公开(公告)号：US20230125777A1

公开(公告)日：2023-04-27

申请号：US18047441

申请日：2022-10-18

申请人： ROHM Co., LTD.

发明人： Tetsuo Yamato ,  Shuntaro Takahashi ,  Kazuki Okuyama

IPC分类号： H03K17/687

摘要： Disclosed is a switch device including a first terminal, a second terminal, a third terminal, a switch element disposed between the first terminal and the second terminal, a control line that reaches a control end of the switch element from the third terminal, a first circuit block that is disposed on the control line and is configured to drive the switch element according to a control signal supplied to the third terminal, at least one second circuit block, each second circuit block being connected to a corresponding one of branch power supply lines that branch from the control line, a first resistor disposed between the third terminal and the first circuit block, and at least one second resistor, each second resistor being disposed on a corresponding one of the branch power supply lines.

公开(公告)号：US12119813B2

公开(公告)日：2024-10-15

申请号：US18047441

申请日：2022-10-18

申请人： ROHM Co., LTD.

发明人： Tetsuo Yamato ,  Shuntaro Takahashi ,  Kazuki Okuyama

IPC分类号： H03K17/687 ,  H01H47/00 ,  H01H47/04 ,  H01H47/32

CPC分类号： H03K17/687 ,  H03K2217/0063 ,  H03K2217/0072

摘要： Disclosed is a switch device including a first terminal, a second terminal, a third terminal, a switch element disposed between the first terminal and the second terminal, a control line that reaches a control end of the switch element from the third terminal, a first circuit block that is disposed on the control line and is configured to drive the switch element according to a control signal supplied to the third terminal, at least one second circuit block, each second circuit block being connected to a corresponding one of branch power supply lines that branch from the control line, a first resistor disposed between the third terminal and the first circuit block, and at least one second resistor, each second resistor being disposed on a corresponding one of the branch power supply lines.

公开(公告)号：US12021012B2

公开(公告)日：2024-06-25

申请号：US17044658

申请日：2019-04-11

申请人： ROHM CO., LTD.

发明人： Kazuki Okuyama ,  Shuntaro Takahashi ,  Motoharu Haga ,  Shingo Yoshida ,  Kazuhisa Kumagai ,  Hajime Okuda

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/765 ,  H01L23/00 ,  H01L23/31 ,  H01L23/34 ,  H01L29/40 ,  H01L29/66 ,  H01L29/78

CPC分类号： H01L23/49562 ,  H01L21/4825 ,  H01L21/565 ,  H01L21/765 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49582 ,  H01L24/48 ,  H01L29/407 ,  H01L29/66734 ,  H01L29/7813 ,  H01L2224/48245 ,  H01L2224/48472 ,  H01L2924/13091

摘要： A semiconductor device includes a semiconductor element and a first connection member. The semiconductor element includes a substrate and an electrode pad. The substrate includes a transistor formation region, in which a transistor is formed and which is shaped to be non-quadrangular. The electrode pad is located on the transistor formation region. The first connection member is connected to the electrode pad at one location. The electrode pad is arranged to cover a center of gravity of the transistor formation region in a plan view of the electrode pad. In the plan view, a connection region in which the first connection member is connected to the electrode pad includes a center of gravity position of the transistor formation region.