METHODS OF PROCESSING SUBSTRATES AND APPARATUSES THEREOF

    公开(公告)号:US20220139714A1

    公开(公告)日:2022-05-05

    申请号:US17319503

    申请日:2021-05-13

    Abstract: A substrate processing method includes inserting a substrate from an outside into a processing space, supplying a process gas from a gas supply unit to the processing space, producing plasma based on the process gas, performing an etching process for the substrate using ions included in the plasma, and discharging a processed gas produced in the etching process through a discharge part. The discharge part includes a first slit extending through a flange part, and a second slit connected to the first slit while extending through a side wall part connected to the flange part. A vertical length of the first slit is equal to a vertical length of the second slit. A horizontal length of the first slit is about 5 times to about 7 times the vertical length of the first slit.

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