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公开(公告)号:US08017436B1
公开(公告)日:2011-09-13
申请号:US11953680
申请日:2007-12-10
申请人: Ronald Patrick Huemoeller , Sukianto Rusli , Bob Shih-Wei Kuo , Jon Gregory Aday , Lee John Smith , Robert F. Darveaux
发明人: Ronald Patrick Huemoeller , Sukianto Rusli , Bob Shih-Wei Kuo , Jon Gregory Aday , Lee John Smith , Robert F. Darveaux
CPC分类号: H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49861 , H01L23/552 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L27/14618 , H01L2221/68345 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/32227 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/73204 , H01L2224/73265 , H01L2224/81001 , H01L2224/81005 , H01L2224/83001 , H01L2224/85001 , H01L2224/92247 , H01L2225/06517 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/12041 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/05624 , H01L2224/05647 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A method of forming a package includes forming a circuit pattern on a first carrier and embedding the circuit pattern in a dielectric material on a second carrier. The first carrier is removed and a buildup dielectric material is mounted to the dielectric material and the circuit pattern. Laser-ablated artifacts are formed in the buildup dielectric material and filled with an electrically conductive material to form a buildup circuit pattern. The second carrier is patterned into a stiffener, which provides rigidity to the thin package.
摘要翻译: 形成封装的方法包括在第一载体上形成电路图案,并将电路图案嵌入到第二载体上的电介质材料中。 去除第一载体并且将积聚电介质材料安装到介电材料和电路图案。 在积聚电介质材料中形成激光烧蚀的伪影,并填充有导电材料以形成积聚电路图案。 第二载体被图案化成加强件,其为薄包装提供刚性。