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公开(公告)号：US20140035935A1
公开(公告)日：2014-02-06
申请号：US13566925
申请日：2012-08-03
申请人： Ravindra V. Shenoy , Kwan-Yu Lai , Jon Bradley Lasiter , Jonghae Kim , Mario Francisco Velez , Chi Shun Lo , Donald William Kidwell , Philip Jason Stephanou , Justin Phelps Black , Evgeni Petrovich Gousev
发明人： Ravindra V. Shenoy , Kwan-Yu Lai , Jon Bradley Lasiter , Jonghae Kim , Mario Francisco Velez , Chi Shun Lo , Donald William Kidwell , Philip Jason Stephanou , Justin Phelps Black , Evgeni Petrovich Gousev
CPC分类号： H01L23/15 , H01L21/568 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/96 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/24195 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/12042 , H01L2924/12044 , H01L2924/1461 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , Y10T29/4902 , Y10T29/49117 , H01L2924/00 , H01L2924/00012
摘要： This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including embedded wafer level packages. The glass via bars can provide high density electrical interconnections in a package. In some implementations, the glass via bars can include integrated passive components. Methods of fabricating glass via bars are provided. In some implementations, the methods can include patterning and etching photo-patternable glass substrates. Packaging methods employing glass via bars are also provided.
摘要翻译： 本公开提供了可用于紧凑型三维封装（包括嵌入式晶片级封装）的玻璃通孔条的系统，方法和装置。 玻璃通孔棒可以在封装中提供高密度电连接。 在一些实施方案中，玻璃通孔棒可以包括集成的无源部件。 提供制造玻璃通孔条的方法。 在一些实施方案中，所述方法可以包括图案化和蚀刻可光图案化的玻璃基板。 还提供了采用玻璃通孔条的包装方法。
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公开(公告)号：US08970516B2
公开(公告)日：2015-03-03
申请号：US13235158
申请日：2011-09-16
申请人： Justin Phelps Black , Ravindra V. Shenoy , Evgeni Petrovich Gousev , Aristotele Hadjichristos , Thomas Andrew Myers , Jonghae Kim , Mario Francisco Velez , Je-Hsiung Jeffrey Lan , Chi Shun Lo
发明人： Justin Phelps Black , Ravindra V. Shenoy , Evgeni Petrovich Gousev , Aristotele Hadjichristos , Thomas Andrew Myers , Jonghae Kim , Mario Francisco Velez , Je-Hsiung Jeffrey Lan , Chi Shun Lo
CPC分类号： G02B26/001 , H01L21/565 , H01L23/3128 , H01L2224/16225 , H01L2924/09701 , H01L2924/12044 , H01L2924/1461 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.
摘要翻译： 本公开提供了用于组合沉积在第一衬底上的器件与形成在第二衬底（例如半导体衬底或玻璃衬底）上的集成电路的系统，方法和装置。 第一基板可以是玻璃基板。 第一衬底可以包括导电通孔。 功率组合器电路可以沉积在第一衬底的第一侧上。 功率组合器电路可以包括沉积在第一衬底的至少第一侧上的无源器件。 集成电路可以包括设置在功率合成器电路上并被配置为与功率组合器电路电连接的功率放大器电路，以形成功率放大系统。 导电通孔可以包括被配置为用于传导来自功率放大系统的热的热通孔和/或配置用于功率放大系统和第一衬底的第二侧上的导体之间的电连接的互连通孔。
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公开(公告)号：US20120075216A1
公开(公告)日：2012-03-29
申请号：US13235158
申请日：2011-09-16
申请人： Justin Phelps Black , Ravindra V. Shenoy , Evgeni Petrovich Gousev , Aristotele Hadjichristos , Thomas Andrew Myers , Jonghae Kim , Mario Francisco Velez , Je-Hsiung Jeffrey Lan , Chi Shun Lo
发明人： Justin Phelps Black , Ravindra V. Shenoy , Evgeni Petrovich Gousev , Aristotele Hadjichristos , Thomas Andrew Myers , Jonghae Kim , Mario Francisco Velez , Je-Hsiung Jeffrey Lan , Chi Shun Lo
CPC分类号： G02B26/001 , H01L21/565 , H01L23/3128 , H01L2224/16225 , H01L2924/09701 , H01L2924/12044 , H01L2924/1461 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.
