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    Adsorbent for moisture removal from fluorine-containing fluids
    3.
    发明授权
    Adsorbent for moisture removal from fluorine-containing fluids 有权
    用于从含氟流体中除湿的吸附剂

    公开(公告)号：US06709487B1

    公开(公告)日：2004-03-23

    申请号：US10278131

    申请日：2002-10-22

    申请人： Chun Christine Dong ,  Madhukar Bhaskara Rao ,  Dingjun Wu

    发明人： Chun Christine Dong ,  Madhukar Bhaskara Rao ,  Dingjun Wu

    IPC分类号： B01D5304

    CPC分类号： B01D53/261 ,  B01D53/28 ,  Y10S95/90

    摘要： An adsorbent, method, and apparatus involving same for the removal of moisture from a fluoride-containing fluid such as gaseous nitrogen trifluoride are disclosed herein. In certain preferred embodiments, the adsorbent of the present invention comprises an organic support having a porosity of 30% or greater and a pore size of 2 &mgr;m or less; and at least one metal fluoride disposed within at least a portion of the organic substrate.

    摘要翻译： 本文公开了一种用于从含氟化物的流体例如气态三氟化氮中除去水分的吸附剂，方法和装置。 在某些优选的实施方式中，本发明的吸附剂包含孔隙率为30％以上，孔径为2μm以下的有机载体， 以及至少一种配置在有机基材的至少一部分内的金属氟化物。

    Adsorbent for water removal from ammonia
    4.
    发明授权
    Adsorbent for water removal from ammonia 有权
    用于从氨去除水的吸附剂

    公开(公告)号：US07446078B2

    公开(公告)日：2008-11-04

    申请号：US10191719

    申请日：2002-07-09

    申请人： Chun Christine Dong ,  Madhukar Bhaskara Rao ,  Dingjun Wu

    发明人： Chun Christine Dong ,  Madhukar Bhaskara Rao ,  Dingjun Wu

    IPC分类号： B01J20/00

    CPC分类号： B01J20/28078 ,  B01J20/0211 ,  B01J20/0222 ,  B01J20/0225 ,  B01J20/0229 ,  B01J20/0244 ,  B01J20/0248 ,  B01J20/0281 ,  B01J20/0288 ,  B01J20/045 ,  B01J20/046 ,  B01J20/08 ,  B01J20/28057 ,  B01J20/3204 ,  B01J20/3234 ,  B01J20/3236 ,  B01J20/3441 ,  B01J20/3483 ,  C01C1/024 ,  C01P2006/82

    摘要： The present invention provides an adsorbent for removing water and/or other oxygen-containing impurities from a fluid comprising ammonia to the ppb level and methods for making and using same. The adsorbent preferably comprises a substrate having a plurality of pores and a surface area that ranges from about 100 to about 2,500 m2/g and a compound disposed within a least a portion of the substrate. In certain preferred embodiments, the compound comprises at least one cation from the group consisting of ammonium (I), lithium (I), sodium (I), potassium (I), cesium (I); magnesium (II), calcium (II), strontium (II), barium (II), manganese (II), nickel (II), iron (II), zinc (II); aluminum (III), indium (III), iron (III), and zirconium (IV) or combinations thereof that is ionically associated with an anion from the group consisting of halide, sulfide, sulfite, or sulfate.

    摘要翻译： 本发明提供了一种用于从包含氨的流体到ppb级除去水和/或其它含氧杂质的吸附剂，以及制造和使用它们的方法。 吸附剂优选包括具有多个孔和约100至约2500m 2 / g范围的表面积的基底和设置在基底的至少一部分内的化合物。 在某些优选的实施方案中，该化合物包括至少一种阳离子，由铵（I），锂（I），钠（I），钾（I），铯（I） 镁（II），钙（II），锶（II），钡（II），锰（II），镍（II），铁（II），锌（II） 与由卤化物，硫化物，亚硫酸盐或硫酸盐组成的组中的阴离子离子键合的铝（III），铟（III），铁（III）和锆（IV）或其组合。

