摘要:
The present invention presents a method for fabricating coil elements for magnetic write heads. A coil pattern is formed on a substrate using photolithographic techniques. The substrate is etched using reactive ion etching, creating a coil-shaped trench in the substrate. Thin film seed layers are deposited using ion beam deposition. The substrate is electroplated with metal filling the trenches with metal. The substrate is chemical mechanical polished to remove excess metal and planarize the air bearing surface of the write head.
摘要:
The present invention provides a reactor for preparing thin films of compound semiconductors for photovoltaic devices. The reactor includes a chamber that has a bottom surface that, in some locations, has protrusions that contact the bottom surface of the substrate having the compound semiconductor to provide uniform heating and cooling of the substrate. Interior walls of the chamber can also be lined with high thermal conductivity portions and low thermal conductivity portions interposed between high thermal conductivity portions.
摘要:
Described are roll-to-roll or reel-to-reel thermal or rapid thermal processing tools (reactors) are used to react a precursor layer on a continuous flexible workpiece. Variants of the reactors are described, including a reactor having multiple exhaust outlets connected to a process gap of the reactor between an entrance opening and an exit opening of the process gap; a reactor including multiple gas inlets and exhaust outlets connected to a process gap of the reactor between an entrance opening and an exit opening of the process gap; a reactor including multiple gas inlets and exhaust outlets connected to a process gap of the reactor between an entrance opening and an exit opening of the process gap; and a reactor including multiple gas inlets and exhaust outlets connected to a process gap of the reactor between an entrance opening and an exit opening of the process gap. Also described is an exhaust system that separates the Group VIA material vapors from other gaseous species for re-cycling or easy disposal and techniques and apparatus for efficient removal of moisture from the workpiece before processing precursor layer in the RTP tool.
摘要:
An apparatus having improved hard bias properties of layers of a magnetoresistance sensor is disclosed. Properties of the hard bias layer are improved using a seedlayer structure that includes at least a layer of silicon and a layer comprising chromium or chromium molybdenum. Further, benefits are achieved when the seedlayer structure includes a layer of tantalum.
摘要:
A system and method of manufacturing solar panels whereby parameters about how each cell, each array and each panel are recorded in a database or electronic memory. The cells, arrays and panels are also provided an identification, such as a bar code, to allow for subsequent retrieval of the parameters. The electronic memory is arranged so that different cells, arrays and panels that share the same parameters can be identified.
摘要:
An electrical connection structure suitable for use in a magnetic head and disk drive, as well as a method of making the same, are disclosed. An electrically conductive etch stop layer is formed over a first electrically conductive layer. An electrically conductive diffusion barrier layer is then formed over the electrically conductive etch stop layer, followed by the formation of an insulator layer over the electrically conductive diffusion barrier layer. Next, a patterned photoresist is formed over left and right regions of the insulator layer so as to expose a central region of the insulator layer. Utilizing an etching process with the patterned photoresist in place, insulator materials of the insulator layer in the central region are removed to form a via which exposes electrically conductive materials in the central region. Finally, a second electrically conductive layer is formed within the via over the electrically conductive materials in the central region. Advantageously, the electrically conductive diffusion barrier layer reduces or eliminates oxidation of a top surface of the electrically conducting etch stop layer during the formation of the electrical connection.
摘要:
A method for improving hard bias properties of layers of a magnetoresistance sensor is disclosed. Properties of the hard bias layer are improved using a seedlayer structure that includes at least a first layer of silicon and a second layer comprising chromium or chromium molybdenum. Further, benefits are achieved when the seedlayer structure includes a layer of tantalum.
摘要:
A method for fabricating a magnetic head with a trapezoidal shaped pole piece tip is described. The body of the main pole piece is deposited, then one or more layers for the pole piece tip are deposited. A bed material is deposited over the pole piece tip material. A void is formed in the bed material over the area for the pole piece tip. The void is filled with an ion-milling resistant material such as alumina preferably using atomic layer deposition or atomic layer chemical vapor deposition. The excess ion-milling resistant material and the bed material are removed. The result is an ion-milling mask formed over the area for the pole piece tip. Ion milling is then used to remove the unmasked material in the pole piece tip layer and to form a beveled pole piece tip and preferably a beveled face on the main pole piece.
摘要:
A method of fabricating a magnetic write head, in accordance with one embodiment, includes forming a beveled write pole. A conformal spacer may be formed upon a portion of a flare length proximate a tip of the write pole. A shield layer may also be formed upon the conformal spacer adjacent the flare length proximate the tip of the write pole.
摘要:
A method for fabricating magnetic side shields for an MR sensor of a magnetic head. Following the deposition of MR sensor layers, a first DLC layer is deposited. Milling mask layers are then deposited, and outer portions of the milling mask layers are removed such that a remaining central portion of the milling mask layers is formed having straight sidewalls and no undercuts. Outer portions of the sensor layers are then removed such that a relatively thick remaining central portion of the milling mask resides above the remaining sensor layers. A thin electrical insulation layer is deposited, followed by the deposition of magnetic side shields. A second DLC layer is deposited and the remaining mask layers are then removed utilizing a chemical mechanical polishing (CMP) liftoff step. Thereafter, the first DLC layer and the second DLC layer are removed and a second magnetic shield layer is then fabricated thereabove.