层陶瓷电容器与改进的引线框架连接

    公开(公告)号:US20130107419A1

    公开(公告)日:2013-05-02

    申请号:US13283784

    申请日:2011-10-28

    IPC分类号: H01G4/008 H01G7/00

    摘要: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.

    摘要翻译: 描述了具有改进的引线框架附件的电容器,其中改进的引线框架附件减轻了缺陷。 电容器包括具有交替极性的平行导电内部电极与导电内部电极之间的电介质。 第一铜底涂层与第一极性的导电内部电极电接触,并且第二铜底涂层与第二极性的导电内部电极电接触。 第一引线与第一铜底涂层电接触,在第一引线和第一铜底涂层之间具有第一焊料。 第二引线与第二铜底涂层电接触,在第二引线和第二铜底涂层之间具有第二焊料。