公开(公告)号：US20180301428A1

公开(公告)日：2018-10-18

申请号：US15949746

申请日：2018-04-10

申请人： Rajen Manicon Murugan ,  Minhong Mi ,  Gary Paul Morrison ,  Jie Chen ,  Kenneth Robert Rhyner ,  Stanley Craig Beddingfield ,  Chittranjan Mohan Gupta ,  Django Earl Trombley

发明人： Rajen Manicon Murugan ,  Minhong Mi ,  Gary Paul Morrison ,  Jie Chen ,  Kenneth Robert Rhyner ,  Stanley Craig Beddingfield ,  Chittranjan Mohan Gupta ,  Django Earl Trombley

IPC分类号： H01L23/66 ,  H01L23/00 ,  H01Q1/32 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H01Q1/22 ,  H01Q23/00

CPC分类号： H01L23/66 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/1423 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01Q1/3233 ,  H01Q23/00 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/181 ,  H05K2201/09609 ,  H05K2201/10734 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

摘要： A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

公开(公告)号：US20130299966A1

公开(公告)日：2013-11-14

申请号：US13469012

申请日：2012-05-10

申请人： Anil KV Kumar ,  Gary Paul Morrison

发明人： Anil KV Kumar ,  Gary Paul Morrison

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/05 ,  H01L23/562 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05555 ,  H01L2224/05563 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

摘要： A WSP die having a redistribution layer (“RDL”) with an RDL capture pad that has an RDL pad central axis RR and a RDL pad outer peripheral edge arranged about the RDL capture pad central axis RR and an under bump metal (UBM) pad positioned above the RDL capture pad. The UBM pad has a UBM pad central axis UU and a UBM pad outer peripheral edge arranged around the UBM pad central axis UU. The UBM pad central axis UU is laterally offset from the RDL pad central axis RR.

摘要翻译： 具有RDL捕获垫的再分配层（“RDL”）的WSP管芯具有RDL焊盘中心轴RR和围绕RDL捕获焊盘中心轴RR布置的RDL焊盘外围边缘以及下凸块金属（UBM）焊盘 位于RDL捕获板上方。 UBM焊盘具有UBM焊盘中心轴UU和布置在UBM焊盘中心轴UU周围的UBM焊盘外周边缘。 UBM焊盘中心轴UU从RDL焊盘中心轴RR侧向偏移。

公开(公告)号：US20130299967A1

公开(公告)日：2013-11-14

申请号：US13469020

申请日：2012-05-10

申请人： Jeffrey David Daniels ,  Gary Paul Morrison

发明人： Jeffrey David Daniels ,  Gary Paul Morrison

IPC分类号： H01L23/48 ,  H01L21/302

CPC分类号： H01L24/05 ,  H01L23/562 ,  H01L24/03 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05011 ,  H01L2224/05012 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05555 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

摘要： A MP die with a redistribution layer (“RDL”) capture pad having at least one void therein and having an RDL capture pad outer peripheral edge and an under bump metal (“UBM”) pad positioned above the RDL capture pad and having a UBM pad outer peripheral edge positioned laterally inwardly of the RDL capture pad outer peripheral edge and positioned laterally outwardly of all the voids in the RDL capture pad.

摘要翻译： 具有再分配层（“RDL”）捕获垫的MP管芯在其中具有至少一个空隙并且具有RDL捕获垫外周边缘和位于RDL捕获垫上方并具有UBM的底部凸块金属（“UBM”）垫 垫外周边缘位于RDL捕获垫外周边缘的横向内侧并且位于RDL捕获垫中的所有空隙的横向外侧。