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公开(公告)号:US11762737B2
公开(公告)日:2023-09-19
申请号:US17956516
申请日:2022-09-29
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , Lawrence Lai
CPC classification number: G06F11/1076 , G06F11/1048
Abstract: A memory component internally generates and stores the check bits of error detect and correct code (EDC). In a first mode, during a read transaction, the check bits are sent to the memory controller along with the data on the data mask (DM) signal lines. In a second mode, an unmasked write transaction is defined where the check bits are sent to the memory component on the data mask signal lines. In a third mode, a masked write transaction is defined where at least a portion of the check bits are sent from the memory controller on the data signal lines coincident with an asserted data mask signal line. By sending the check bits along with the data, the EDC code can be used to detect and correct errors that occur between the memory component and the memory controller.
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公开(公告)号:US20220004472A9
公开(公告)日:2022-01-06
申请号:US16670798
申请日:2019-10-31
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , John Eric Linstadt , Scott C. Best
IPC: G06F11/20 , G11C29/52 , G11C11/4093
Abstract: A memory module is disclosed. The memory module includes a substrate, and respective first, second and third memory devices. The first memory device is of a first type disposed on the substrate and has addressable storage locations. The second memory device is also of the first type, and includes storage cells dedicated to store failure address information associated with defective storage locations in the first memory device. The third memory device is of the first type and includes storage cells dedicated to substitute as storage locations for the defective storage locations.
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公开(公告)号:US10481973B2
公开(公告)日:2019-11-19
申请号:US15907210
申请日:2018-02-27
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , John Eric Linstadt , Scott C. Best
Abstract: A memory module is disclosed. The memory module includes a substrate, and respective first, second and third memory devices. The first memory device is of a first type disposed on the substrate and has addressable storage locations. The second memory device is also of the first type, and includes storage cells dedicated to store failure address information associated with defective storage locations in the first memory device. The third memory device is of the first type and includes storage cells dedicated to substitute as storage locations for the defective storage locations.
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公开(公告)号:US10452478B2
公开(公告)日:2019-10-22
申请号:US15794164
申请日:2017-10-26
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , Lawrence Lai
Abstract: A memory component internally generates and stores the check bits of error detect and correct code (EDC). In a first mode, during a read transaction, the check bits are sent to the memory controller along with the data on the data mask (DM) signal lines. In a second mode, an unmasked write transaction is defined where the check bits are sent to the memory component on the data mask signal lines. In a third mode, a masked write transaction is defined where at least a portion of the check bits are sent from the memory controller on the data signal lines coincident with an asserted data mask signal line. By sending the check bits along with the data, the EDC code can be used to detect and correct errors that occur between the memory component and the memory controller.
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公开(公告)号:US11782807B2
公开(公告)日:2023-10-10
申请号:US17744347
申请日:2022-05-13
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , John Eric Linstadt , Scott C. Best
IPC: G06F11/20 , G11C11/4093 , G11C29/52
CPC classification number: G06F11/2094 , G11C11/4093 , G11C29/52 , G06F2201/82
Abstract: A memory module includes a substrate, and respective first, second and third memory devices. The first memory device is of a first type disposed on the substrate and has addressable storage locations. The second memory device is also of the first type, and includes storage cells dedicated to store failure address information associated with defective storage locations in the first memory device. The third memory device is of the first type and includes storage cells dedicated to substitute as storage locations for the defective storage locations.
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公开(公告)号:US11651823B2
公开(公告)日:2023-05-16
申请号:US16953182
申请日:2020-11-19
Applicant: Rambus Inc.
Inventor: Brent S. Haukness , Ian Shaeffer , Gary Bela Bronner
CPC classification number: G11C16/10 , G06F3/0611 , G06F3/0659 , G06F3/0688 , G06F2212/7204
Abstract: A memory system includes an array of non-volatile memory cells and a memory controller having a first port to receive a program command that addresses a number of the memory cells for a programming operation, having a second port coupled to the memory array via a command pipeline, and configured to create a plurality of fractional program commands in response to the program command. Execution of each fractional program command applies a single program pulse to the addressed memory cells to incrementally program the addressed memory cells with program data, where the duration of the program pulse associated with each fractional program command is a selected fraction of the total programming time typically required to program the memory cells.
