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公开(公告)号：US08735184B2
公开(公告)日：2014-05-27
申请号：US13341175
申请日：2011-12-30
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.
摘要翻译： 一种器件包括具有表面的半导体管芯，靠近表面的多个接近连接器，以及耦合到多个接近连接器中的至少一个的电路。 半导体管芯被配置为通过使用多个接近连接器中的一个或多个的电容耦合来传送电压模式信号。 电路还包括具有电容求和结的滤波器以均衡信号。
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公开(公告)号：US20070268125A1
公开(公告)日：2007-11-22
申请号：US11437457
申请日：2006-05-18
IPC分类号： G08B1/08
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.
摘要翻译： 一种器件包括具有表面的半导体管芯，靠近表面的多个接近连接器，以及耦合到多个接近连接器中的至少一个的电路。 半导体管芯被配置为通过使用多个接近连接器中的一个或多个的电容耦合来传送电压模式信号。 电路还包括具有电容求和结的滤波器以均衡信号。
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公开(公告)号：US08130821B2
公开(公告)日：2012-03-06
申请号：US11437287
申请日：2006-05-18
IPC分类号： H04B3/46
CPC分类号： H04L25/03878 , H01L2224/48137 , H01L2224/49175 , H01L2924/00014 , H01L2924/13091 , H01L2924/30107 , H04L25/0266 , H01L2924/00 , H01L2224/45099
摘要： An integrated circuit containing a communication channel is described. This communication channel includes a transmit circuit configured to transmit signals using a voltage-mode driver, a receive circuit, and a capacitive link that couples the transmit circuit to the receive circuit. The communication channel includes a filter with a capacitive-summing junction to equalize signals communicated between the transmit circuit and the receive circuit.
摘要翻译： 描述包含通信信道的集成电路。 该通信信道包括被配置为使用将发送电路耦合到接收电路的电压模式驱动器，接收电路和电容链路来发送信号的发送电路。 通信信道包括具有电容求和结点的滤波器，以平衡发送电路和接收电路之间传送的信号。
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公开(公告)号：US20070268047A1
公开(公告)日：2007-11-22
申请号：US11437287
申请日：2006-05-18
IPC分类号： H03K3/00
CPC分类号： H04L25/03878 , H01L2224/48137 , H01L2224/49175 , H01L2924/00014 , H01L2924/13091 , H01L2924/30107 , H04L25/0266 , H01L2924/00 , H01L2224/45099
摘要： An integrated circuit containing a communication channel is described. This communication channel includes a transmit circuit configured to transmit signals using a voltage-mode driver, a receive circuit, and a capacitive link that couples the transmit circuit to the receive circuit. The communication channel includes a filter with a capacitive-summing junction to equalize signals communicated between the transmit circuit and the receive circuit.
摘要翻译： 描述包含通信信道的集成电路。 该通信信道包括被配置为使用将发送电路耦合到接收电路的电压模式驱动器，接收电路和电容链路来发送信号的发送电路。 通信信道包括具有电容求和结点的滤波器，以平衡发送电路和接收电路之间传送的信号。
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公开(公告)号：US20120114032A1
公开(公告)日：2012-05-10
申请号：US13341175
申请日：2011-12-30
IPC分类号： H04L27/01
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.
摘要翻译： 一种器件包括具有表面的半导体管芯，靠近表面的多个接近连接器，以及耦合到多个接近连接器中的至少一个的电路。 半导体管芯被配置为通过使用多个接近连接器中的一个或多个的电容耦合来传送电压模式信号。 电路还包括具有电容求和结的滤波器以均衡信号。
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公开(公告)号：US08102020B2
公开(公告)日：2012-01-24
申请号：US11437457
申请日：2006-05-18
IPC分类号： H01L21/02
CPC分类号： H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： A device includes a semiconductor die having a surface, a plurality of proximity connectors proximate to the surface, and a circuit coupled to at least one of the plurality of proximity connectors. The semiconductor die is configured to communicate voltage-mode signals through capacitive coupling using one or more of the plurality of proximity connectors. The circuit also includes a filter with a capacitive-summing junction to equalize the signals.
