公开(公告)号：US06197222B1

公开(公告)日：2001-03-06

申请号：US09119569

申请日：1998-07-20

申请人： Ravi F. Saraf ,  Judith Marie Roldan ,  Michael Anthony Gaynes ,  Richard Benton Booth ,  Steven Paul Ostrander ,  Emanuel I. Cooper ,  Carlos J. Sambucetti

发明人： Ravi F. Saraf ,  Judith Marie Roldan ,  Michael Anthony Gaynes ,  Richard Benton Booth ,  Steven Paul Ostrander ,  Emanuel I. Cooper ,  Carlos J. Sambucetti

IPC分类号： H01B104

CPC分类号： H01L24/81 ,  H01B1/22 ,  H01L23/49883 ,  H01L2224/13009 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/321 ,  H05K3/4614 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2203/0783

摘要： An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.

摘要翻译： 公开了一种包括热塑性聚合物，导电金属粉末和有机溶剂系统的导电浆料。 本发明还包括一种包含上述热塑性和金属的导电复合材料，其中基于复合材料的总体积，金属占体积的至少约30体积％。 复合材料由高温下的糊料形成。 该糊剂用于涉及将糊料转化为复合材料的工艺条件下的电气和电子部件电连接的工艺。

公开(公告)号：US5866044A

公开(公告)日：1999-02-02

申请号：US734492

申请日：1996-10-21

申请人： Ravi F. Saraf ,  Judith Marie Roldan ,  Michael Anthony Gaynes ,  Richard Benton Booth ,  Steven Paul Ostrander ,  Emanuel I. Cooper ,  Carlos J. Sambucetti

发明人： Ravi F. Saraf ,  Judith Marie Roldan ,  Michael Anthony Gaynes ,  Richard Benton Booth ,  Steven Paul Ostrander ,  Emanuel I. Cooper ,  Carlos J. Sambucetti

IPC分类号： H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  H05K3/46 ,  H01B1/12

CPC分类号： H01L24/81 ,  H01B1/22 ,  H01L23/49883 ,  H05K3/321 ,  H01L2224/13009 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2203/0783 ,  H05K3/4614 ,  H05K3/4632

摘要： An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.

摘要翻译： 公开了一种包括热塑性聚合物，导电金属粉末和有机溶剂系统的导电浆料。 本发明还包括一种包含上述热塑性和金属的导电复合材料，其中基于复合材料的总体积，金属占体积的至少约30体积％。 复合材料由高温下的糊料形成。 该糊剂用于涉及将糊料转化为复合材料的工艺条件下的电气和电子部件电连接的工艺。

公开(公告)号：US5813870A

公开(公告)日：1998-09-29

申请号：US678852

申请日：1996-07-12

申请人： Michael Anthony Gaynes ,  Jaynal Abedin Molla ,  Steven Paul Ostrander ,  Judith Marie Roldan ,  George John Saxenmeyer ,  George Frederick Walker

发明人： Michael Anthony Gaynes ,  Jaynal Abedin Molla ,  Steven Paul Ostrander ,  Judith Marie Roldan ,  George John Saxenmeyer ,  George Frederick Walker

IPC分类号： H01L23/32 ,  H01L21/60 ,  H01L21/68 ,  H01R4/58

CPC分类号： H01L21/6835 ,  H01L2221/68345 ,  H01L2224/81101 ,  H01L2924/0002

摘要： Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a noble metal at a high current density.

摘要翻译： 电介质粘合膜，其图案化为导电细丝簇，其延伸穿过膜厚度以提供电互连和封装。 电介质粘合剂材料是可再加工的。 通过以高电流密度选择性地电镀贵金属来形成簇。

公开(公告)号：US20100248506A1

公开(公告)日：2010-09-30

申请号：US12410095

申请日：2009-03-24

申请人： Mark Kenneth Hoffmeyer ,  Steven Paul Ostrander ,  Sri M. Sri-Jayantha

发明人： Mark Kenneth Hoffmeyer ,  Steven Paul Ostrander ,  Sri M. Sri-Jayantha

IPC分类号： H01R12/00 ,  H01R43/04

CPC分类号： H05K1/111 ,  H01R43/0256 ,  H05K3/3421 ,  H05K2201/0373 ,  H05K2201/09736 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49218

摘要： A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.

摘要翻译： 提供了一种方法和表面贴装技术（SMT）焊盘结构，用于实现增强的焊点鲁棒性。 SMT焊盘结构包括基板SMT焊盘。 基座SMT焊盘接收用于焊接到SMT焊盘结构的连接器。 在基座SMT焊盘上限定具有选定几何形状的间隔结构，以增加用于连接器的焊点的厚度。

公开(公告)号：US08085550B2

公开(公告)日：2011-12-27

申请号：US12410095

申请日：2009-03-24

申请人： Mark Kenneth Hoffmeyer ,  Steven Paul Ostrander ,  Sri M. Sri-Jayantha

发明人： Mark Kenneth Hoffmeyer ,  Steven Paul Ostrander ,  Sri M. Sri-Jayantha

IPC分类号： H05K7/10

CPC分类号： H05K1/111 ,  H01R43/0256 ,  H05K3/3421 ,  H05K2201/0373 ,  H05K2201/09736 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49218

摘要： A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.

摘要翻译： 提供了一种方法和表面贴装技术（SMT）焊盘结构，用于实现增强的焊点鲁棒性。 SMT焊盘结构包括基板SMT焊盘。 基座SMT焊盘接收用于焊接到SMT焊盘结构的连接器。 在基座SMT焊盘上限定具有选定几何形状的间隔结构，以增加用于连接器的焊点的厚度。

公开(公告)号：US06502999B1

公开(公告)日：2003-01-07

申请号：US09946053

申请日：2001-09-04

申请人： Mitchell Simmons Cohen ,  David Peter Gaio ,  William K. Hogan ,  Steven Paul Ostrander ,  Sudipta Kumar Ray ,  Jeannine Madelyn Trewhella

发明人： Mitchell Simmons Cohen ,  David Peter Gaio ,  William K. Hogan ,  Steven Paul Ostrander ,  Sudipta Kumar Ray ,  Jeannine Madelyn Trewhella

IPC分类号： G02B636

CPC分类号： G02B6/4246 ,  G02B6/4206 ,  G02B6/4245 ,  G02B6/4251 ,  G02B6/4257 ,  G02B6/4267 ,  G02B6/4269 ,  G02B6/4274

摘要： An opto-electronic module is housed in a hermetically sealed housing which is fabricated on a base member of solderable material to which a side wall structure is soldered. A cover is similarly provided that either is soldered to the top open end of the housing at the edge of the housing wall structure or is a cup-shaped member that slides over the wall structure and is soldered at the juxtaposed faces of the walls of the cover and the wall structure. Overlapping slots co-align to form a passage through which optical fibers may pass through the walls. The hermetic seal of the housing prevents the internal contamination of the module by water vapor, particulate matter or other contaminants.

摘要翻译： 光电模块容纳在气密密封的壳体中，该壳体被制造在可焊接材料的基底构件上，侧壁结构被焊接到该基底构件上。 类似地提供了一种盖子，其在壳体壁结构的边缘被焊接到壳体的顶部开口端，或者是在壁结构上滑动并且在壁结构的壁的并置面上被焊接的杯状构件 盖和墙结构。 重叠槽共同对准以形成光纤通过该通道的通道。 外壳的气密密封可防止模块被水蒸汽，颗粒物或其他污染物污染。