-
公开(公告)号：US20180307141A1
公开(公告)日：2018-10-25
申请号：US15769944
申请日：2016-09-23
Inventor： Jin Kwon , Geun Huh , Jong-Ho Na , Jong Han Yang
CPC classification number: G03F7/0757 , G03F7/0233 , G03F7/038
Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition includes a siloxane polymer, a 1,2-quinonediazide compound, an epoxy compound and at least one silane compound represented by formula 1. The silane compound together with the epoxy compound in the resin composition further reduces the number of highly reactive silanol group present in the siloxane polymer. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximized to provide a cured film having excellent stability.
-
公开(公告)号：US11137682B2
公开(公告)日：2021-10-05
申请号：US16160024
申请日：2018-10-15
Inventor： Kahee Shin , Jong Han Yang , Geun Huh
Abstract: The present invention relates to a photosensitive resin composition that is excellent in adhesiveness and sensitivity. Specifically, the photosensitive resin composition is capable of providing a cured film that is excellent in transparency, sensitivity, chemical resistance, and adhesiveness upon immersion in a stripper. Thus, the cured film can be effectively used in a liquid crystal display, an organic EL display, and the like.
-
公开(公告)号：US10890846B2
公开(公告)日：2021-01-12
申请号：US15769945
申请日：2016-09-22
Inventor： Jong-Ho Na , Geun Huh , Jin Kwon , Jong Han Yang
IPC: G03F7/075 , G03F7/004 , G03F7/022 , G03F7/023 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , G03F7/038 , G03F7/039 , H01L21/3105 , H01L27/12 , H01L27/32 , C08G77/18 , C08G77/24
Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition introduces a siloxane polymer containing a fluorine atom which has strong water-repellency into a composition including a common siloxane polymer and an epoxy compound, and fluorine groups may be present in the whole region of the cured film so that the water-repellency due to a fluorine component may be maintained even after removing the surface of the cured film is removed via a dry etching process. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximizes to provide a cured film having excellent stability.
-
Patent Agency Ranking
公开(公告)号：US20180095365A1
公开(公告)日：2018-04-05
申请号：US15725388
申请日：2017-10-05
Inventor： Yeonok Kim , Geun Huh , Jong Han Yang , Jin Kwon , Jin Kyu Im
CPC classification number: G03F7/0048 , C08G77/04 , C08L83/04 , G03F7/0226 , G03F7/0233 , G03F7/039 , G03F7/0755 , G03F7/0757 , C08K5/28 , C08K5/08 , C08K5/01
Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
-
公开(公告)号：US10942449B2
公开(公告)日：2021-03-09
申请号：US15725388
申请日：2017-10-05
Inventor： Yeonok Kim , Geun Huh , Jong Han Yang , Jin Kwon , Jin Kyu Im
Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
-
公开(公告)号：US20190137877A1
公开(公告)日：2019-05-09
申请号：US16097883
申请日：2017-03-29
Inventor： Jong Han Yang , Geun Huh , Jin Kwon , Jong-Ho Na
Abstract: The present invention provides a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition includes a mixture of two or more siloxane polymers having different dissolution rates with respect to an aqueous solution of tetramethylammonium hydroxide. The composition keeps high transparency and high sensitivity, which are advantages of a composition containing a siloxane polymer, and has excellent chemical resistance, thereby providing a cured film having excellent stability in a post-processing.
-
公开(公告)号：US11106133B2
公开(公告)日：2021-08-31
申请号：US16192013
申请日：2018-11-15
Inventor： Yeonok Kim , Geun Huh , Ju-Young Jung , Jung-Hwa Lee , Jong Han Yang
IPC: G03F7/039 , G03F7/075 , G03F7/038 , G03F7/023 , C08G77/392 , C08G77/388 , H01L27/12
Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises an acrylic resin and a siloxane copolymer containing a sulfonated diazoquinone group at the terminal thereof. Thus, the film retention rate and adhesiveness can be further enhanced, while the sensitivity is maintained.
-
公开(公告)号：US20180314153A1
公开(公告)日：2018-11-01
申请号：US15769945
申请日：2016-09-22
Inventor： Jong-Ho Na , Geun Huh , Jin Kwon , Jong Han Yang
IPC: G03F7/075 , C08G77/18 , G03F7/022 , G03F7/023 , G03F7/039 , G03F7/004 , C08G77/24 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , H01L21/3105 , H01L27/32 , H01L27/12
CPC classification number: G03F7/0757 , G03F7/0046 , G03F7/0226 , G03F7/0233 , G03F7/038
Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition introduces a siloxane polymer containing a fluorine atom which has strong water-repellency into a composition including a common siloxane polymer and an epoxy compound, and fluorine groups may be present in the whole region of the cured film so that the water-repellency due to a fluorine component may be maintained even after removing the surface of the cured film is removed via a dry etching process. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximizes to provide a cured film having excellent stability.
-
-
-
-
-
-
-
Search Results
8
records
(took 0.028 seconds)
