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1.发明申请公开(公告)号：US20180301428A1
公开(公告)日：2018-10-18
申请号：US15949746
申请日：2018-04-10
申请人： Rajen Manicon Murugan , Minhong Mi , Gary Paul Morrison , Jie Chen , Kenneth Robert Rhyner , Stanley Craig Beddingfield , Chittranjan Mohan Gupta , Django Earl Trombley
发明人： Rajen Manicon Murugan , Minhong Mi , Gary Paul Morrison , Jie Chen , Kenneth Robert Rhyner , Stanley Craig Beddingfield , Chittranjan Mohan Gupta , Django Earl Trombley
CPC分类号： H01L23/66 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6627 , H01L2223/6655 , H01L2223/6677 , H01L2223/6683 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/1423 , H01L2924/15173 , H01L2924/15311 , H01L2924/30111 , H01Q1/2283 , H01Q1/3233 , H01Q23/00 , H05K1/0222 , H05K1/0243 , H05K1/0245 , H05K1/0251 , H05K1/181 , H05K2201/09609 , H05K2201/10734 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599
摘要： A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
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2.发明申请公开(公告)号：US20130026642A1
公开(公告)日：2013-01-31
申请号：US13191783
申请日：2011-07-27
CPC分类号： H01L24/03 , H01L21/50 , H01L23/48 , H01L23/49805 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L24/05 , H01L24/16 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05147 , H01L2224/05569 , H01L2224/05571 , H01L2224/13022 , H01L2224/131 , H01L2224/16237 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2924/12042 , H01L2924/15787 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： An integrated circuit package including a semiconductor die and a flexible circuit (flex circuit), and a method for forming the integrated circuit package. The flex circuit can include a direct connect pad which is not electrically coupled to an active trace, a blind via electrically coupled to the direct connect pad, and a semiconductor die having a bond pad which is electrically coupled to the direct connect pad using a conductor. The bond pad, the conductor, the direct connect pad, and the blind via can all be vertically aligned, each with the other.
摘要翻译： 包括半导体管芯和柔性电路（柔性电路）的集成电路封装以及用于形成集成电路封装的方法。 柔性电路可以包括不电耦合到有源迹线的直接连接焊盘，电耦合到直接连接焊盘的盲孔，以及具有接合焊盘的半导体管芯，其使用导体电连接到直接连接焊盘 。 接合焊盘，导体，直接连接焊盘和盲孔都可以垂直对准，每个都与另一个垂直对齐。
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3.发明授权Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad 有权集成电路封装，包括直接连接焊盘，盲通孔和电连接到直接连接焊盘的接合焊盘公开(公告)号：US08598048B2
公开(公告)日：2013-12-03
申请号：US13191783
申请日：2011-07-27
IPC分类号： H01L23/48
CPC分类号： H01L24/03 , H01L21/50 , H01L23/48 , H01L23/49805 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L24/05 , H01L24/16 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05147 , H01L2224/05569 , H01L2224/05571 , H01L2224/13022 , H01L2224/131 , H01L2224/16237 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2924/12042 , H01L2924/15787 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： An integrated circuit package including a semiconductor die and a flexible circuit (flex circuit), and a method for forming the integrated circuit package. The flex circuit can include a direct connect pad which is not electrically coupled to an active trace, a blind via electrically coupled to the direct connect pad, and a semiconductor die having a bond pad which is electrically coupled to the direct connect pad using a conductor. The bond pad, the conductor, the direct connect pad, and the blind via can all be vertically aligned, each with the other.
摘要翻译： 包括半导体管芯和柔性电路（柔性电路）的集成电路封装以及用于形成集成电路封装的方法。 柔性电路可以包括不电耦合到有源迹线的直接连接焊盘，电耦合到直接连接焊盘的盲孔，以及具有接合焊盘的半导体管芯，其使用导体电连接到直接连接焊盘 。 接合焊盘，导体，直接连接焊盘和盲孔都可以垂直对准，每个都与另一个垂直对齐。
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