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    Processing tubular surfaces using double glow discharge
    2.
    发明授权
    Processing tubular surfaces using double glow discharge 有权
    使用双辉光放电加工管状表面

    公开(公告)号：US09175381B2

    公开(公告)日：2015-11-03

    申请号：US12169837

    申请日：2008-07-09

    申请人： Ronghua Wei

    发明人： Ronghua Wei

    IPC分类号： C23C14/34 ,  C23C14/16 ,  C23C14/54 ,  C23C14/48 ,  C23C14/04

    CPC分类号： C23C14/345 ,  C23C14/046 ,  C23C14/16 ,  C23C14/165 ,  C23C14/48 ,  C23C14/541

    摘要： A method of sputtering a component includes positioning a conductive substrate into a vacuum chamber, wherein the conductive substrate is tubular and has a surface. A source electrode including a source material may be inserted into the conductive substrate. A first bias voltage ΔVac1 may be applied between the conductive substrate and the vacuum chamber and a second bias voltage ΔVas1 may be applied between the source electrode and the vacuum chamber, sputtering the source material onto the conductive substrate.

    摘要翻译： 溅射部件的方法包括将导电基板定位到真空室中，其中导电基板是管状的并具有表面。 可以将包括源材料的源电极插入到导电基板中。 可以在导电基板和真空室之间施加第一偏置电压＆amp; Vac1，并且可以在源电极和真空室之间施加第二偏压＆Dgr; Vas1，将源材料溅射到导电基板上。

    Method of in-situ displacement/stress control in electroplating
    5.
    发明授权
    Method of in-situ displacement/stress control in electroplating 有权
    电镀中原位位移/应力控制方法

    公开(公告)号：US06238539B1

    公开(公告)日：2001-05-29

    申请号：US09344729

    申请日：1999-06-25

    申请人： Richard J. Joyce ,  Ronghua Wei ,  Randall L. Kubena ,  Robert E. Doty

    发明人： Richard J. Joyce ,  Ronghua Wei ,  Randall L. Kubena ,  Robert E. Doty

    IPC分类号： C25D2112

    CPC分类号： C25D21/12

    摘要： The dominant physical parameter that affects the internal stress of electroplated metals on substrates have been identified and their effects have been systematically studied. Thin electroplated metals have very high internal stresses, even though the substrate displacements are small. Increasing the electroplated metal's thickness greatly reduces the magnitude of the stress, which can be either tensile or compressive depending on the plating conditions, but it may not necessarily reduce the displacement of the substrate. Based on the research done in connection to this application, the relationship between the plating temperatures and the current density needed to obtain near-zero-stress state for electroplated nickel on silicon substrate can be deduced.

    摘要翻译： 影响电镀金属对衬底内应力的主要物理参数已被确定，并对其影响进行了系统研究。 薄的电镀金属具有非常高的内应力，即使衬底位移较小。 增加电镀金属的厚度大大减小了应力的大小，其可以根据电镀条件而拉伸或压缩，但是它可能不一定会降低基板的位移。 基于与本申请相关的研究，可以推导出电镀温度与电解镍在硅衬底上获得接近零应力状态所需的电流密度之间的关系。

    Conformal magnetron sputter deposition
    7.
    发明授权
    Conformal magnetron sputter deposition 有权
    保形磁控溅射沉积

    公开(公告)号：US08277617B2

    公开(公告)日：2012-10-02

    申请号：US11838399

    申请日：2007-08-14

    申请人： Kuang-Tsan Kenneth Chiang ,  Ronghua Wei

    发明人： Kuang-Tsan Kenneth Chiang ,  Ronghua Wei

    IPC分类号： C23C14/00 ,  C23C14/32 ,  C25B9/00 ,  C25B11/00 ,  C25B13/00

    CPC分类号： C23C14/046 ,  C23C14/165 ,  C23C14/35 ,  C23C14/354 ,  H01J37/3405 ,  H01J37/342 ,  H01J37/3452

    摘要： An apparatus and method for magnetron sputter coating of an interior surface of a hollow substrate defining at least one irregular contour. The apparatus may contain a vacuum chamber and a target containing one or more metals having an exterior surface defining at least one irregular contour. The exterior surface of the target may be configured to conform to at least a portion of an irregular contour of the interior surface of the hollow substrate to be coated. A magnet assembly may be supplied which may include a plurality of magnets where the magnets are positioned substantially within a metallic target alloy.

