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    High dielectric constant metal oxide gate dielectrics
    3.
    发明授权
    High dielectric constant metal oxide gate dielectrics 有权
    高介电常数金属氧化物栅极电介质

    公开(公告)号：US06689702B2

    公开(公告)日：2004-02-10

    申请号：US10304434

    申请日：2002-11-25

    申请人： Gang Bai ,  David B. Fraser ,  Brian S. Doyle ,  Peng Cheng ,  Chunlin Liang

    发明人： Gang Bai ,  David B. Fraser ,  Brian S. Doyle ,  Peng Cheng ,  Chunlin Liang

    IPC分类号： H01L21469

    CPC分类号： H01L29/513 ,  H01L21/28185 ,  H01L21/28194 ,  H01L21/28211 ,  H01L21/28229 ,  H01L29/517

    摘要： A method of forming a dielectric layer suitable for use as the gate dielectric layer of a metal-oxide-semiconductor field effect transistor (MOSFET) includes oxidizing the surface of a silicon substrate, forming a metal layer over the oxidized surface, and reacting the metal with the oxidized surface to form a substantially intrinsic layer of silicon superjacent the substrate, wherein at least a portion of the silicon layer may be an epitaxial silicon layer, and a metal oxide layer superjacent the silicon layer. In a further aspect of the present invention, an integrated circuit includes a plurality of MOSFETs, wherein various ones of the plurality of transistors have metal oxide gate dielectric layers and substantially intrinsic silicon layers subjacent the metal oxide dielectric layers.

    摘要翻译： 形成适合用作金属氧化物半导体场效应晶体管（MOSFET）的栅极电介质层的电介质层的方法包括氧化硅衬底的表面，在氧化表面上形成金属层，并使金属 与氧化表面形成超过衬底的基本上本征的硅层，其中硅层的至少一部分可以是外延硅层，以及位于硅层之上的金属氧化物层。 在本发明的另一方面，集成电路包括多个MOSFET，其中多个晶体管中的各个晶体管具有金属氧化物栅极电介质层和位于金属氧化物电介质层之下的基本上本征的硅层。

    Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layer
    4.
    发明授权
    Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layer 失效
    用于通过电介质层中的封闭空隙减小互连系统电容的方法和结构

    公开(公告)号：US06303464B1

    公开(公告)日：2001-10-16

    申请号：US08774382

    申请日：1996-12-30

    申请人： Eng T. Gaw ,  Quat T. Vu ,  David B. Fraser ,  Chien Chiang ,  Ian A. Young ,  Thomas N. D. Marieb

    发明人： Eng T. Gaw ,  Quat T. Vu ,  David B. Fraser ,  Chien Chiang ,  Ian A. Young ,  Thomas N. D. Marieb

    IPC分类号： H01L2176

    CPC分类号： H01L21/7682

    摘要： A reduced capacitance interconnect system. A first metal layer is formed to a predetermined level above a first dielectric layer which is formed on a semiconductor substrate. The first metal layer level forms multiple interconnect lines wherein each interconnect line is separated from each adjacent interconnect line by a trench including a trench having a highest aspect ratio. A second dielectric layer is formed on the first metal layer and in the trenches between the interconnect lines such that an enclosed void having a void tip substantially level with the top of the metal layer is formed in at least each trench having an aspect ratio above a predetermined minimum aspect ratio, wherein the enclosed void in the trench having the highest aspect ratio has a void volume which is at least 15% of the volume of the trench.

    摘要翻译： 降低电容互连系统。 第一金属层形成在形成在半导体衬底上的第一介电层上方的预定水平。 第一金属层级形成多个互连线，其中每个互连线通过包括具有最高纵横比的沟槽的沟槽与每个相邻的互连线分开。 在第一金属层和互连线之间的沟槽中形成第二电介质层，使得具有空隙尖端的封闭空隙与金属层的顶部基本一致地形成在至少每个沟槽中，其纵横比高于 预定的最小纵横比，其中具有最高纵横比的沟槽中的封闭空隙具有至少占沟槽体积的15％的空隙体积。

    Method for forming multileves interconnections for semiconductor fabrication
    6.
    发明授权
    Method for forming multileves interconnections for semiconductor fabrication 失效
    用于形成用于半导体制造的多层互连的方法

    公开(公告)号：US5817572A

    公开(公告)日：1998-10-06

    申请号：US768790

    申请日：1996-12-18

    申请人： Chien Chiang ,  David B. Fraser

    发明人： Chien Chiang ,  David B. Fraser

    IPC分类号： H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L21/44

    CPC分类号： H01L21/76834 ,  H01L21/76801 ,  H01L21/76807 ,  H01L21/76843 ,  H01L21/76852 ,  H01L21/76877 ,  H01L21/76885 ,  H01L23/5226 ,  H01L23/5329 ,  H01L21/76829 ,  H01L23/53214 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53266 ,  H01L2924/0002 ,  Y10S438/945 ,  Y10S438/975

