公开(公告)号：US06197222B1

公开(公告)日：2001-03-06

申请号：US09119569

申请日：1998-07-20

申请人： Ravi F. Saraf ,  Judith Marie Roldan ,  Michael Anthony Gaynes ,  Richard Benton Booth ,  Steven Paul Ostrander ,  Emanuel I. Cooper ,  Carlos J. Sambucetti

发明人： Ravi F. Saraf ,  Judith Marie Roldan ,  Michael Anthony Gaynes ,  Richard Benton Booth ,  Steven Paul Ostrander ,  Emanuel I. Cooper ,  Carlos J. Sambucetti

IPC分类号： H01B104

CPC分类号： H01L24/81 ,  H01B1/22 ,  H01L23/49883 ,  H01L2224/13009 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/321 ,  H05K3/4614 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2203/0783

摘要： An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.

摘要翻译： 公开了一种包括热塑性聚合物，导电金属粉末和有机溶剂系统的导电浆料。 本发明还包括一种包含上述热塑性和金属的导电复合材料，其中基于复合材料的总体积，金属占体积的至少约30体积％。 复合材料由高温下的糊料形成。 该糊剂用于涉及将糊料转化为复合材料的工艺条件下的电气和电子部件电连接的工艺。

公开(公告)号：US5866044A

公开(公告)日：1999-02-02

申请号：US734492

申请日：1996-10-21

申请人： Ravi F. Saraf ,  Judith Marie Roldan ,  Michael Anthony Gaynes ,  Richard Benton Booth ,  Steven Paul Ostrander ,  Emanuel I. Cooper ,  Carlos J. Sambucetti

发明人： Ravi F. Saraf ,  Judith Marie Roldan ,  Michael Anthony Gaynes ,  Richard Benton Booth ,  Steven Paul Ostrander ,  Emanuel I. Cooper ,  Carlos J. Sambucetti

IPC分类号： H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  H05K3/46 ,  H01B1/12

CPC分类号： H01L24/81 ,  H01B1/22 ,  H01L23/49883 ,  H05K3/321 ,  H01L2224/13009 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2203/0783 ,  H05K3/4614 ,  H05K3/4632

摘要： An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.

摘要翻译： 公开了一种包括热塑性聚合物，导电金属粉末和有机溶剂系统的导电浆料。 本发明还包括一种包含上述热塑性和金属的导电复合材料，其中基于复合材料的总体积，金属占体积的至少约30体积％。 复合材料由高温下的糊料形成。 该糊剂用于涉及将糊料转化为复合材料的工艺条件下的电气和电子部件电连接的工艺。

公开(公告)号：US5813870A

公开(公告)日：1998-09-29

申请号：US678852

申请日：1996-07-12

申请人： Michael Anthony Gaynes ,  Jaynal Abedin Molla ,  Steven Paul Ostrander ,  Judith Marie Roldan ,  George John Saxenmeyer ,  George Frederick Walker

发明人： Michael Anthony Gaynes ,  Jaynal Abedin Molla ,  Steven Paul Ostrander ,  Judith Marie Roldan ,  George John Saxenmeyer ,  George Frederick Walker

IPC分类号： H01L23/32 ,  H01L21/60 ,  H01L21/68 ,  H01R4/58

CPC分类号： H01L21/6835 ,  H01L2221/68345 ,  H01L2224/81101 ,  H01L2924/0002

摘要： Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a noble metal at a high current density.

摘要翻译： 电介质粘合膜，其图案化为导电细丝簇，其延伸穿过膜厚度以提供电互连和封装。 电介质粘合剂材料是可再加工的。 通过以高电流密度选择性地电镀贵金属来形成簇。

公开(公告)号：US06740959B2

公开(公告)日：2004-05-25

申请号：US09921062

申请日：2001-08-01

申请人： David James Alcoe ,  Jeffrey Thomas Coffin ,  Michael Anthony Gaynes ,  Harvey Charles Hamel ,  Mario J. Interrante ,  Brenda Lee Peterson ,  Megan J. Shannon ,  William Edward Sablinski ,  Christopher Todd Spring ,  Randall Joseph Stutzman ,  Renee L. Weisman ,  Jeffrey Allen Zitz