    摘要翻译： 用于限定至少一个不规则轮廓的中空衬底的内表面的磁控溅射涂覆的装置和方法。 该装置可以包含真空室和包含一种或多种具有限定至少一个不规则轮廓的外表面的金属的靶。 靶的外表面可以被配置成符合待涂覆的中空基底的内表面的不规则轮廓的至少一部分。 可以提供磁体组件，其可以包括多个磁体，其中磁体基本上位于金属靶合金内。

    Method for magnetron sputter deposition
    9.
    发明申请
    Method for magnetron sputter deposition 有权
    磁控溅射沉积方法

    公开(公告)号：US20060251917A1

    公开(公告)日：2006-11-09

    申请号：US11397878

    申请日：2006-04-04

    申请人： Kuang-Tsan Chiang ,  Ronghua Wei ,  Edward Langa

    发明人： Kuang-Tsan Chiang ,  Ronghua Wei ,  Edward Langa

    IPC分类号： C23C14/32 ,  B32B15/20

    CPC分类号： C23C14/046 ,  C23C14/165 ,  C23C14/225 ,  C23C14/352 ,  C23C14/355 ,  H01J37/3405 ,  Y10T428/12903

    摘要： A method for depositing a nanostructured coating comprising chromium or a copper-chromium mixture on a workpiece. The workpiece may comprise a hollowed structure such as a rocket or jet engine combustion chamber liner. The method comprises providing a magnetron and an external sputter target material comprising chromium or a copper-chromium composite and effecting a magnetron sputter deposition to deposit a substantially uniform nanostructured coating comprising said sputter target material on said workpiece. The method may include plasma enhancement wherein a filament is utilized to produce a plasma that effects an ion bombardment on the workpiece during the magnetron sputter deposition process. The invention also includes the nanostructured coatings deposited by these methods and workpieces coated thereby.

    摘要翻译： 一种在工件上沉积包含铬或铜 - 铬混合物的纳米结构涂层的方法。 工件可以包括中空结构，例如火箭或喷气式发动机燃烧室衬套。 该方法包括提供磁控管和包含铬或铜 - 铬复合材料的外部溅射靶材料，并进行磁控溅射沉积，以将包含所述溅射靶材料的基本均匀的纳米结构涂层沉积在所述工件上。 该方法可以包括等离子体增强，其中使用丝来产生在磁控溅射沉积工艺期间对工件进行离子轰击的等离子体。 本发明还包括通过这些方法沉积的纳米结构涂层和由此涂覆的工件。

    Method for depositing coatings on the interior surfaces of tubular structures
    10.
    发明授权
    Method for depositing coatings on the interior surfaces of tubular structures 有权
    在管状结构的内表面上沉积涂层的方法

    公开(公告)号：US07052736B2

    公开(公告)日：2006-05-30

    申请号：US10807039

    申请日：2004-03-23

    申请人： Ronghua Wei ,  Christopher Rincon ,  James Arps

    发明人： Ronghua Wei ,  Christopher Rincon ,  James Arps

    IPC分类号： B05D7/22 ,  C23C14/22

    CPC分类号： B05D7/22 ,  B05D1/62 ,  B05D7/52 ,  B05D2254/04 ,  F41A21/04 ,  Y10T428/13

    摘要： A method is disclosed for substantially uniformly coating an interior surface of a ferromagnetic tubular structure such as a ferromagnetic tube having a high aspect ratio. The method entails inducing a magnetic field of a given magnitude within the tubular structure. Further, a bias is applied at a given voltage to the tubular structure. Then, the interior surface of the tubular structure is exposed to a gaseous precursor material under conditions effective to convert a quantity of the gaseous precursor material to ionize gaseous precursor material. The given magnitude and voltage is such that it is effective to deposit the ionized the gaseous precursor material onto the interior surface and converts the ionized gaseous precursor material to a substantially uniform protective coating in the interior surface.

    摘要翻译： 公开了一种基本上均匀地涂覆铁磁管状结构的内表面的方法，例如具有高纵横比的铁磁管。 该方法需要在管状结构内引起给定量值的磁场。 此外，在给定电压下施加偏压到管状结构。 然后，管状结构的内表面在有效地将一定量的气态前体材料转化成电离气态前体材料的条件下暴露于气态前体材料。 给定的量值和电压使得将离子化的气态前体材料沉积到内表面上并将离子化的气态前体材料转化成内表面中基本均匀的保护涂层是有效的。