公开(公告)号：US20060226019A1

公开(公告)日：2006-10-12

申请号：US11399762

申请日：2006-04-07

申请人： Raymon Thompson ,  Paul McHugh ,  Daniel Woodruff ,  Gregory Wilson ,  Steve Eudy ,  Rajesh Baskaran

发明人： Raymon Thompson ,  Paul McHugh ,  Daniel Woodruff ,  Gregory Wilson ,  Steve Eudy ,  Rajesh Baskaran

IPC分类号： C25D7/12

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/005 ,  C25D17/06 ,  H01L21/2885 ,  H01L21/76873 ,  H01L21/76877

摘要： The present invention provides a semiconductor workpiece support and contact assembly for providing localized electrical connections with the device side of the workpiece. The additional contact points help overcome the terminal effect caused by very high sheet resistance of thin barrier layers and enable plating a conformal seed layer or feature filling directly on thin barrier layers. By utilizing the streets that separate individual dice on a workpiece to make electrical connections with the workpiece and provide localized distribution of plating chemistry, the present invention provides a more uniform and conformal metallization layer.

摘要翻译： 本发明提供一种用于提供与工件的装置侧的局部电连接的半导体工件支撑和接触组件。 额外的接触点有助于克服由薄阻挡层的非常高的薄层电阻引起的终端效应，并且能够将保形种子层或特征直接填充在薄的阻挡层上。 通过利用在工件上分离单个骰子以与工件电连接并且提供电镀化学物质的局部分布的街道，本发明提供了更均匀和保形的金属化层。

公开(公告)号：US20060037855A1

公开(公告)日：2006-02-23

申请号：US11111672

申请日：2005-04-20

申请人： Kyle Hanson ,  Steve Eudy ,  Thomas Ritzdorf ,  Gregory Wilson ,  Daniel Woodruff ,  Randy Harris ,  Curtis Weber ,  Tim McGlenn ,  Timothy Anderson ,  Daniel Bexten

发明人： Kyle Hanson ,  Steve Eudy ,  Thomas Ritzdorf ,  Gregory Wilson ,  Daniel Woodruff ,  Randy Harris ,  Curtis Weber ,  Tim McGlenn ,  Timothy Anderson ,  Daniel Bexten

IPC分类号： C25D17/00

CPC分类号： C25D21/12 ,  C23C18/1632 ,  C25D7/123 ,  C25D17/001 ,  C25D17/008 ,  H01L21/67005 ,  H01L21/6723

摘要： Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward reaction vessels for electrochemical processing of microelectronic workpieces, processing stations including such reaction vessels, and methods for using these devices. For example, one embodiment of a reaction vessel includes an outer container having an outer wall, a first outlet configured to introduce a primary fluid flow into the outer container, and at least one second outlet configured to introduce a secondary fluid flow into the outer container separate from the primary fluid flow. The reaction vessel can also include at least one electrode, and it can also have a field shaping unit. The field shaping unit, for example, can be a dielectric assembly coupled to the second outlet to receive the secondary flow and configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container. The field shaping unit can also have at least one electrode compartment through which the secondary flow can pass separately from the primary flow. The electrode is positioned in the electrode compartment.

公开(公告)号：US20050107971A1

公开(公告)日：2005-05-19

申请号：US10685306

申请日：2003-10-14

申请人： Thomas Ritzdorf ,  Steve Eudy ,  Gregory Wilson ,  Paul McHugh

发明人： Thomas Ritzdorf ,  Steve Eudy ,  Gregory Wilson ,  Paul McHugh

IPC分类号： H01L21/00 ,  G06F19/00

CPC分类号： H01L21/67173 ,  H01L21/67103 ,  H01L21/67207 ,  H01L21/67219 ,  H01L21/67253 ,  H01L21/67276

摘要： A processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. The control can modify a process recipe or a process sequence of the processing apparatus based on a feed forward or a feed back signal from the metrology unit. A seed layer deposition tool, a process layer electrochemical deposition tool, and a chemical mechanical polishing tool, arranged for sequential processing of a workpiece, can be controlled as an integrated system using one or more metrology units. A metrology unit can be located at each tool to measure workpiece parameters. Each of the metrology units can be used as a feed forward control and/or a feed back control at each of the tools.

