POWER SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    1.
    发明申请
    POWER SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 有权
    功率半导体器件及其制造方法

    公开(公告)号:US20140291722A1

    公开(公告)日:2014-10-02

    申请号:US13937589

    申请日:2013-07-09

    Abstract: There is provided a power semiconductor device, including a plurality of trench gates formed to be spaced apart from each other by a predetermined distance, a current increasing part formed between the trench gates and including a first conductivity-type emitter layer and a gate oxide formed on a surface of the trench gate, and an immunity improving part formed between the trench gates and including a second conductivity-type body layer, a preventing film formed on the surface of the trench gate, and a gate oxide having a thickness less than that the gate oxide of the current increasing part.

    Abstract translation: 提供了一种功率半导体器件,包括形成为彼此间隔开预定距离的多个沟槽栅极,形成在沟槽栅极之间并包括第一导电型发射极层和形成的栅极氧化物的电流增加部分 在所述沟槽栅极的表面上形成的抗扰度改善部以及形成在所述沟槽栅极之间并且包括第二导电型体层的抗扰度改善部,以及形成在所述沟槽栅极的表面上的防止膜和厚度小于所述沟槽栅极的厚度的栅极氧化物。 电流增加部分的栅极氧化物。

    SEMICONDUCTOR DEVICE
    3.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:US20140159104A1

    公开(公告)日:2014-06-12

    申请号:US13829896

    申请日:2013-03-14

    CPC classification number: H01L29/7397 H01L29/0834 H01L29/66348

    Abstract: There is provided a semiconductor device including: a first semiconductor region having a first conductivity; a second semiconductor region having a second conductivity and formed on a surface of the first semiconductor region; a third semiconductor region having the first conductivity and formed on a surface of the second semiconductor region; a gate electrode disposed in a trench that passes through the third semiconductor region in a depth direction and extends to an inside of the second semiconductor region; a first insulation layer formed between the gate electrode and the third semiconductor region; a second insulation layer formed between the gate electrode and the second semiconductor region; and a fourth semiconductor region having the second conductivity and formed in a portion of a surface of the third semiconductor region, wherein a thickness of a portion of the second insulation layer is greater than that of the first insulation layer.

    Abstract translation: 提供了一种半导体器件,包括:具有第一导电性的第一半导体区域; 具有第二导电性并形成在第一半导体区域的表面上的第二半导体区域; 具有第一导电性并形成在第二半导体区域的表面上的第三半导体区域; 设置在沟槽中的栅电极,所述沟槽在深度方向上穿过所述第三半导体区域并延伸到所述第二半导体区域的内部; 形成在所述栅极电极和所述第三半导体区域之间的第一绝缘层; 形成在栅电极和第二半导体区之间的第二绝缘层; 以及具有第二导电性并形成在第三半导体区域的表面的一部分中的第四半导体区域,其中第二绝缘层的一部分的厚度大于第一绝缘层的厚度。

    POWER SEMICONDUCTOR DEVICE
    4.
    发明申请
    POWER SEMICONDUCTOR DEVICE 审中-公开
    功率半导体器件

    公开(公告)号:US20150076652A1

    公开(公告)日:2015-03-19

    申请号:US14101066

    申请日:2013-12-09

    CPC classification number: H01L29/861 H01L29/0615

    Abstract: There is provided a power semiconductor device, including: a first semiconductor layer of a first conductive type having a thickness of t1 so as to withstand a reverse voltage of 600V; and a second semiconductor layer of a second conductive type formed inside an upper portion of the first semiconductor layer and having a thickness of t2, wherein t1/t2 is 15 to 18.

    Abstract translation: 提供了一种功率半导体器件,包括:具有厚度为t1的第一导电类型的第一半导体层,以承受600V的反向电压; 以及第二导电类型的第二半导体层,形成在所述第一半导体层的上部内并具有厚度t2,其中t1 / t2为15至18。

    INSULATED GATE BIPOLAR TRANSISTOR
    6.
    发明申请
    INSULATED GATE BIPOLAR TRANSISTOR 有权
    绝缘栅双极晶体管

    公开(公告)号:US20140138736A1

    公开(公告)日:2014-05-22

    申请号:US13751916

    申请日:2013-01-28

    CPC classification number: H01L29/7397 H01L29/1095

    Abstract: There is provided an insulated gate bipolar transistor including: a first semiconductor area of a first conductivity type; a second semiconductor area of a second conductivity type formed on one surface of the first semiconductor area; third semiconductor areas of the first conductivity type continuously formed in a length direction on one surface of the second semiconductor area; a plurality of trenches formed between the third semiconductor areas, extending to an inside of the second semiconductor area, and being continuous in the length direction; a fourth semiconductor area of the second conductivity type formed on one surface of the third semiconductor areas, insulation layers formed inside the trenches; gate electrodes buried inside the insulation layers; and a barrier layer formed in at least one of locations corresponding to the third semiconductor areas inside the second semiconductor area.

    Abstract translation: 提供了一种绝缘栅双极晶体管,包括:第一导电类型的第一半导体区域; 形成在第一半导体区域的一个表面上的第二导电类型的第二半导体区域; 在第二半导体区域的一个表面上沿长度方向连续形成的第一导电类型的第三半导体区域; 多个沟槽,形成在第三半导体区域之间,延伸到第二半导体区域的内部,并且在长度方向上是连续的; 形成在第三半导体区域的一个表面上的第二导电类型的第四半导体区域,形成在沟槽内的绝缘层; 掩埋在绝缘层内的栅电极; 以及形成在与所述第二半导体区域内的所述第三半导体区域对应的位置中的至少一个的阻挡层。

    SEMICONDUCTOR DEVICE
    7.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:US20140117405A1

    公开(公告)日:2014-05-01

    申请号:US13746616

    申请日:2013-01-22

    CPC classification number: H01L29/7397

    Abstract: There is provided a semiconductor device including: a first semiconductor region having a first conductivity type; a second semiconductor region having a second conductivity type and formed on one surface of the first semiconductor region; a third semiconductor region having a first conductivity type and formed on one surface of the second semiconductor region; a gate electrode formed in a trench penetrating through the second semiconductor region and the third semiconductor region to reach an interior of the first semiconductor region; and a hole injection unit formed between the gate electrode and the first semiconductor region.

    Abstract translation: 提供一种半导体器件,包括:具有第一导电类型的第一半导体区域; 具有第二导电类型并形成在第一半导体区域的一个表面上的第二半导体区域; 具有第一导电类型并形成在第二半导体区域的一个表面上的第三半导体区域; 形成在穿过所述第二半导体区域的沟槽和所述第三半导体区域中以到达所述第一半导体区域的内部的栅电极; 以及形成在所述栅极电极和所述第一半导体区域之间的空穴注入单元。

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