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1.发明授权Dielectric ceramic composition and multilayer ceramic capacitor including the same 有权介电陶瓷组合物和包括其的多层陶瓷电容器公开(公告)号：US09287045B2
公开(公告)日：2016-03-15
申请号：US14095634
申请日：2013-12-03
发明人： Seok Hyun Yoon , Dae Ho Yoon , Suk Hyun Song , Takaki Masaki , Doo Young Kim , Sang Huk Kim , Jong Bong Lim
CPC分类号： H01G4/1227 , H01G4/30
摘要： There are provided a dielectric ceramic composition and a multilayer ceramic capacitor including the same. The dielectric ceramic composition according to embodiments of the present disclosure includes a base powder represented by xSrTiO3-(1−x)BiMO3 (M includes Mg and Ti) containing a first main component represented by SrTiO3 and a second main component represented by BiMO3, wherein x satisfies 0.5≦x≦0.9.
摘要翻译： 提供介电陶瓷组合物和包括该陶瓷组合物的多层陶瓷电容器。 根据本公开实施方案的电介质陶瓷组合物包括由包含由SrTiO 3表示的第一主要成分的xSrTiO 3 - （1-x）BiMO 3（M包括Mg和Ti）表示的基础粉末和由BiMO 3表示的第二主要成分，其中 x满足0.5＆nlE; x＆nlE; 0.9。
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2.发明授权Dielectric composition to be sintered at low temperature, multilayer ceramic electronic component containing the same, and method of manufacturing the multilayer ceramic electronic component 有权在低温下烧结的电介质组合物，含有该介电组合物的多层陶瓷电子部件以及多层陶瓷电子部件的制造方法公开(公告)号：US09384894B2
公开(公告)日：2016-07-05
申请号：US14258969
申请日：2014-04-22
发明人： Jong Bong Lim , Seok Hyun Yoon , Doo Young Kim , Sang Huk Kim
IPC分类号： C04B35/468 , H01G4/12 , H01G4/30
CPC分类号： H01G4/1227 , C04B35/4682 , C04B2235/3203 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3244 , C04B2235/3263 , C04B2235/3282 , C04B2235/3418 , H01G4/30 , Y10T29/435
摘要： A dielectric composition to be sintered at low temperature may include BaTiO3 as a major component; and (1-x)Li2O-xCuO as a minor component, wherein x is 0.1 to 0.9, and the minor component is contained in a content of 0.1 mol % to 2.0 mol % based on 100 mol % of the major component.
摘要翻译： 在低温下烧结的电介质组合物可以包括BaTiO 3作为主要成分; 和（1-x）Li 2 O-xCuO作为次要组分，其中x为0.1至0.9，并且以主成分的100摩尔％计含有0.1摩尔％至2.0摩尔％的次要成分。
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公开(公告)号：US10355074B2
公开(公告)日：2019-07-16
申请号：US15890838
申请日：2018-02-07
发明人： Jong Pil Lee , Jong Bong Lim , Hai Joon Lee , Ji Hyun Park
IPC分类号： H01L23/522 , H01L49/02 , H01L23/528
摘要： A monolayer thin film capacitor includes: a bottom electrode; a top electrode; a dielectric layer disposed between the bottom electrode and the top electrode; a first via formed in the dielectric layer so as to penetrate through the dielectric layer; a second via formed in the top electrode so as to penetrate through the top electrode and having a greater width or a greater diameter than that of the first via; and a connection electrode disposed on inner sides of the first and second vias, electrically connected to the bottom electrode, and electrically insulated from the top electrode.
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4.发明授权Dielectric composition, multilayer ceramic capacitor using the same, and method for manufacturing multilayer ceramic capacitor 有权电介质组成，使用其的多层陶瓷电容器，以及多层陶瓷电容器的制造方法公开(公告)号：US09390856B2
公开(公告)日：2016-07-12
申请号：US14045161
申请日：2013-10-03
发明人： Seok Hyun Yoon , Jong Bong Lim , Jae Sung Park , Doo Young Kim , Chang Hoon Kim
IPC分类号： H01G4/12 , C04B35/468 , H01G4/30 , C04B35/465 , C04B35/49
CPC分类号： H01G4/1227 , C04B35/465 , C04B35/4682 , C04B35/49 , C04B2235/3206 , C04B2235/3208 , C04B2235/3217 , C04B2235/3224 , C04B2235/3225 , C04B2235/3229 , C04B2235/3239 , C04B2235/3241 , C04B2235/3244 , C04B2235/3262 , C04B2235/3272 , C04B2235/3275 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/3418 , C04B2235/5445 , C04B2235/78 , C04B2235/788 , H01G4/30
摘要： A dielectric composition includes a base main component including Ba and Ti and an accessory component, wherein a ratio of domain width/grain size of the dielectric composition is in the range of 0 to 0.2, a multilayer ceramic capacitor using the same, and a method for manufacturing a multilayer ceramic capacitor. It is possible to provide a dielectric composition that can implement a higher dielectric constant and good high temperature withstand voltage characteristics in the same grain size condition. It is expected that this effect can be effectively applied to the development of ultra high capacity MLCCs having a thin dielectric by implementing the same capacity while increasing the thickness of the dielectric than the case of applying the conventional dielectric material.