发明人： David James Alcoe ,  Jeffrey Thomas Coffin ,  Michael Anthony Gaynes ,  Harvey Charles Hamel ,  Mario J. Interrante ,  Brenda Lee Peterson ,  Megan J. Shannon ,  William Edward Sablinski ,  Christopher Todd Spring ,  Randall Joseph Stutzman ,  Renee L. Weisman ,  Jeffrey Allen Zitz

IPC分类号： H01L23552

CPC分类号： H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

摘要： Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

摘要翻译： 包括EMI屏蔽的电子封装，特别是包含嵌入其中具有接地带的半导体芯片 - 载体结构的半导体器件，其适于减少高速开关电子封装的输出和入射EMI发射。

公开(公告)号：US06670223B2

公开(公告)日：2003-12-30

申请号：US10285023

申请日：2002-10-31

申请人： Michael Anthony Gaynes ,  Eric Arthur Johnson

发明人： Michael Anthony Gaynes ,  Eric Arthur Johnson

IPC分类号： H01L2148

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially the filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

摘要翻译： 封装半导体芯片的引线键合封装，例如塑料球栅阵列（PBGA）封装，提供所谓的倒装芯片的安装。 芯片覆盖有网状材料的热扩散导热盖，其间隙填充有粘合剂，以防止由热膨胀系数中的错配引起的分层，导致导致整个封装布置的收缩 翘曲，导致密封剂和帽之间的分层，并导致连接接头和球栅阵列的故障。

公开(公告)号：US06492724B2

公开(公告)日：2002-12-10

申请号：US09798829

申请日：2001-03-02

申请人： Michael Anthony Gaynes ,  Mark Vincent Pierson ,  Aleksander Zubelewicz

发明人： Michael Anthony Gaynes ,  Mark Vincent Pierson ,  Aleksander Zubelewicz

IPC分类号： H01L2334

CPC分类号： H01L23/3135 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/00

摘要： A structure and methods for reinforcing a semiconductor device to prevent cracking is provided. The device may take the form of a semiconductor chip or a semiconductor chip package. When a semiconductor chip is provided, an adhesion layer is applied over its top surface, followed by the application of a reinforcing layer over the adhesion layer. When a semiconductor chip package is provided, the package first undergoes a cleaning process, followed by the application of an adhesion layer over its top surface and, lastly, the application of a reinforcing layer over the adhesion layer.

摘要翻译： 提供了用于加强半导体器件以防止开裂的结构和方法。 该器件可以采取半导体芯片或半导体芯片封装的形式。 当提供半导体芯片时，在其顶表面上施加粘合层，随后在粘合层上施加增强层。 当提供半导体芯片封装时，封装首先进行清洁处理，然后在其顶表面上施加粘合层，最后在粘合层上施加增强层。

公开(公告)号：US06403882B1

公开(公告)日：2002-06-11

申请号：US08884796

申请日：1997-06-30

申请人： William Tze-You Chen ,  Michael Anthony Gaynes ,  Eric Arthur Johnson ,  Tien Yue Wu

发明人： William Tze-You Chen ,  Michael Anthony Gaynes ,  Eric Arthur Johnson ,  Tien Yue Wu

IPC分类号： H01L2302

CPC分类号： H01L23/49816 ,  H01L23/16 ,  H01L23/36 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low Young's modulus of elasticity may be 10,000 psi or less; 1,000 psi or less; or, preferably, about 1,000 psi. Further, the adhesive may include a thermal conducting material. A protective plate is coupled to the inactive surface using the adhesive and a chip carrier is coupled to the active surface of the die.