摘要翻译： 一种器件包括具有表面的半导体管芯，靠近表面的多个接近连接器，以及耦合到多个接近连接器中的至少一个的电路。 半导体管芯被配置为通过使用多个接近连接器中的一个或多个的电容耦合来传送电压模式信号。 电路还包括具有电容求和结的滤波器以均衡信号。
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公开(公告)号：US08918752B2
公开(公告)日：2014-12-23
申请号：US13326301
申请日：2011-12-14
申请人： Alex Chow , Robert J. Drost , Ronald Ho , Robert D. Hopkins , Ivan E. Sutherland
发明人： Alex Chow , Robert J. Drost , Ronald Ho , Robert D. Hopkins , Ivan E. Sutherland
IPC分类号： G06F17/50
CPC分类号： H01L23/585 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/72 , H01L25/0657 , H01L2224/13021 , H01L2224/131 , H01L2224/16145 , H01L2224/16147 , H01L2224/292 , H01L2224/293 , H01L2224/32145 , H01L2224/83851 , H01L2225/06531 , H01L2225/06593 , H01L2924/014 , H01L2924/00014
摘要： A semiconductor die is described. This semiconductor die includes a driver, and a spatial alignment transducer that is electrically coupled to the driver and which is proximate to a surface of the semiconductor die. The driver establishes a spatially varying electric charge distribution in at least one direction in the spatial alignment transducer, thereby facilitating determination of a spatial alignment in more than one direction between the semiconductor die and another semiconductor die. In particular, a spatial alignment sensor proximate to the surface of the other semiconductor die may detect an electrical field (or an associated electrostatic potential) associated with the spatially varying electric charge distribution. This detected electric field may allow the vertical spacing between the surfaces of the semiconductor dies and/or an angular alignment of the semiconductor dies to be determined.
摘要翻译： 描述半导体管芯。 该半导体管芯包括驱动器和电耦合到驱动器并且靠近半导体管芯的表面的空间对准换能器。 驱动器在空间对准转换器中在至少一个方向上建立空间变化的电荷分布，从而有助于确定半导体管芯和另一个半导体管芯之间的多于一个方向上的空间对准。 特别地，靠近另一个半导体管芯的表面的空间对准传感器可以检测与空间变化的电荷分布相关联的电场（或相关的静电电位）。 该检测的电场可以允许确定半导体管芯的表面之间的垂直间隔和/或半导体管芯的角度对准。
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公开(公告)号：US20130154608A1
公开(公告)日：2013-06-20
申请号：US13326301
申请日：2011-12-14
申请人： Alex Chow , Robert J. Drost , Ronald Ho , Robert D. Hopkins , Ivan E. Sutherland
发明人： Alex Chow , Robert J. Drost , Ronald Ho , Robert D. Hopkins , Ivan E. Sutherland
CPC分类号： H01L23/585 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/72 , H01L25/0657 , H01L2224/13021 , H01L2224/131 , H01L2224/16145 , H01L2224/16147 , H01L2224/292 , H01L2224/293 , H01L2224/32145 , H01L2224/83851 , H01L2225/06531 , H01L2225/06593 , H01L2924/014 , H01L2924/00014
摘要： A semiconductor die is described. This semiconductor die includes a driver, and a spatial alignment transducer that is electrically coupled to the driver and which is proximate to a surface of the semiconductor die. The driver establishes a spatially varying electric charge distribution in at least one direction in the spatial alignment transducer, thereby facilitating determination of a spatial alignment in more than one direction between the semiconductor die and another semiconductor die. In particular, a spatial alignment sensor proximate to the surface of the other semiconductor die may detect an electrical field (or an associated electrostatic potential) associated with the spatially varying electric charge distribution. This detected electric field may allow the vertical spacing between the surfaces of the semiconductor dies and/or an angular alignment of the semiconductor dies to be determined.