摘要翻译： 用于处理微电子工件的处理装置包括测量单元和与计量单元信号连接的控制。 该控制可以基于来自计量单元的前馈或反馈信号来修改处理设备的处理配方或处理顺序。 布置用于对工件进行连续加工的种子层沉积工具，工艺层电化学沉积工具和化学机械抛光工具可被控制为使用一个或多个计量单元的集成系统。 每个工具都可以设置一个测量单元来测量工件参数。 每个计量单元可用作每个工具的前馈控制和/或反馈控制。

公开(公告)号：US20070261964A1

公开(公告)日：2007-11-15

申请号：US11432164

申请日：2006-05-10

申请人： Gregory Wilson ,  Paul McHugh ,  Kyle Hanson ,  Rajesh Baskaran

发明人： Gregory Wilson ,  Paul McHugh ,  Kyle Hanson ,  Rajesh Baskaran

IPC分类号： C25D5/20 ,  C25B9/00

CPC分类号： C25D5/08 ,  C25D17/002

摘要： Reactors, systems and methods for electroplating and/or electro-etching microfeature workpieces. Reactors in accordance with the invention have a first chamber configured to direct a first processing solution to a processing zone, a second chamber configured to contain a second processing solution different than the first processing solution, and an ion exchange membrane between the first chamber and the second chamber. The reactors also include (a) a support member in the first chamber that contacts the ion exchange membrane across the surface of the membrane, and (b) a counter electrode in the second chamber. The ion exchange membrane enables a low conductivity catholyte to be used in the first chamber and an inert counter electrode in the second chamber. More specifically, the ion exchange membrane prevents nascent oxygen that evolves from the inert counter electrode from reaching the catholyte to reduce oxidation of constituents of the catholyte, consumption of organic additives in the anolyte, and/or accumulation of bubbles and particulates at the workpiece.

摘要翻译： 用于电镀和/或电蚀蚀微型工件的反应器，系统和方法。 根据本发明的反应器具有被配置为将第一处理溶液引导到处理区的第一室，被配置为容纳不同于第一处理溶液的第二处理溶液的第二室以及第一室与第一室之间的离子交换膜 第二室。 反应器还包括（a）在第一室中的与膜的表面接触离子交换膜的支撑构件，和（b）第二室中的对电极。 离子交换膜使得能够在第一室中使用低导电性阴极电解液，并且在第二室中使用惰性对电极。 更具体地，离子交换膜防止从惰性对电极逸出的新生氧气到达阴极电解液，以减少阴极电解液的组分的氧化，阳极电解液中的有机添加剂的消耗和/或工件上的气泡和微粒的积聚。

公开(公告)号：US20080011450A1

公开(公告)日：2008-01-17

申请号：US11776952

申请日：2007-07-12

申请人： Kyle Hanson ,  Robert Batz ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory Wilson ,  Paul McHugh

发明人： Kyle Hanson ,  Robert Batz ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory Wilson ,  Paul McHugh

IPC分类号： B05B1/00 ,  F17D3/00

CPC分类号： H01L21/6723 ,  C23C18/1676 ,  H01L21/67109 ,  Y10T137/0318

摘要： Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater. The interaction between the microelectronic workpiece and the processing liquid can be further controlled by controlling the rate at which the microelectronic workpiece rotates and/or the manner in which the microelectronic workpiece is introduced to and/or withdrawn from the processing liquid.