摘要翻译： 本公开提供了用于组合沉积在第一衬底上的器件与形成在第二衬底（例如半导体衬底或玻璃衬底）上的集成电路的系统，方法和装置。 第一基板可以是玻璃基板。 第一衬底可以包括导电通孔。 功率组合器电路可以沉积在第一衬底的第一侧上。 功率组合器电路可以包括沉积在第一衬底的至少第一侧上的无源器件。 集成电路可以包括设置在功率合成器电路上并被配置为与功率组合器电路电连接的功率放大器电路，以形成功率放大系统。 导电通孔可以包括被配置为用于传导来自功率放大系统的热的热通孔和/或配置用于功率放大系统和第一衬底的第二侧上的导体之间的电连接的互连通孔。
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4.发明申请公开(公告)号：US20130181893A1
公开(公告)日：2013-07-18
申请号：US13449198
申请日：2012-04-17
CPC分类号： B81B3/0021 , B81B2201/033 , B81B2201/047 , G02B26/001 , G02B26/0841 , H02N1/008
摘要： This disclosure provides systems, methods and apparatus for glass electromechanical systems (EMS) electrostatic devices. In one aspect, a glass EMS electrostatic device includes sidewall electrodes. Structural components of a glass EMS electrostatic device such as stationary support structures, movable masses, coupling flexures, and sidewall electrode supports, can be formed from a single glass body. The glass body can be a photochemically etched. In some implementations, pairs of sidewall electrodes can be arranged in interdigitated comb or parallel plate configurations and can include plated metal layers and narrow capacitive gap spacing.
摘要翻译： 本公开提供了用于玻璃机电系统（EMS）静电装置的系统，方法和装置。 一方面，玻璃EMS静电装置包括侧壁电极。 可以由单个玻璃体形成诸如固定支撑结构，可移动质量块，耦合弯曲部和侧壁电极支架的玻璃EMS静电装置的结构部件。 玻璃体可以光化学蚀刻。 在一些实施方式中，侧壁电极对可以以叉指梳状或平行板结构布置，并且可以包括电镀金属层和窄电容间隙。
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公开(公告)号：US20130241939A1
公开(公告)日：2013-09-19
申请号：US13454949
申请日：2012-04-24
CPC分类号： H01L28/40 , H01G4/1209 , H01G4/33 , H01L23/642 , H01L28/60 , H01L2924/0002 , Y10T29/49124 , H01L2924/00
摘要： This disclosure provides systems, methods, and apparatus for high capacitance density metal-insulator-metal capacitors. In one aspect, an apparatus may include a first base metal layer on a first side of a substrate. A first polymer layer may be disposed on the first base metal layer and on the first side of the substrate. The first polymer layer may define a first plurality of vias though the first polymer layer, the first plurality of vias exposing portions of the first base metal layer. A first electrode layer may be disposed on the first polymer layer. The first electrode layer may contact the portions of the first base metal layer. A first dielectric layer may be disposed on the first electrode layer. A second electrode layer may be disposed on the first dielectric layer. The first dielectric layer may electrically isolate the first electrode layer from the second electrode layer.
摘要翻译： 本公开提供了用于高电容密度金属 - 绝缘体 - 金属电容器的系统，方法和装置。 在一个方面，设备可以包括在基板的第一侧上的第一基底金属层。 第一聚合物层可以设置在第一基底金属层上和衬底的第一侧上。 第一聚合物层可以通过第一聚合物层限定第一多个通孔，第一多个通孔暴露第一基底金属层的部分。 第一电极层可以设置在第一聚合物层上。 第一电极层可以接触第一基底金属层的部分。 第一电介质层可以设置在第一电极层上。 第二电极层可以设置在第一电介质层上。 第一电介质层可以将第一电极层与第二电极层电隔离。
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公开(公告)号：US20140035702A1
公开(公告)日：2014-02-06
申请号：US13563252
申请日：2012-07-31
申请人： Justin Phelps Black , Philip Jason Stephanou , Jonghae Kim , Je-Hsiung Jeffrey Lan , Sang-June Park , Changhan Hobie Yun , Chi Shun Lo , Chengjie Zuo
发明人： Justin Phelps Black , Philip Jason Stephanou , Jonghae Kim , Je-Hsiung Jeffrey Lan , Sang-June Park , Changhan Hobie Yun , Chi Shun Lo , Chengjie Zuo
CPC分类号： H03H7/075 , H03H9/465 , H03H2007/006
摘要： This disclosure provides implementations of filters and filter topologies, circuits, structures, devices, apparatus, systems, and related processes. In one aspect, a device includes one or more LC resonant circuit stages. In some implementations, each LC stage includes an inductor and a capacitor. Each LC stage also has a corresponding resonant frequency. The one or more LC stages are arranged to produce an unmodified passband over a range of frequencies having a corresponding bandwidth. One or more microelectromechanical systems (MEMS) resonators are arranged with the one or more LC stages. The one or more MEMS resonators are arranged with the one or more LC stages so as to modify characteristics of the unmodified passband such that the hybrid filter produces a modified passband having a modified bandwidth and one or more other modified band characteristics.