摘要翻译： 描述半导体管芯。 该半导体管芯包括驱动器和电耦合到驱动器并且靠近半导体管芯的表面的空间对准换能器。 驱动器在空间对准转换器中在至少一个方向上建立空间变化的电荷分布，从而有助于确定半导体管芯和另一个半导体管芯之间的多于一个方向上的空间对准。 特别地，靠近另一个半导体管芯的表面的空间对准传感器可以检测与空间变化的电荷分布相关联的电场（或相关的静电电位）。 该检测的电场可以允许确定半导体管芯的表面之间的垂直间隔和/或半导体管芯的角度对准。
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公开(公告)号：US08242811B2
公开(公告)日：2012-08-14
申请号：US12758189
申请日：2010-04-12
申请人： Jae-sun Seo , Ronald Ho , Robert J. Drost , Robert D. Hopkins
发明人： Jae-sun Seo , Ronald Ho , Robert J. Drost , Robert D. Hopkins
IPC分类号： H03K3/00
CPC分类号： G06F13/4072 , G06F2213/0038 , H03K3/3565 , Y02D10/14 , Y02D10/151
摘要： Some embodiments of the present invention provide techniques and systems for high-bandwidth on-chip communication. During operation, the system receives an input voltage signal which is to be transmitted over a wire in a chip. The system then generates one or more modified voltage signals from the input voltage signal. Next, the system drives each of the voltage signals (i.e., the input voltage signal and the one or more modified voltage signals) through a respective capacitor. The system then combines the output signals from the capacitors to obtain a combined voltage signal. Next, the system transmits the combined voltage signal over the wire. The transmitted signals can then be received by a hysteresis receiver which is coupled to the wire through a coupling capacitor.
摘要翻译： 本发明的一些实施例提供了用于高带宽片上通信的技术和系统。 在操作期间，系统接收将通过芯片中的导线传输的输入电压信号。 然后，该系统从输入电压信号产生一个或多个修改的电压信号。 接下来，系统通过相应的电容器驱动每个电压信号（即，输入电压信号和一个或多个修改的电压信号）。 然后，系统组合来自电容器的输出信号以获得组合电压信号。 接下来，系统通过电线传输组合的电压信号。 所传送的信号然后可以由滞后接收器接收，该滞后接收器通过耦合电容耦合到导线。
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公开(公告)号：US20110248750A1
公开(公告)日：2011-10-13
申请号：US12758189
申请日：2010-04-12
申请人： Jae-sun Seo , Ronald Ho , Robert J. Drost , Robert D. Hopkins
发明人： Jae-sun Seo , Ronald Ho , Robert J. Drost , Robert D. Hopkins
IPC分类号： H03K3/00
CPC分类号： G06F13/4072 , G06F2213/0038 , H03K3/3565 , Y02D10/14 , Y02D10/151
摘要： Some embodiments of the present invention provide techniques and systems for high-bandwidth on-chip communication. During operation, the system receives an input voltage signal which is to be transmitted over a wire in a chip. The system then generates one or more modified voltage signals from the input voltage signal. Next, the system drives each of the voltage signals (i.e., the input voltage signal and the one or more modified voltage signals) through a respective capacitor. The system then combines the output signals from the capacitors to obtain a combined voltage signal. Next, the system transmits the combined voltage signal over the wire. The transmitted signals can then be received by a hysteresis receiver which is coupled to the wire through a coupling capacitor.
摘要翻译： 本发明的一些实施例提供了用于高带宽片上通信的技术和系统。 在操作期间，系统接收将通过芯片中的导线传输的输入电压信号。 然后，该系统从输入电压信号产生一个或多个修改的电压信号。 接下来，系统通过相应的电容器驱动每个电压信号（即，输入电压信号和一个或多个修改的电压信号）。 然后，系统组合来自电容器的输出信号以获得组合电压信号。 接下来，系统通过电线传输组合的电压信号。 所传送的信号然后可以由滞后接收器接收，该滞后接收器通过耦合电容耦合到导线。
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