公开(公告)号：US07626211B2

公开(公告)日：2009-12-01

申请号：US10574160

申请日：2005-09-07

申请人： Ryouji Sugiura ,  Hideki Yoshida

发明人： Ryouji Sugiura ,  Hideki Yoshida

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A recess is formed in a land (2) of an LED reflecting plate (1) formed of a metal plate. The recess comprises a flat LED chip mounting portion (7) and a reflecting portion (8) inclined with respect to the LED chip mounting portion (7). The LED reflecting plate (1) is mounted on a printed wiring board (25) such that the land (2) is fitted in a first through hole (18). An LED chip (27) mounted on the LED chip mounting portion (7) is connected to a terminal portion (22) formed on the printed wiring board (25). The printed wiring board (25) is diced along a third through hole (19) to form an LED device (30) as one unit. With this arrangement, heat radiation properties and reflecting efficiency of the LED device (30) can be improved, and the manufacturing cost can be decreased.

摘要翻译： 在由金属板形成的LED反射板（1）的平台（2）中形成凹部。 凹部包括平坦的LED芯片安装部分（7）和相对于LED芯片安装部分（7）倾斜的反射部分（8）。 LED反射板（1）安装在印刷电路板（25）上，使得焊盘（2）装配在第一通孔（18）中。 安装在LED芯片安装部分（7）上的LED芯片（27）连接到形成在印刷电路板（25）上的端子部分（22）。 印刷电路板（25）沿着第三通孔（19）切割，形成作为一个单元的LED器件（30）。 利用这种布置，可以提高LED装置（30）的散热特性和反射效率，并且可以降低制造成本。

公开(公告)号：US20070063209A1

公开(公告)日：2007-03-22

申请号：US10574160

申请日：2005-09-07

申请人： Ryouji Sugiura ,  Hideki Yoshida

发明人： Ryouji Sugiura ,  Hideki Yoshida

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A recess is formed in a land (2) of an LED reflecting plate (1) formed of a metal plate. The recess comprises a flat LED chip mounting portion (7) and a reflecting portion (8) inclined with respect to the LED chip mounting portion (7). The LED reflecting plate (1) is mounted on a printed wiring board (25) such that the land (2) is fitted in a first through hole (18). An LED chip (27) mounted on the LED chip mounting portion (7) is connected to a terminal portion (22) formed on the printed wiring board (25). The printed wiring board (25) is diced along a third through hole (19) to form an LED device (30) as one unit. With this arrangement, heat radiation properties and reflecting efficiency of the LED device (30) can be improved, and the manufacturing cost can be decreased.

摘要翻译： 在由金属板形成的LED反射板（1）的平台（2）中形成凹部。 凹部包括平坦的LED芯片安装部分（7）和相对于LED芯片安装部分（7）倾斜的反射部分（8）。 LED反射板（1）安装在印刷电路板（25）上，使得焊盘（2）装配在第一通孔（18）中。 安装在LED芯片安装部分（7）上的LED芯片（27）连接到形成在印刷电路板（25）上的端子部分（22）。 印刷电路板（25）沿着第三通孔（19）切割，形成作为一个单元的LED器件（30）。 利用这种布置，可以提高LED装置（30）的散热特性和反射效率，并且可以降低制造成本。

公开(公告)号：US20100032693A1

公开(公告)日：2010-02-11

申请号：US12581828

申请日：2009-10-19

申请人： Ryouji Sugiura ,  Hideki Yoshida

发明人： Ryouji Sugiura ,  Hideki Yoshida

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A recess is formed in a land (2) of an LED reflecting plate (1) formed of a metal plate. The recess comprises a flat LED chip mounting portion (7) and a reflecting portion (8) inclined with respect to the LED chip mounting portion (7). The LED reflecting plate (1) is mounted on a printed wiring board (25) such that the land (2) is fitted in a first through hole (18). An LED chip (27) mounted on the LED chip mounting portion (7) is connected to a terminal portion (22) formed on the printed wiring board (25). The printed wiring board (25) is diced along a third through hole (19) to form an LED device (30) as one unit. With this arrangement, heat radiation properties and reflecting efficiency of the LED device (30) can be improved, and the manufacturing cost can be decreased.