摘要翻译： 本公开提供了滤波器和滤波器拓扑，电路，结构，设备，装置，系统和相关过程的实现。 在一个方面，器件包括一个或多个LC谐振电路级。 在一些实现中，每个LC级包括电感器和电容器。 每个LC级还具有相应的谐振频率。 一个或多个LC级布置成在具有相应带宽的频率范围上产生未修改的通带。 一个或多个微机电系统（MEMS）谐振器与一个或多个LC级布置。 一个或多个MEMS谐振器被布置成具有一个或多个LC级，以便修改未修改的通带的特性，使得混合滤波器产生具有修改的带宽和一个或多个其它修改的频带特性的修改的通带。
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公开(公告)号：US20130293337A1
公开(公告)日：2013-11-07
申请号：US13463583
申请日：2012-05-03
申请人： Chi Shun Lo , Wesley Nathaniel Allen , Jonghae Kim , Je-Hsiung Jeffrey Lan , Ravindra V. Shenoy , Justin Phelps Black , Chengjie Zuo , Changhan Hobie Yun
发明人： Chi Shun Lo , Wesley Nathaniel Allen , Jonghae Kim , Je-Hsiung Jeffrey Lan , Ravindra V. Shenoy , Justin Phelps Black , Chengjie Zuo , Changhan Hobie Yun
CPC分类号： H01F5/003 , H01F41/041 , Y10T29/4902
摘要： This disclosure provides systems, methods, and apparatus related to inductors. In one aspect, a planar inductor may include a substrate with a spacer in the shape of a planar spiral coil on a surface of the substrate. Disposed on the spacer may be a line of metal formed as a planar inductor in the shape of the planar spiral coil. The spacer may be between the line of metal and the surface of the substrate. The spacer may elevate the line of metal above the surface of the substrate.
摘要翻译： 本公开提供了与电感器相关的系统，方法和装置。 一方面，平面电感器可以包括在衬底的表面上具有平面螺旋线圈形状的间隔物的衬底。 设置在间隔件上的金属线可以是形成为平面螺旋线圈形状的平面电感器的金属线。 间隔物可以在金属线和基底的表面之间。 间隔物可以将衬底上的金属线提升。
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8.发明申请GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开作为基板材料的玻璃和用于MEMS和IC器件的最终封装公开(公告)号：US20130050227A1
公开(公告)日：2013-02-28
申请号：US13221701
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
CPC分类号： H01L23/10 , B81B7/007 , B81B2201/047 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C2203/0118 , B81C2203/0792 , H01L23/053 , H01L23/055 , H01L23/057 , H01L23/08 , H01L23/15 , H01L23/49827 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.
摘要翻译： 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。 覆盖玻璃可以用诸如环氧树脂或金属粘结环的粘合剂结合到玻璃基板上。 玻璃包装还可以包括在一个或多个装置和包装外部之间的一个或多个信号传输路径。 在一些实施方案中，包括EMS和/或IC器件的玻璃封装被配置为通过表面贴装技术直接附接到印刷电路板（PCB）或其它集成基板。
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9.发明申请GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开作为基板材料的玻璃和用于MEMS和IC器件的最终封装公开(公告)号：US20130050228A1
公开(公告)日：2013-02-28
申请号：US13221717
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
CPC分类号： H01L23/053 , B81B2201/047 , B81C1/0023 , H01L23/055 , H01L23/057 , H01L23/08 , H01L23/10 , H01L23/15 , H01L23/49827 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L27/14609 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.
摘要翻译： 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，制造玻璃封装包括将盖玻璃面板接合到玻璃基板面板，以及将接合的面板分开以形成各自包括一个或多个封装装置和一个或多个信号传输路径的单独的玻璃封装。 在另一方面，玻璃包装可以包括玻璃基板，玻璃盖和一个或多个封装在玻璃基板和盖玻璃之间的装置。
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10.发明申请GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES 审中-公开作为基板材料的玻璃和用于MEMS和IC器件的最终封装公开(公告)号：US20130050155A1
公开(公告)日：2013-02-28
申请号：US13221744
申请日：2011-08-30
申请人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
发明人： Kurt Edward Petersen , Ravindra V. Shenoy , Justin Phelps Black , David William Burns , Srinivasan Kodaganallur Ganapathi , Philip Jason Stephanou , Nicholas Ian Buchan
CPC分类号： B81B7/0067 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C2203/0109 , H01L2224/16 , H01L2224/48091 , H01L2224/73204 , H01L2924/12044 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , Y10T29/5313 , H01L2924/00014 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.
摘要翻译： 本公开提供了用于集成电路（IC）和机电系统（EMS）装置的玻璃封装的系统，方法和装置。 在一个方面，玻璃包装可以包括玻璃基板，玻璃盖，一个或多个封装在玻璃基板和盖玻璃之间的装置，以及被配置成连接到柔性连接器并与封装装置电连通的接合垫。 在一些实施方案中，柔性连接器可以用于将玻璃封装内的器件电连接到玻璃封装外部的诸如集成电路（IC）器件或PCB之类的电气元件。
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