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    Method for magnetron sputter deposition
    5.
    发明申请
    Method for magnetron sputter deposition 有权
    磁控溅射沉积方法

    公开(公告)号：US20060251917A1

    公开(公告)日：2006-11-09

    申请号：US11397878

    申请日：2006-04-04

    申请人： Kuang-Tsan Chiang ,  Ronghua Wei ,  Edward Langa

    发明人： Kuang-Tsan Chiang ,  Ronghua Wei ,  Edward Langa

    IPC分类号： C23C14/32 ,  B32B15/20

    CPC分类号： C23C14/046 ,  C23C14/165 ,  C23C14/225 ,  C23C14/352 ,  C23C14/355 ,  H01J37/3405 ,  Y10T428/12903

    摘要： A method for depositing a nanostructured coating comprising chromium or a copper-chromium mixture on a workpiece. The workpiece may comprise a hollowed structure such as a rocket or jet engine combustion chamber liner. The method comprises providing a magnetron and an external sputter target material comprising chromium or a copper-chromium composite and effecting a magnetron sputter deposition to deposit a substantially uniform nanostructured coating comprising said sputter target material on said workpiece. The method may include plasma enhancement wherein a filament is utilized to produce a plasma that effects an ion bombardment on the workpiece during the magnetron sputter deposition process. The invention also includes the nanostructured coatings deposited by these methods and workpieces coated thereby.

    摘要翻译： 一种在工件上沉积包含铬或铜 - 铬混合物的纳米结构涂层的方法。 工件可以包括中空结构，例如火箭或喷气式发动机燃烧室衬套。 该方法包括提供磁控管和包含铬或铜 - 铬复合材料的外部溅射靶材料，并进行磁控溅射沉积，以将包含所述溅射靶材料的基本均匀的纳米结构涂层沉积在所述工件上。 该方法可以包括等离子体增强，其中使用丝来产生在磁控溅射沉积工艺期间对工件进行离子轰击的等离子体。 本发明还包括通过这些方法沉积的纳米结构涂层和由此涂覆的工件。

    Method for magnetron sputter deposition
    6.
    发明授权
    Method for magnetron sputter deposition 有权
    磁控溅射沉积方法

    公开(公告)号：US07790003B2

    公开(公告)日：2010-09-07

    申请号：US11397878

    申请日：2006-04-04

    申请人： Kuang-Tsan Kenneth Chiang ,  Ronghua Wei ,  Edward Langa

    发明人： Kuang-Tsan Kenneth Chiang ,  Ronghua Wei ,  Edward Langa

    IPC分类号： C23C14/35

    CPC分类号： C23C14/046 ,  C23C14/165 ,  C23C14/225 ,  C23C14/352 ,  C23C14/355 ,  H01J37/3405 ,  Y10T428/12903

    摘要： A method for depositing a nanostructured coating comprising chromium or a copper-chromium mixture on a workpiece. The workpiece may comprise a hollowed structure such as a rocket or jet engine combustion chamber liner. The method comprises providing a magnetron and an external sputter target material comprising chromium or a copper-chromium composite and effecting a magnetron sputter deposition to deposit a substantially uniform nanostructured coating comprising said sputter target material on said workpiece. The method may include plasma enhancement wherein a filament is utilized to produce a plasma that effects an ion bombardment on the workpiece during the magnetron sputter deposition process. The invention also includes the nanostructured coatings deposited by these methods and workpieces coated thereby.

    摘要翻译： 一种在工件上沉积包含铬或铜 - 铬混合物的纳米结构涂层的方法。 工件可以包括中空结构，例如火箭或喷气式发动机燃烧室衬套。 该方法包括提供磁控管和包含铬或铜 - 铬复合材料的外部溅射靶材料，并进行磁控溅射沉积，以将包含所述溅射靶材料的基本均匀的纳米结构涂层沉积在所述工件上。 该方法可以包括等离子体增强，其中使用丝来产生在磁控溅射沉积工艺期间对工件进行离子轰击的等离子体。 本发明还包括通过这些方法沉积的纳米结构涂层和由此涂覆的工件。

    SYSTEM AND METHOD FOR DEPOSITING COATINGS ON INNER SURFACE OF TUBULAR STRUCTURE
    7.
    发明申请
    SYSTEM AND METHOD FOR DEPOSITING COATINGS ON INNER SURFACE OF TUBULAR STRUCTURE 审中-公开
    用于在管状结构的内表面沉积涂层的系统和方法

    公开(公告)号：US20110111132A1

    公开(公告)日：2011-05-12

    申请号：US12939248

    申请日：2010-11-04

    申请人： Ronghua Wei ,  Christopher Rincon ,  Edward Langa ,  Narayana S. Cheruvu

    发明人： Ronghua Wei ,  Christopher Rincon ,  Edward Langa ,  Narayana S. Cheruvu

    IPC分类号： C23C14/02 ,  B29C71/04

    CPC分类号： C23C16/045 ,  C23C16/26 ,  H01J37/32596

    摘要： A system and method for depositing coatings on an inner surface of a tubular structure includes at least one pump for creating and maintaining a vacuum in the tubular structure, a meshed electrode adapted to be positioned in a center of the tubular structure, and a biased voltage power supply connected to the meshed electrode. The biased voltage power supply is adapted to apply a negative voltage to the meshed electrode such that the negative voltage causes a hollow cathode discharge inside the meshed electrode. The creation of the hollow cathode discharge causes ions to be drawn out of a mesh on the meshed electrode and accelerate onto an inner surface of the tubular structure, thereby coating the inner surface with a desired coating.

    摘要翻译： 用于在管状结构的内表面上沉积涂层的系统和方法包括至少一个用于在管状结构中产生和保持真空的泵，适于定位在管状结构的中心的网状电极和偏置电压 电源连接到网状电极。 偏置电压电源适于向网状电极施加负电压，使得负电压在网状电极内部引起空心阴极放电。 空心阴极放电的产生导致离子从网状电极上的网状物拉出并加速到管状结构的内表面上，从而以期望的涂层涂覆内表面。

    Processing tubular surfaces using double glow discharge
    8.
    发明授权
    Processing tubular surfaces using double glow discharge 有权
    使用双辉光放电加工管状表面

    公开(公告)号：US09175381B2

    公开(公告)日：2015-11-03

    申请号：US12169837

    申请日：2008-07-09

    申请人： Ronghua Wei

    发明人： Ronghua Wei

    IPC分类号： C23C14/34 ,  C23C14/16 ,  C23C14/54 ,  C23C14/48 ,  C23C14/04

    CPC分类号： C23C14/345 ,  C23C14/046 ,  C23C14/16 ,  C23C14/165 ,  C23C14/48 ,  C23C14/541

    摘要： A method of sputtering a component includes positioning a conductive substrate into a vacuum chamber, wherein the conductive substrate is tubular and has a surface. A source electrode including a source material may be inserted into the conductive substrate. A first bias voltage ΔVac1 may be applied between the conductive substrate and the vacuum chamber and a second bias voltage ΔVas1 may be applied between the source electrode and the vacuum chamber, sputtering the source material onto the conductive substrate.

    摘要翻译： 溅射部件的方法包括将导电基板定位到真空室中，其中导电基板是管状的并具有表面。 可以将包括源材料的源电极插入到导电基板中。 可以在导电基板和真空室之间施加第一偏置电压＆amp; Vac1，并且可以在源电极和真空室之间施加第二偏压＆Dgr; Vas1，将源材料溅射到导电基板上。