摘要翻译： 在由金属板形成的LED反射板（1）的平台（2）中形成凹部。 凹部包括平坦的LED芯片安装部分（7）和相对于LED芯片安装部分（7）倾斜的反射部分（8）。 LED反射板（1）安装在印刷电路板（25）上，使得焊盘（2）装配在第一通孔（18）中。 安装在LED芯片安装部分（7）上的LED芯片（27）连接到形成在印刷电路板（25）上的端子部分（22）。 印刷电路板（25）沿着第三通孔（19）切割，形成作为一个单元的LED器件（30）。 利用这种布置，可以提高LED装置（30）的散热特性和反射效率，并且可以降低制造成本。

公开(公告)号：US20070230842A1

公开(公告)日：2007-10-04

申请号：US11730431

申请日：2007-04-02

申请人： Takehito Tamaoka ,  Ryouji Sugiura

发明人： Takehito Tamaoka ,  Ryouji Sugiura

IPC分类号： F16C32/06

CPC分类号： F16C17/08 ,  F16C17/026 ,  F16C33/107 ,  F16C33/14 ,  F16C2220/66 ,  F16C2220/70 ,  F16C2220/82 ,  F16C2220/84 ,  F16C2223/04 ,  F16C2223/06 ,  F16C2223/08 ,  F16C2223/32 ,  F16C2226/40 ,  F16C2370/12 ,  Y10T29/49636 ,  Y10T29/49645 ,  Y10T29/49995 ,  Y10T29/49996

摘要： A plate-like material is pressed and a middle concave portion centered on a center axis is formed in one axial surface of the material. Likely, an annular concave portion centered on a center axis and radially outwardly arranged is formed in one and/or the other axial surface of the material. The material is then cut along a radially outer rim of the middle concave portion, and between a radially outer rim and a radially inner rim of the annular concave portion. In this way, a thrust plate having indented portions at radially inside and outside portion of the one and/or the other axial surface thereof is manufactured. A burr formed in press working is accommodate within the indented portion and does not axially protrude from the one and/or the other axial surface of the thrust plate.

摘要翻译： 压制板状材料，并且在该材料的一个轴向表面上形成以中心轴为中心的中间凹部。 可能地，在材料的一个和/或另一个轴向表面中形成以中心轴线为中心并径向向外布置的环形凹部。 然后沿着中间凹部的径向外边缘以及在环形凹部的径向外边缘和径向内边缘之间切割材料。 以这种方式，制造在其一个和/或另一个轴向表面的径向内侧和外侧部分具有凹入部分的止推板。 在压制加工中形成的毛刺容纳在凹入部分内并且不从止推板的一个和/或另一个轴向表面轴向突出。

公开(公告)号：US08760799B2

公开(公告)日：2014-06-24

申请号：US13492956

申请日：2012-06-11

申请人： Takuro Iguchi ,  Yoshihiro Sameshima ,  Takehito Tamaoka ,  Ryouji Sugiura

发明人： Takuro Iguchi ,  Yoshihiro Sameshima ,  Takehito Tamaoka ,  Ryouji Sugiura

IPC分类号： G11B17/02

CPC分类号： G11B19/2045 ,  G11B17/0282

摘要： A rotor hub includes a shaft connecting portion arranged to be connected to a shaft serving as a central axis, a disk loading portion centered about the central axis and arranged to support a disk shaped storage medium mounted thereon, a yoke arranged below the disk loading portion and supporting a field magnet at one of an inner side surface thereof and an outer side surface thereof, and a flexible portion connecting the disk loading portion to the yoke and being flexible with respect to a force applied thereto from the yoke.

摘要翻译： 转子轮毂包括：轴连接部分，其被布置成连接到用作中心轴线的轴;盘装载部分，围绕中心轴线居中并且被布置成支撑安装在其上的盘形存储介质;轭架，其布置在盘装载部分下方 并且在其内侧表面和外侧表面中的一个支撑场磁体;以及柔性部分，其将盘装载部分连接到轭，并且相对于从轭提供的力而是柔性的。

公开(公告)号：US06777612B2

公开(公告)日：2004-08-17

申请号：US09930944

申请日：2001-08-17

申请人： Ryouji Sugiura ,  Masayuki Sakurai ,  Kenichi Masuda

发明人： Ryouji Sugiura ,  Masayuki Sakurai ,  Kenichi Masuda

IPC分类号： H01L2302

CPC分类号： H03H9/1071 ,  H01L21/50 ,  H01L23/055 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/3025 ,  H03H3/08 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electronic device is provided which includes a substrate of insulating resin having at least a pair of interior terminal portions on an upper surface thereof, an electronic element mounted on the terminal portions, having at least a pair of electrode terminals thereof, and a member of insulating resin, bonded on the upper surface of said substrate. The frame includes a cavity to store the electronic element. A cover member of insulating material hermetically seals over the cavity. Electrodes are formed at or in vicinity of positions of the terminals of said electronic element to electrically conduct the interior terminal portions for connection outside the device. Alternatively, roughened surfaces can be formed on metal electrode portions, which are formed on the upper surface of substrate for electrically conducting said interior terminal portions to exterior terminal portions.