摘要翻译： 用液体对微电子工件进行热处理的装置和方法。 根据本发明的实施例的装置包括配置成承载诸如无电处理液体的处理液体的处理容器。 容器具有用于将热量传递到和/或内部的处理液体的热传递壁。 传热装置，例如容纳从处理容器溢出的处理液体的储存器，将热量传递到处理容器内或从处理容器内的处理液体。 传热装置还可以将热量传递到内部或外部热源，例如承载传热流体的导管或电阻加热器。 通过控制微电子工件旋转的速度和/或微电子工件被引入和/或从处理液中取出的方式，可以进一步控制微电子工件和处理液之间的相互作用。

公开(公告)号：US20070151844A1

公开(公告)日：2007-07-05

申请号：US11603940

申请日：2006-11-22

申请人： Gregory Wilson ,  Paul McHugh ,  Daniel Woodruff

发明人： Gregory Wilson ,  Paul McHugh ,  Daniel Woodruff

IPC分类号： C25B9/04

CPC分类号： C25D17/00 ,  C25D5/08 ,  C25D5/18 ,  C25D17/001 ,  C25D17/08 ,  C25D17/10

摘要： Reactors with agitators and methods for processing microfeature workpieces with such reactors. The agitators are capable of obtaining high, controlled mass-transfer rates that result in high quality surfaces and efficient wet chemical processes. The agitators generate high flow velocities in the fluid and contain the high energy fluid proximate to the surface of the workpiece to form high quality surfaces when cleaning, etching and/or depositing materials to/from a workpiece. The agitators also have short stroke lengths so that the footprints of the reactors are relatively small. As a result, the reactors are efficient and cost effective to operate. The agitators are also designed so that electrical fields in the processing solution can effectively operate at the surface of the workpiece.

摘要翻译： 具有搅拌器的反应器和用这种反应器处理微型工件的方法。 搅拌器能够获得高质量的质量传递速率，从而产生高品质的表面和有效的湿化学工艺。 搅拌器在流体中产生高流速并且在工件表面附近容纳高能量流体，以便当清洁，蚀刻和/或从工件沉积材料时形成高质量的表面。 搅拌器还具有短行程长度，使得反应器的足迹相对较小。 因此，反应堆的运行效率高，成本低。 搅拌器也被设计成使得处理溶液中的电场能够在工件的表面上有效地操作。

公开(公告)号：US20050006241A1

公开(公告)日：2005-01-13

申请号：US10734098

申请日：2003-12-11

申请人： Paul McHugh ,  Gregory Wilson ,  Daniel Woodruff ,  Nolan Zimmerman ,  James Erickson

发明人： Paul McHugh ,  Gregory Wilson ,  Daniel Woodruff ,  Nolan Zimmerman ,  James Erickson

IPC分类号： C25D5/00

CPC分类号： C25D5/006 ,  C25D5/08 ,  C25D17/001 ,  C25D17/008 ,  C25D17/10 ,  C25D17/12 ,  C25D21/10 ,  C25D21/12 ,  H01L21/6723

摘要： Paddles and enclosures for processing microfeature workpieces are disclosed. A paddle device having multiple paddles is positioned in an enclosure to reciprocate back and forth along a generally linear path. The clearances between the paddles, the workpiece and the walls of the chamber are relatively small to increase the flow agitation at the surface of the workpiece and enhance the mass transfer process occurring there. The paddles are shaped to reduce or eliminate electrical shadowing effects created at the surface of the workpiece during electrochemical processing. Paddles on the same paddle device may have different shapes to reduce the likelihood for creating three-dimensional effects in the flow field proximate to the surface of the workpiece. The reciprocation stroke of the paddles may shift to further reduce shadowing.

摘要翻译： 公开了用于处理微特征工件的鞍座和外壳。 具有多个桨叶的桨装置定位在外壳中，沿着大致线性的路径往复运动。 桨叶，工件和室壁之间的间隙相对较小，以增加工件表面的流动搅拌并增强在那里发生的传质过程。 桨叶的形状可减少或消除在电化学处理期间在工件表面产生的电阴影效应。 相同桨装置上的桨叶可以具有不同的形状，以减少在靠近工件表面的流场中产生三维效应的可能性。 桨叶的往复行程可能会转移以进一步减少阴影。

公开(公告)号：US20050000817A1

公开(公告)日：2005-01-06

申请号：US10734100

申请日：2003-12-11

申请人： Paul McHugh ,  Gregory Wilson ,  Daniel Woodruff ,  Nolan Zimmerman ,  James Erickson

