公开(公告)号：US10706993B2

公开(公告)日：2020-07-07

申请号：US15703954

申请日：2017-09-13

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi ,  Yasuhiro Kondo ,  Keishi Watanabe ,  Takamichi Torii ,  Katsuya Matsuura

IPC: H01F27/28 ,  H01C1/01 ,  H01F27/29 ,  H01G4/30 ,  H01G4/228 ,  H01F17/00 ,  H01C1/02 ,  H05K1/02 ,  H01C17/26 ,  H05K1/16 ,  H01C1/142 ,  H01C7/00 ,  H01L23/522 ,  H01C13/02 ,  H01L49/02 ,  H01G4/33 ,  H01C1/14

Abstract: A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.

公开(公告)号：US09773588B2

公开(公告)日：2017-09-26

申请号：US14713684

申请日：2015-05-15

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi ,  Yasuhiro Kondo ,  Keishi Watanabe ,  Takamichi Torii ,  Katsuya Matsuura

IPC: H01C7/10 ,  H01C1/01 ,  H01F27/29 ,  H01C1/14 ,  H01G4/30 ,  H01G4/228 ,  H01F27/28 ,  H01F17/00

CPC classification number: H01C1/01 ,  H01C1/02 ,  H01C1/14 ,  H01C1/142 ,  H01C7/006 ,  H01C13/02 ,  H01C17/267 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/0026 ,  H01G4/228 ,  H01G4/30 ,  H01G4/33 ,  H01L23/5228 ,  H01L23/647 ,  H01L28/20 ,  H05K1/0293 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167

Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.

公开(公告)号：US11990264B2

公开(公告)日：2024-05-21

申请号：US17381633

申请日：2021-07-21

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/10 ,  H01F41/12

CPC classification number: H01F27/28 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01F27/323 ,  H01F41/04 ,  H01F41/041 ,  H01F41/10 ,  H01F41/122

Abstract: A chip inductor includes a sealing body having a mounting surface and a coil conductor sealed in an interior of the sealing body, wherein the coil conductor includes a first coil end exposed from the mounting surface of the sealing body, a second coil end exposed from the mounting surface of the sealing body, and a spiral portion of spiral form connected to the first coil end and the second coil end and routed along a normal direction of the mounting surface of the sealing body from the first coil end and the second coil end.

公开(公告)号：US10586774B2

公开(公告)日：2020-03-10

申请号：US15795511

申请日：2017-10-27

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi ,  Yasuhiro Kondo

IPC: H01L23/66 ,  H01L27/01 ,  H01L49/02 ,  H05K3/10 ,  H05K1/02 ,  H05K1/16 ,  H05K3/14

Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

公开(公告)号：US12165797B2

公开(公告)日：2024-12-10

申请号：US16369049

申请日：2019-03-29

Applicant: ROHM Co., LTD.

Inventor： Takuma Shimoichi

IPC: H01F27/28

Abstract: The present technology provides a chip inductor of which the height can be reduced. The chip inductor includes a sealing resin having a mounting face; a coil conductor disposed in the sealing resin, including an inner end and an outer end, and spirally wound; an inner terminal disposed on the mounting face, and electrically connected to the inner end; and an outer terminal disposed on the mounting face and electrically connected to the outer end.

公开(公告)号：US11094447B2

公开(公告)日：2021-08-17

申请号：US15940002

申请日：2018-03-29

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04 ,  H01F41/12 ,  H01F27/32 ,  H01F41/10 ,  H01F17/00

Abstract: A chip inductor includes a sealing body having a mounting surface and a coil conductor sealed in an interior of the sealing body, wherein the coil conductor includes a first coil end exposed from the mounting surface of the sealing body, a second coil end exposed from the mounting surface of the sealing body, and a spiral portion of spiral form connected to the first coil end and the second coil end and routed along a normal direction of the mounting surface of the sealing body from the first coil end and the second coil end.

公开(公告)号：US11410985B2

公开(公告)日：2022-08-09

申请号：US16898950

申请日：2020-06-11

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi

IPC: H01L27/01 ,  H01L23/522 ,  H01L49/02 ,  H03H7/01

Abstract: The present invention provides a chip component that achieves outstanding LC characteristics.
The present invention provides a chip component (1), including: a substrate (12); an inorganic insulating layer (13), formed on the substrate (12); an organic insulating layer (14), formed on the inorganic insulating layer (13); and an LC circuit (6), including a first capacitor (C1) formed in the inorganic insulating layer (13), and a first inductor (L1) formed, in a manner of being electrically connected to the first capacitor (C1), in the organic insulating layer (14).

公开(公告)号：US10566126B2

公开(公告)日：2020-02-18

申请号：US15703091

申请日：2017-09-13

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi

IPC: H01F5/00 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: A chip inductor includes a substrate having a main surface, an insulating layer covering the main surface of the substrate, an external terminal formed on the insulating layer, and a coil conductor of a spiral-shape routed to a region outside the external terminal and a region facing the external terminal at the main surface of the substrate.

公开(公告)号：US09812412B2

公开(公告)日：2017-11-07

申请号：US14980404

申请日：2015-12-28

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi ,  Yasuhiro Kondo

IPC: H01L23/66 ,  H01L49/02 ,  H01L27/01

CPC classification number: H01L23/66 ,  H01L27/016 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L2223/6672 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/029 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/107 ,  H05K3/146 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0376 ,  H05K2201/0391 ,  H05K2201/09263 ,  H05K2201/09981 ,  H05K2201/10181 ,  H05K2203/0353 ,  H05K2203/1338 ,  H01L2924/00

Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.