    Apparatus for Removal of Surface Oxides via Fluxless Technique Involving Electron Attachment and Remote Ion Generation
    5.
    发明申请
    Apparatus for Removal of Surface Oxides via Fluxless Technique Involving Electron Attachment and Remote Ion Generation 有权
    用于通过无电极技术去除表面氧化物的装置，涉及电子附件和远程离子生成

    公开(公告)号：US20110229377A1

    公开(公告)日：2011-09-22

    申请号：US13151883

    申请日：2011-06-02

    申请人： Chun Christine Dong ,  Wayne Thomas McDermott ,  Richard E. Patrick ,  Alexander Schwarz

    发明人： Chun Christine Dong ,  Wayne Thomas McDermott ,  Richard E. Patrick ,  Alexander Schwarz

    IPC分类号： B01J19/08

    CPC分类号： C23G5/00 ,  B08B7/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/012 ,  B23K1/206 ,  H05K3/3489 ,  H05K2203/095

    摘要： The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

    摘要翻译： 本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。 在一个实施方案中，提供了从组分表面去除氧化物的方法，包括：在基底上提供组分，其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压，其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。

    Removal of Surface Oxides by Electron Attachment
    6.
    发明申请
    Removal of Surface Oxides by Electron Attachment 有权
    通过电子附件去除表面氧化物

    公开(公告)号：US20090223831A1

    公开(公告)日：2009-09-10

    申请号：US12119701

    申请日：2008-05-13

    申请人： Chun Christine Dong ,  Richard E. Patrick ,  Gregory Khosrov Arslanian

    发明人： Chun Christine Dong ,  Richard E. Patrick ,  Gregory Khosrov Arslanian

    IPC分类号： C25F5/00

    CPC分类号： B23K1/008 ,  B23K1/206 ,  B23K35/268 ,  B23K35/38 ,  C23G5/00 ,  H01J37/32431 ,  H01L21/31116 ,  H01L21/67069 ,  H05K3/3489 ,  H05K2203/087 ,  H05K2203/105 ,  H05K2203/1157

    摘要： The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.

    摘要翻译： 本发明涉及从衬底表面去除金属氧化物的方法。 在一个特定实施例中，该方法包括：提供驻留在目标区域内的衬底，第一和第二电极; 将包含还原气体的气体混合物通过所述目标区域; 向第一和/或第二电极提供一定量的能量以在目标区域内产生电子，其中至少一部分电子附着到一部分还原气体并形成带负电荷的还原气体; 并使基板与带负电荷的还原气体接触以减少基板表面上的金属氧化物。

    Addition of D2 to H2 to Detect and Calibrate Atomic Hydrogen Formed By Dissociative Electron attachment
    7.
    发明申请
    Addition of D2 to H2 to Detect and Calibrate Atomic Hydrogen Formed By Dissociative Electron attachment 审中-公开
    添加D2至H2以检测和校准通过分离电子附着形成的原子氢

    公开(公告)号：US20090008426A1

    公开(公告)日：2009-01-08

    申请号：US12233678

    申请日：2008-09-19

    申请人： Chun Christine Dong ,  Eugene Joseph Karwacki, JR. ,  Richard E. Patrick

    发明人： Chun Christine Dong ,  Eugene Joseph Karwacki, JR. ,  Richard E. Patrick

    IPC分类号： B23K37/00

    CPC分类号： B23K1/206 ,  H01L2924/0002 ,  H05K3/3489 ,  H01L2924/00

    摘要： A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.

    摘要翻译： 一种通过使用包括氢和氘的还原气体的气体混合物通过电子附着来检测和校准要焊接的一种或多种组分的干熔剂金属表面的方法，包括以下步骤：a）提供一种或多种待焊接的组分， 连接到作为目标组件的第一电极; b）提供邻近目标组件的第二电极; c）在所述第一和第二电极之间提供包含包含氢和氘的还原气体的气体混合物; d）向所述第一和第二电极提供直流（DC）电压以在所述电极之间形成发射电流并且将电子供给到所述还原气体以形成带负电荷的离子还原气体和键合到氘的氢分子; e）使目标组件与负电荷的离子还原气体和目标组件上的还原氧化物接触。 还公开了相关装置。