公开(公告)号：US20200152566A1

公开(公告)日：2020-05-14

申请号：US16658288

申请日：2019-10-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yoong OH ,  Sang-Hoon KIM ,  Hea-Sung KIM ,  Gyu-Mook KIM ,  Young-Kuk KO

IPC: H01L23/498 ,  H01L25/00 ,  H01L21/48

Abstract: A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.

公开(公告)号：US20200260580A1

公开(公告)日：2020-08-13

申请号：US16662529

申请日：2019-10-24

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Young-Kuk KO ,  Yoong OH ,  Sang-Hoon KIM ,  Gyu-Mook KIM ,  Hea-Sung KIM

IPC: H05K1/11 ,  H05K1/18

Abstract: A printed circuit board includes: an insulating layer; a via passing through the insulating layer; and a metal post in contact with a surface of the via, and protruding from the insulating layer. The metal post includes a region having a width that is greater than a width of the via.

公开(公告)号：US20160192491A1

公开(公告)日：2016-06-30

申请号：US14966442

申请日：2015-12-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Myung-Sam KANG ,  Young-Gwan KO ,  Sang-Hoon KIM ,  Kang-Wook BONG ,  Hye-Won JUNG ,  Yong-Wan JI

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/46 ,  H05K1/05 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/113 ,  H05K3/0023 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2203/0502 ,  H05K2203/0514

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括设置在基板的上表面上的第一电路层，设置在基板上的绝缘层和第一电路层，设置在绝缘层的上表面上的第二电路层，以及配置成 连接在第一电路层和第二电路层之间，并且通孔的下部与衬底的上表面接触。

公开(公告)号：US20130141191A1

公开(公告)日：2013-06-06

申请号：US13756210

申请日：2013-01-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Han KIM ,  Hyung-Sik CHOI ,  Sang-Hoon KIM ,  Joon-Sung KIM

IPC: H01P5/04 ,  H05K1/11

CPC classification number: H05K1/116 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2224/0401

Abstract: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

Abstract translation: 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据实施例，电磁带隙结构与第一金属层，第一介电层，金属板，第二介电层和第二金属层堆叠，并且奇数个通孔可以通过金属串联连接 第一金属层和金属板之间的线。 该电磁带隙结构可以具有小尺寸和低带隙频率。

公开(公告)号：US20210029825A1

公开(公告)日：2021-01-28

申请号：US17070289

申请日：2020-10-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Young-Kuk KO ,  Yoong OH ,  Sang-Hoon KIM ,  Gyu-Mook KIM ,  Yong-Soon JANG ,  Hea-Sung KIM

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/06

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

公开(公告)号：US20160192490A1

公开(公告)日：2016-06-30

申请号：US14966518

申请日：2015-12-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Myung-Sam KANG ,  Young-Gwan KO ,  Sang-Hoon KIM ,  Kang-Wook BONG ,  Hye-Won JUNG ,  Yong-Wan JI

IPC: H05K1/11 ,  H05K3/42 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/0326 ,  H05K1/0346 ,  H05K3/0023 ,  H05K3/426 ,  H05K3/428 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1476

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括绝缘层，其包括第一树脂层和第二树脂层，设置在绝缘层的上表面和下表面上的电路层，以及通孔，被配置为将形成在上表面上的电路层连接到电路层 形成在下表面上，第二树脂层通过第一树脂层从第一树脂层的上表面延伸到第一树脂层的下表面，以接触通孔的侧表面。