摘要翻译： 电介质组合物包括包含Ba和Ti的基本主成分和辅助成分，其中电介质组合物的畴宽/晶粒尺寸的比例在0至0.2的范围内，使用其的多层陶瓷电容器和方法 用于制造多层陶瓷电容器。 可以提供在相同的晶粒尺寸条件下能够实现更高介电常数和良好的耐高温耐高压特性的电介质组合物。 预期这种效果可以有效地应用于通过实施相同容量而开发具有薄电介质的超高容量MLCC，同时增加电介质的厚度比施加常规电介质材料的情况更多。
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公开(公告)号：US10553363B2
公开(公告)日：2020-02-04
申请号：US15293944
申请日：2016-10-14
发明人： Ji Hyun Park , Jong Bong Lim , Hai Joon Lee
摘要： A multilayer ceramic capacitor (MLCC) includes: a ceramic body having a plurality of dielectric layers, first internal electrodes, and second internal electrodes; and a first external electrode and a second external electrode, disposed on an exterior of the ceramic body. A plurality of via electrodes are disposed in the ceramic body; a first via electrode connects the first internal electrodes to the first external electrode; a second via electrode connects the second internal electrodes to the second external electrode; and the plurality of via electrodes have a stepped shape, and a distance in a length direction from a first vertical edge of each step to a second vertical edge of each step in the plurality of via electrodes is increased in a direction from the substrate toward an upper portion of the ceramic body.
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公开(公告)号：US10199171B2
公开(公告)日：2019-02-05
申请号：US15450568
申请日：2017-03-06
发明人： Jong Bong Lim , Hai Joon Lee , Doo Young Kim , Chang Hoon Kim
摘要： Disclosed herein is a thin film type capacitor element, including: a body part formed by stacking a plurality of dielectric layers; a first internal electrode provided in the body part and including a first non-plated region; a second internal electrode including a second non-plated region; a first via formed in the first non-plated region; and a second via formed in the second non-plated region.
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公开(公告)号：US09929231B2
公开(公告)日：2018-03-27
申请号：US15251565
申请日：2016-08-30
发明人： Hai Joon Lee , Makoto Kosaki , Ji Hyun Park , Jong Bong Lim
CPC分类号： H01L28/75 , H01L23/481 , H01L24/20 , H01L25/105 , H01L27/016 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105
摘要： An electronic component includes a body part and a via part. The body part includes first and second metal layers disposed with at least one dielectric layer interposed therebetween. The via part is disposed in the body part and includes first and second vias penetrating through the body part and selectively connected to the first and second metal layers, respectively. The first and second metal layers contain different metals. In some examples, a first insulating film is disposed between the first metal layer and the second via to electrically insulate the second via from the first metal layer, and a second insulating film is disposed between the second metal layer and the first via to electrically insulate the first via from the second metal layer. A method for forming the electronic component includes use of first and second etchants to selectively etch the first and second metal layers.
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公开(公告)号：US10199154B2
公开(公告)日：2019-02-05
申请号：US15200700
申请日：2016-07-01
发明人： Seok Il Hong , Jae Yeol Choi , Jong Bong Lim , Ju Hwan Yang
IPC分类号： H01F27/28 , H01F27/245 , H01F27/255 , H01F27/29 , H01F41/02 , H01F41/04 , H01F41/10 , H01F1/26 , H01F17/00 , H01F17/04
摘要： A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.
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公开(公告)号：US20180144848A1
公开(公告)日：2018-05-24
申请号：US15680663
申请日：2017-08-18
发明人： Jong Pil Lee , Seung Woo Song , Ji Hyun Park , Jong Bong Lim
CPC分类号： H01C1/14 , H01C1/01 , H01C1/148 , H01C7/003 , H01C17/006 , H01C17/06 , H01C17/281
摘要： A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.
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10.发明授权公开(公告)号：US09472316B2
公开(公告)日：2016-10-18
申请号：US14682788
申请日：2015-04-09
发明人： Jong Bong Lim , Seok Hyun Yoon , No Hoon Park , Doo Young Kim , Chang Hoon Kim
IPC分类号： C04B35/00 , H01B3/12 , C04B35/468 , H01G4/30 , H01G4/12
CPC分类号： H01B3/12 , B32B18/00 , C04B35/468 , C04B35/62685 , C04B2237/346 , C04B2237/68 , C04B2237/704 , H01G4/1227 , H01G4/30
摘要： There are provided a dielectric composition for low-temperature sintering and a multilayer ceramic electronic component manufactured using the dielectric composition and the dielectric composition may contains: BaTiO3 as a main ingredient; and a Li2O—BaO compound as an accessory ingredient, wherein the accessory ingredient is contained in an amount of 0.2 mol % to 0.8 mol %, on the basis of 100 mol % of the main ingredient.
摘要翻译： 提供了一种用于低温烧结的电介质组合物和使用电介质组合物制造的多层陶瓷电子部件，并且电介质组合物可以包含：BaTiO 3作为主要成分; 和作为辅助成分的Li 2 O-BaO化合物，其中辅助成分的含量为基于100摩尔％的主成分的0.2摩尔％至0.8摩尔％。
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