公开(公告)号：US20180197831A1

公开(公告)日：2018-07-12

申请号：US15788189

申请日：2017-10-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun KIM ,  Thomas A. KIM ,  Kyu Bum HAN

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/538 ,  H01L25/10 ,  H01L23/552

Abstract: A semiconductor package includes a substrate portion including a core layer having a device accommodating portion formed therein, and a buildup layer stacked on each of opposing sides of the core layer; an electronic device disposed in the device accommodating portion; and heat dissipating conductors disposed in the buildup layer to externally emit heat generated by the electronic device.

公开(公告)号：US20200335851A1

公开(公告)日：2020-10-22

申请号：US16916431

申请日：2020-06-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong In KIM ,  Thomas A. KIM ,  Ho Kyung KANG

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/48 ,  H01Q21/06 ,  H05K1/02 ,  H05K1/16

Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.

公开(公告)号：US20200091585A1

公开(公告)日：2020-03-19

申请号：US16694228

申请日：2019-11-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong In KIM ,  Thomas A. KIM ,  Ho Kyung KANG

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/48 ,  H01Q21/06 ,  H05K1/02 ,  H05K1/16

Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.

公开(公告)号：US20190198995A1

公开(公告)日：2019-06-27

申请号：US15993821

申请日：2018-05-31

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jeong Ki RYOO ,  Sang Hyun KIM ,  Seung Goo JANG ,  Thomas A. KIM ,  Hong In KIM ,  Nam Ki KIM

IPC: H01Q5/35 ,  H01Q1/38 ,  H01Q1/24 ,  H01Q9/42

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.

公开(公告)号：US20180053719A1

公开(公告)日：2018-02-22

申请号：US15600114

申请日：2017-05-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun KIM ,  Thomas A. KIM ,  Kyu Bum HAN ,  Tae Hoon KIM

IPC: H01L23/522 ,  H01L23/532

CPC classification number: H01L23/5226 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/53209 ,  H01L23/53214 ,  H01L23/53219 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53242 ,  H01L23/53247 ,  H01L23/5328 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3025

Abstract: A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.

公开(公告)号：US20190334224A1

公开(公告)日：2019-10-31

申请号：US16503666

申请日：2019-07-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong In KIM ,  Thomas A. KIM ,  Ho Kyung KANG

IPC: H01Q1/22 ,  H05K1/16 ,  H01Q21/06 ,  H01L23/66 ,  H05K1/02 ,  H01Q1/48

Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.

公开(公告)号：US20180076147A1

公开(公告)日：2018-03-15

申请号：US15598497

申请日：2017-05-18

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hyun KIM ,  Thomas A. KIM ,  Kyu Bum HAN ,  Kwan Hoo SON

IPC: H01L23/552 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06586 ,  H01L2225/06589

Abstract: A semiconductor package includes a frame including a through-hole, an electronic component disposed in the through-hole, a redistribution portion disposed below the frame and the electronic component, a metal layer disposed on an inner surface of the frame, and a conductive layer disposed between the metal layer and the electronic component, and covering the frame and the electronic component.

公开(公告)号：US20170263522A1

公开(公告)日：2017-09-14

申请号：US15264684

申请日：2016-09-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Thomas A. KIM ,  Kyu Bum HAN ,  Chang Moo JUNG ,  Kyung In KANG ,  Sang Kyu LEE

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/367

CPC classification number: H01L23/3171 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/09 ,  H01L24/19 ,  H01L24/33 ,  H01L24/46 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/1434 ,  H01L2924/1816

Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.