摘要翻译： 提供了一种电子器件，其包括：绝缘树脂基板，其上表面具有至少一对内部端子部分，安装在端子部分上的电子元件，具有至少一对电极端子，以及 绝缘树脂，粘合在所述基板的上表面上。 框架包括用于存储电子元件的空腔。 绝缘材料的盖件密封在空腔上。 电极形成在所述电子元件的端子的位置处或附近，以将内部端子部分导电以连接到器件外部。 或者，可以在形成在用于将内部端子部分导电到外部端子部分的基板的上表面上的金属电极部分上形成粗糙表面。

公开(公告)号：US07777238B2

公开(公告)日：2010-08-17

申请号：US11574833

申请日：2005-09-06

申请人： Takanori Nishida ,  Satoshi Isoda ,  Ryouji Sugiura ,  Masayuki Sakurai

发明人： Takanori Nishida ,  Satoshi Isoda ,  Ryouji Sugiura ,  Masayuki Sakurai

IPC分类号： H01L29/18

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H05K1/183 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

摘要： For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes 30, 30 . . . within an inside of an insulating substrate, has a base substrate 10 and a reflector substrate 20, which is laminated and adhered on an upper surface thereof. In the base substrate 10 is formed a though hole 11, on the reverse surface of which is formed a heat radiating plate 12 made from a thick metal thin film. Also, on an inner periphery and a bottom portion of the through hole are formed a reflection film 13, and further wiring patterns 14, 14 . . . are formed on the substrate. On the other hand, the reflector substrate 20 is formed with a through hole 21, having a diameter larger than that of the through hole of the base substrate, and on an inner peripheral surface thereof is formed a reflection film 22. This reflector substrate is disposed and adhered on an upper surface of the base substrate, at such the position that portions of the wiring patterns are exposed through the through hole thereof, and the plural number of the light emitting diodes are connected to the wiring patterns on the base substrate, to be mounted thereon.

摘要翻译： 为了提供其中具有多个发光元件的芯片型发光器件，以便能够获得具有优选的转换效率的高光输出，以及用于其的布线基板，芯片型发光器件 ，安装多个发光二极管30,30。 。 。 在绝缘基板的内部具有底基板10和反射器基板20，该基板10和反射器基板20层压并粘附在其上表面上。 在基底基板10上形成贯通孔11，反面设有由厚金属薄膜构成的散热板12。 此外，在通孔的内周和底部形成有反射膜13，以及另外的布线图案14,14。 。 。 形成在基板上。 另一方面，反射器基板20形成有直径大于基底基板的通孔直径的通孔21，其内周面形成有反射膜22.该反射基板为 在基板的上表面设置并粘附在布线图案的一部分通过其通孔露出的位置，并且多个发光二极管连接到基底基板上的布线图案， 安装在其上。

公开(公告)号：US08223455B2

公开(公告)日：2012-07-17

申请号：US11684130

申请日：2007-03-09

申请人： Takuro Iguchi ,  Yoshihiro Sameshima ,  Takehito Tamaoka ,  Ryouji Sugiura

发明人： Takuro Iguchi ,  Yoshihiro Sameshima ,  Takehito Tamaoka ,  Ryouji Sugiura

IPC分类号： G11B17/02

CPC分类号： G11B19/2045 ,  G11B17/0282

摘要： A rotor hub includes a shaft connecting portion arranged to be connected to a shaft serving as a central axis, a disk loading portion centered about the central axis and arranged to support a disk shaped storage medium mounted thereon, a yoke arranged below the disk loading portion and supporting a field magnet at one of an inner side surface thereof and an outer side surface thereof, and a flexible portion connecting the disk loading portion to the yoke and being flexible with respect to a force applied thereto from the yoke.