发明人： Paul McHugh ,  Gregory Wilson ,  Daniel Woodruff ,  Nolan Zimmerman ,  James Erickson

IPC分类号： C25D5/00

CPC分类号： C25D5/006 ,  C25D5/08 ,  C25D17/001 ,  C25D17/008 ,  C25D17/10 ,  C25D17/12 ,  C25D21/10 ,  C25D21/12 ,  H01L21/6723

摘要： Reactors having multiple electrodes and/or enclosed reciprocating paddles are disclosed. The reactor can include multiple electrodes spaced apart from a process location to provide virtual electrodes proximate to the process location for transferring material to or from the workpiece. A magnet may be positioned proximate to the process plane to orient magnetically sensitive material deposited on the workpiece. The electrodes may be removable from the reactor without passing them through the magnet to reduce interference between the electrodes and the magnet. The workpiece may be carried by a rotatable workpiece support to orient the workpiece for processing. At least one of the electrodes can operate as a current thief to reduce terminal effects at the periphery of the workpiece. An electric field control element positioned between the electrodes and the workpiece circumferentially varies the effect of the thieving electrode current to account for effects created by elongated paddles as they oscillate proximate to the workpiece.

摘要翻译： 公开了具有多个电极和/或封闭的往复式叶片的反应器。 反应器可以包括与处理位置间隔开的多个电极，以提供靠近处理位置的虚拟电极，用于将材料转移到工件或从工件传送材料。 可以将磁体定位成靠近处理平面以定向沉积在工件上的感应敏感材料。 电极可以从反应器中移除，而不会使它们通过磁体，以减少电极和磁体之间的干扰。 工件可以由可旋转的工件支撑件承载以使工件定向以进行加工。 电极中的至少一个可以作为电流窃贼工作，以减少在工件周边处的终端效应。 定位在电极和工件之间的电场控制元件周向地改变了窃电电极电流的影响，以解决细长桨叶在靠近工件振荡时产生的效应。

公开(公告)号：US20050045474A1

公开(公告)日：2005-03-03

申请号：US10497670

申请日：2002-12-05

申请人： Nolan Zimmerman ,  Gregory Wilson ,  Steve Eudy

发明人： Nolan Zimmerman ,  Gregory Wilson ,  Steve Eudy

IPC分类号： C25D7/12 ,  C25D17/06

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/06

摘要： Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the work-piece and a plurality of contacts (420). The individual contacts (420) include a conductor (440) and a cover (430). The conductor (440) can comprise a proximal section (435) projecting inwardly into the opening (414) relative to the support member (410), a distal section (436) extending from the proximal section (435), and an inert exterior (444) at least at the distal section (436). The cover (430) comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

摘要翻译： 微电子工件电化学处理接触组件。 接触组件（400）可以包括支撑构件（410），该支撑构件包括内壁（412），内壁限定了构造成容纳工件的多个触点（420）的开口（414）。 各个触点（420）包括导体（440）和盖（430）。 导体（440）可以包括相对于支撑构件（410）向内伸入开口（414）的近端部分（435），从近侧部分（435）延伸的远端部分（436）和惰性外部 444），至少在远端部分（436）。 盖（430）包括覆盖导体的至少近端部分但不覆盖芯的远端部分的至少一部分的电介质元件。 因此，芯的远端部分的暴露部分限定了用于接触工件上的导电层（例如种子层）的导电接触部位。

公开(公告)号：US20080217167A9

公开(公告)日：2008-09-11

申请号：US11096630

申请日：2005-03-29

申请人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

发明人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

IPC分类号： C25C7/00

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67103 ,  H01L21/6723

摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

摘要翻译： 用于反应容器中微电子工件的电化学处理的装置和方法。 在一个实施例中，反应容器包括：具有外壁的外容器; 分配器，其耦合到所述外部容器，所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流，所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分，以及 所述场成形单元具有至少一个电极室，所述二次流可以通过所述至少一个电极室，而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件，所述界面构件与所述电极室中的所述次流体流体连通，并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流 流。