Abstract:
A beam lead device which can be made extremely thin and with an extremely narrow cross sectional area is presented. The beam lead device has elongated metal contacts on its top and bottom surfaces which overhang the surfaces and which are angularly disposed from one another so as to form an X. Also presented is the method for making such a beam lead device which includes the steps of preparing an appropriately-doped piece of semiconductor material, depositing elongated metal contacts upon the top and bottom surfaces of the semiconductor material, and then etching through the semiconductor material with its portions of the top and bottom contacts which intersect one another acting as a mask and protecting the semiconductor device during the etching procedure. The disclosed method of forming a beam lead device eliminates critical alignment of masks and also provides a simplified method of making such a device.
Abstract:
A movable magnetic tuning slug capacitively coupled to both the center conductor and outer conductor of an electromagnetic transmission line is used to provide a desired transmission line impedance in response to an applied magnetic field.
Abstract:
Three coplanar conductive surfaces on the top surface of a dielectric substrate form a microwave transmission line having first and second transmission modes used in the construction and operation of various microwave devices, such as amplifiers and directional couplers.
Abstract:
Three coplanar conductive surfaces on the top surface of a dielectric substrate form a microwave transmission line having first and second transmission modes used in the construction and operation of various microwave devices, such as amplifiers unbalanced-to balanced transmission line transformers and directional couplers.
Abstract:
The reactance of an active element exhibiting a nonlinear current-voltage characteristic in response to an applied input signal and generating an output signal at a desired frequency is incorporated as part of a circuit resonant at both the frequency of the applied input signal and of the output signal.
Abstract:
Semiconductor devices having thin bodies of a semiconductor material are made from a wafer of the semiconductor material which is thicker than the bodies of the devices. The thicker wafer is provided with spaced thinner portions of the desired area and thickness of the bodies of the devices to be formed by etching recesses in one surface of the wafer. The recesses are formed with flat bottoms which are of the desired area of the bodies of the devices. A masking layer is coated on the bottom of each of the recesses. The active region of each of the devices is formed at the other surface of the wafer over each of the recesses. The semiconductor material between the thin portions of the wafer is then removed by etching the wafer from the one surface of the wafer so as to separate the thin portions of the wafer to form the individual devices. During the last etching process the masking layers on the bottom of the recess protect the thin portions of the wafer from being etched.
Abstract:
The transistor is especially useful for high frequency switching applications. A conductive path between ohmic contacts will pass high frequency signals with very little impedance. The conductive path is comprised of a doped semiconductor layer of one conductivity type to which ohmic contacts are attached. The substrate of the device which underlies the layer is heavily doped with deep impurities of opposite conductivity type so that it has a high resistivity. The high resistivity of the substrate isolates the driving voltage used to switch the device from the signal passed between the ohmic contacts. The device can be turned ''''OFF'''' by reverse biasing the PN junction formed between the substrate and the layer. This is accomplished by imposing a driver voltage between one of the ohmic contacts and a metallic contact connected to the substrate.
Abstract:
Three coplanar conductive surfaces on the top surface of a dielectric substrate form a microwave transmission line having first and second transmission modes used in the construction and operation of various microwave devices, such as amplifiers and directional couplers.
Abstract:
A semiconductor device having at least two contacts on a body of semiconductor material. One of the contacts is in a plane spaced from the plane of the other contacts and the edges of the one contact are in substantial alignment with the adjacent edges of the other contacts. The material under either the edges of the one contact or the adjacent edges of the other contacts is removed so that such edges project in cantilever fashion beyond the material under the respective contact.