    摘要： A method for forming interconnections for semiconductor fabrication and semiconductor devices have such interconnections are described. A first patterned dielectric layer is formed over a semiconductor substrate and has a first opening filled with conductive material. Another patterned dielectric layer is formed over the first dielectric layer and has a second opening over at least a portion of the conductive material. The first patterned dielectric layer may serve as an etch-stop in patterning the other patterned dielectric layer. Also, a dielectric etch-stop layer may be formed over the first patterned dielectric layer and over the conductive material before the other patterned dielectric layer has been formed. This dielectric etch-stop layer may serve as an etch-stop in patterning the other patterned dielectric layer. The second opening exposes a portion of the dielectric etch-stop layer. The exposed portion of the dielectric etch-stop layer is removed. The second opening is filled with conductive material.

    摘要翻译： 描述了用于形成用于半导体制造和半导体器件的互连的方法具有这样的互连。 第一图案化电介质层形成在半导体衬底之上并且具有填充有导电材料的第一开口。 在第一电介质层上形成另一图案化电介质层，并且在至少一部分导电材料上具有第二开口。 第一图案化电介质层可以在图案化其它图案化的介电层时用作蚀刻停止。 此外，在形成另一个图案化的介电层之前，可以在第一图案化电介质层上方和导电材料之上形成电介质蚀刻停止层。 该电介质蚀刻停止层可以在图案化其它图案化的介电层时用作蚀刻停止。 第二开口露出电介质蚀刻停止层的一部分。 去除电介质蚀刻停止层的暴露部分。 第二个开口填充有导电材料。

    Methods of forming an interconnect on a semiconductor substrate
    7.
    发明授权
    Methods of forming an interconnect on a semiconductor substrate 失效
    在半导体衬底上形成互连的方法

    公开(公告)号：US5612254A

    公开(公告)日：1997-03-18

    申请号：US905473

    申请日：1992-06-29

    申请人： Xiao-Chun Mu ,  Srinivasan Sivaram ,  Donald S. Gardner ,  David B. Fraser

    发明人： Xiao-Chun Mu ,  Srinivasan Sivaram ,  Donald S. Gardner ,  David B. Fraser

    IPC分类号： H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L21/44

    CPC分类号： H01L21/76843 ,  H01L21/76801 ,  H01L21/76807 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/5329 ,  H01L2221/1036 ,  H01L2924/0002

    摘要： A device and methods of forming an interconnection within a prepatterned channel in a semiconductor device are described. The present invention includes a method of forming an interconnect channel within a semiconductor device. A first dielectric layer is deposited over a substrate and patterned to form a contact opening that is subsequently filled with a contact plug. A second dielectric layer is deposited over the patterned first dielectric layer and the contact plug. The second dielectric layer is patterned to form the interconnect channel, wherein the first dielectric layer acts as an etch stop to prevent etching of the substrate. The present invention also includes a method of forming an interconnect. A dielectric layer is deposited over a substrate and patterned to form an interconnect chapel. A metal layer is deposited over the patterned dielectric layer and within the interconnect channel. The metal layer is polished with an alkaline solution to remove the metal layer that does not lie within the interconnect chapel to form an interconnect. The present invention further includes a method of forming an interconnect over a silicon nitride layer. The silicon nitride layer is deposited over a semiconductor substrate and patterned to form a contact opening that is subsequently filled with a conductive material. A metal layer is deposited on the patterned silicon nitride layer and the contact plug and patterned to form the interconnect such that all of the interconnect lies on the contact plug and part of the patterned silicon nitride layer.

    摘要翻译： 描述了在半导体器件中的预制图形通道内形成互连的装置和方法。 本发明包括在半导体器件内形成互连通道的方法。 第一电介质层沉积在衬底上并被图案化以形成随后用接触插塞填充的接触开口。 在图案化的第一介电层和接触插塞上沉积第二介电层。 图案化第二电介质层以形成互连通道，其中第一介电层用作蚀刻停止件以防止蚀刻基板。 本发明还包括形成互连的方法。 将电介质层沉积在衬底上并图案化以形成互连教堂。 金属层沉积在图案化的介电层上并且在互连通道内。 金属层用碱性溶液抛光以除去不在互连教堂内的金属层以形成互连。 本发明还包括在氮化硅层上形成互连的方法。 氮化硅层沉积在半导体衬底上并被图案化以形成随后用导电材料填充的接触开口。 金属层沉积在图案化的氮化硅层和接触插塞上，并被图案化以形成互连，使得所有互连都位于接触插塞和图案化的氮化硅层的一部分上。