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公开(公告)号:US10884860B2
公开(公告)日:2021-01-05
申请号:US16565848
申请日:2019-09-10
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , Lawrence Lai
Abstract: A memory component internally generates and stores the check bits of error detect and correct code (EDC). In a first mode, during a read transaction, the check bits are sent to the memory controller along with the data on the data mask (DM) signal lines. In a second mode, an unmasked write transaction is defined where the check bits are sent to the memory component on the data mask signal lines. In a third mode, a masked write transaction is defined where at least a portion of the check bits are sent from the memory controller on the data signal lines coincident with an asserted data mask signal line. By sending the check bits along with the data, the EDC code can be used to detect and correct errors that occur between the memory component and the memory controller.
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公开(公告)号:US09916196B2
公开(公告)日:2018-03-13
申请号:US14631570
申请日:2015-02-25
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Brent S. Haukness , John Eric Linstadt , Scott C. Best
CPC classification number: G06F11/1048 , G11C5/04 , G11C29/42 , G11C29/44 , G11C2029/0411 , G11C2029/4402
Abstract: A memory module includes a substrate, and respective first, second and third memory devices. The first memory device is of a first type disposed on the substrate and has addressable storage locations. The second memory device is also of the first type, and includes storage cells dedicated to store failure address information associated with defective storage locations in the first memory device. The third memory device is of the first type and includes storage cells dedicated to substitute as storage locations for the defective storage locations.
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公开(公告)号:US20160071608A1
公开(公告)日:2016-03-10
申请号:US14940084
申请日:2015-11-12
Applicant: Rambus Inc.
Inventor: Gary B. Bronner , Brent S. Haukness , Mark A. Horowitz , Mark D. Kellam , Fariborz Assaderaghi
IPC: G11C16/26
CPC classification number: G11C16/26 , G11C7/04 , G11C13/0002 , G11C13/0033 , G11C13/0035 , G11C16/06 , H01L21/324
Abstract: Control logic within a memory control component outputs first and second memory read commands to a memory module at respective times, the memory module having memory components disposed thereon. Interface circuitry within the memory control component receives first read data concurrently from a first plurality of the memory components via a first plurality of data paths, respectively, in response to the first memory read command, and receives second read data concurrently from a second plurality of the memory components via a second plurality of data paths, respectively, in response to the second memory read command, the first plurality of the memory components including at least one memory component not included in the second plurality of the memory components and vice-versa.
Abstract translation: 存储器控制组件内的控制逻辑在相应的时间向存储器模块输出第一和第二存储器读取命令,存储器模块具有置于其上的存储器组件。 存储器控制组件内的接口电路响应于第一存储器读取命令分别经由第一多个数据路径从第一多个存储器组件同时接收第一读取数据,并且从第二个多个 所述存储器组件分别响应于所述第二存储器读取命令经由第二多个数据路径,所述第一多个存储器组件包括不包括在所述第二多个存储器组件中的至少一个存储器组件,反之亦然。
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公开(公告)号:US20140254286A1
公开(公告)日:2014-09-11
申请号:US14097503
申请日:2013-12-05
Applicant: Rambus Inc.
Inventor: Gary B. Bronner , Brent S. Haukness , Mark A. Horowitz , Mark D. Kellam , Fariborz Assaderaghi
IPC: G11C16/06
CPC classification number: G11C16/26 , G11C7/04 , G11C13/0002 , G11C13/0033 , G11C13/0035 , G11C16/06 , H01L21/324
Abstract: In response to detecting an event during operation of an integrated-circuit memory device containing charge-storing memory cells, an electric current is enabled to flow through a word line coupled to the charge-storing memory cells for a brief interval to heat the charge-storing memory cells to an annealing temperature range.
Abstract translation: 响应于在包含电荷存储存储单元的集成电路存储器件的操作期间检测到事件,电流能够短暂地流过耦合到电荷存储存储单元的字线,以加热电荷存储单元, 将存储单元存储到退火温度范围。
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