摘要翻译： 转子轮毂包括：轴连接部分，其被布置成连接到用作中心轴线的轴;盘装载部分，围绕中心轴线居中并且被布置成支撑安装在其上的盘形存储介质;轭架，其布置在盘装载部分下方 并且在其内侧表面和外侧表面中的一个支撑场磁体;以及柔性部分，其将盘装载部分连接到轭，并且相对于从轭提供的力而是柔性的。

公开(公告)号：US07721445B2

公开(公告)日：2010-05-25

申请号：US11730431

申请日：2007-04-02

申请人： Takehito Tamaoka ,  Ryouji Sugiura

发明人： Takehito Tamaoka ,  Ryouji Sugiura

IPC分类号： B21D28/00 ,  B21D31/02 ,  B21K1/10 ,  B23P17/00 ,  F16C32/06

CPC分类号： F16C17/08 ,  F16C17/026 ,  F16C33/107 ,  F16C33/14 ,  F16C2220/66 ,  F16C2220/70 ,  F16C2220/82 ,  F16C2220/84 ,  F16C2223/04 ,  F16C2223/06 ,  F16C2223/08 ,  F16C2223/32 ,  F16C2226/40 ,  F16C2370/12 ,  Y10T29/49636 ,  Y10T29/49645 ,  Y10T29/49995 ,  Y10T29/49996

摘要： A plate-like material is pressed and a middle concave portion centered on a center axis is formed in one axial surface of the material. Likely, an annular concave portion centered on a center axis and radially outwardly arranged is formed in one and/or the other axial surface of the material. The material is then cut along a radially outer rim of the middle concave portion, and between a radially outer rim and a radially inner rim of the annular concave portion. In this way, a thrust plate having indented portions at radially inside and outside portion of the one and/or the other axial surface thereof is manufactured. A burr formed in press working is accommodate within the indented portion and does not axially protrude from the one and/or the other axial surface of the thrust plate.

摘要翻译： 压制板状材料，并且在该材料的一个轴向表面上形成以中心轴为中心的中间凹部。 可能地，在材料的一个和/或另一个轴向表面中形成以中心轴线为中心并径向向外布置的环形凹部。 然后沿着中间凹部的径向外边缘以及在环形凹部的径向外边缘和径向内边缘之间切割材料。 以这种方式，制造在其一个和/或另一个轴向表面的径向内侧和外侧部分具有凹入部分的止推板。 在压制加工中形成的毛刺容纳在凹入部分内并且不从止推板的一个和/或另一个轴向表面轴向突出。

公开(公告)号：US20090014732A1

公开(公告)日：2009-01-15

申请号：US11574833

申请日：2005-09-06

申请人： Takanori Nishida ,  Satoshi Isoda ,  Ryouji Sugiura ,  Masayuki Sakurai

发明人： Takanori Nishida ,  Satoshi Isoda ,  Ryouji Sugiura ,  Masayuki Sakurai

IPC分类号： H01L33/00 ,  F21V7/00

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H05K1/183 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

摘要： For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes 30, 30 . . . within an inside of an insulating substrate, has a base substrate 10 and a reflector substrate 20, which is laminated and adhered on an upper surface thereof. In the base substrate 10 is formed a though hole 11, on the reverse surface of which is formed a heat radiating plate 12 made from a thick metal thin film. Also, on an inner periphery and a bottom portion of the through hole are formed a reflection film 13, and further wiring patterns 14, 14 . . . are formed on the substrate. On the other hand, the reflector substrate 20 is formed with a through hole 21, having a diameter larger than that of the through hole of the base substrate, and on an inner peripheral surface thereof is formed a reflection film 22. This reflector substrate is disposed and adhered on an upper surface of the base substrate, at such the position that portions of the wiring patterns are exposed through the through hole thereof, and the plural number of the light emitting diodes are connected to the wiring patterns on the base substrate, to be mounted thereon.

摘要翻译： 为了提供其中具有多个发光元件的芯片型发光器件，以便能够获得具有优选的转换效率的高光输出，以及用于其的布线基板，芯片型发光器件 ，安装多个发光二极管30,30。 。 。 在绝缘基板的内部具有底基板10和反射器基板20，该基板10和反射器基板20层压并粘附在其上表面上。 在基底基板10上形成贯通孔11，反面设有由厚金属薄膜构成的散热板12。 此外，在通孔的内周和底部形成有反射膜13，以及另外的布线图案14,14。 。 。 形成在基板上。 另一方面，反射器基板20形成有直径大于基底基板的通孔直径的通孔21，其内周面形成有反射膜22.该反射基板为 在基板的上表面设置并粘附在布线图案的一部分通过其通孔露出的位置，并且多个发光二极管连接到基底基板上的布线图案， 安装在其上。