摘要翻译： 芯片封装包括具有活性表面和非活性表面的模具。 在非活性表面上形成粘合剂，其中粘合剂具有低的杨氏弹性模量。 低杨氏弹性模量可以是10,000psi或更小; 1,000 psi以下; 或优选约1,000psi。 此外，粘合剂可以包括导热材料。 使用粘合剂将保护板耦合到非活性表面，并且芯片载体耦合到模具的有效表面。

公开(公告)号：US06326237B1

公开(公告)日：2001-12-04

申请号：US09325988

申请日：1999-06-04

申请人： Kenneth Raymond Carter ,  Craig Jon Hawker ,  James Lupton Hedrick ,  Robert Dennis Miller ,  Michael Anthony Gaynes ,  Stephen Leslie Buchwalter

发明人： Kenneth Raymond Carter ,  Craig Jon Hawker ,  James Lupton Hedrick ,  Robert Dennis Miller ,  Michael Anthony Gaynes ,  Stephen Leslie Buchwalter

IPC分类号： H01L2148

CPC分类号： H01L23/295 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15174 ,  Y10T29/49144 ,  Y10T29/49146

摘要： The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a hyperbranched polymer formed by the reaction of a monomer of the formula: (A)nRB, wherein A is a coupling group reactive with B, B is a coupling group reactive with A, n is greater than 1, and R is a group selected from the group consisting of an aromatic group, an aliphatic group, and mixtures thereof Also disclosed is a method of encapsulating a circuit assembly using the encapsulant of the invention.

摘要翻译： 本发明是一种包括芯片的封装电路组件; 底物; 至少一个焊点，其中所述焊点跨越所述芯片和所述衬底，在所述芯片和所述衬底之间形成导电连接; 以及邻近所述焊接接头形成的密封剂，其中所述密封剂包含通过下式的单体反应形成的超支化聚合物：（A）nRB，其中A是与B反应的偶联基团，B是与A反应的偶联基团 ，n大于1，R为选自芳族基团，脂族基团和其混合物的基团。还公开了一种使用本发明的密封剂封装电路组件的方法。

公开(公告)号：US06236115B1

公开(公告)日：2001-05-22

申请号：US09362859

申请日：1999-07-29

申请人： Michael Anthony Gaynes ,  Alan James Emerick ,  Viswanadham Puligandla ,  Charles Gerard Woychik ,  Jerzy Maria Zalesinski

发明人： Michael Anthony Gaynes ,  Alan James Emerick ,  Viswanadham Puligandla ,  Charles Gerard Woychik ,  Jerzy Maria Zalesinski

IPC分类号： H01L2348

CPC分类号： H01L23/481 ,  H01L25/0657 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00013 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/00

摘要： Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.

公开(公告)号：US6002177A

公开(公告)日：1999-12-14

申请号：US578922

申请日：1995-12-27

申请人： Michael Anthony Gaynes ,  Alan James Emerick ,  Viswanadham Puligandla ,  Charles Gerard Woychik ,  Jerzy Maria Zalesinski

发明人： Michael Anthony Gaynes ,  Alan James Emerick ,  Viswanadham Puligandla ,  Charles Gerard Woychik ,  Jerzy Maria Zalesinski

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L23/02

CPC分类号： H01L23/481 ,  H01L25/0657 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00013 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152

摘要： Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.

摘要翻译： 具有降低的导体长度和改善的抗噪声性的芯片堆叠通过激光钻孔单独的芯片，例如存储芯片，优选靠近但在其周围内，并且通过其形成导体，优选地通过金属化或填充导电浆料来形成，该导电浆料可以由 瞬态液相（TLP）工艺，并且优选地在导电焊盘的金属化期间或期间，或者可能包括堆叠中的至少一些芯片的两侧上的连接器图案。 堆叠中的至少一些芯片之后具有在其间形成的电气和机械连接，优选地使用与TLP工艺一致的电镀焊料预制件。 连接可以由围绕连接的一层弹性材料容纳，并且可以在现场形成。 由此获得的高密度电路封装可以通过表面贴装技术或诸如插头和插座装置的可分离连接器安装在载体上。 载体可以具有与芯片堆叠相同的材料以匹配热膨胀系数。 高密度电路封装也可以是类似于笔或作为导热模块的大致平面或棱柱形形式的可移除存储器模块的形式。