公开(公告)号：US11764336B2

公开(公告)日：2023-09-19

申请号：US17385193

申请日：2021-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun Sim ,  Yong Il Kim ,  Ha Nul Yoo ,  Ji Hye Yeon ,  Jun Bu Youn ,  Ji Hoon Yun ,  Su Hyun Jo

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/504 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

公开(公告)号：US10700246B2

公开(公告)日：2020-06-30

申请号：US16299422

申请日：2019-03-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun Sim ,  Yong Il Kim ,  Ha Nul Yoo ,  Ji Hye Yeon ,  Jun Bu Youn ,  Ji Hoon Yun ,  Su Hyun Jo

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

公开(公告)号：US10573632B2

公开(公告)日：2020-02-25

申请号：US16185602

申请日：2018-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hye Yeon ,  Su Hyun Jo ,  Sung Hyun Sim ,  Ha Nul Yoo ,  Yong Il Kim ,  Han Kyu Seong

IPC: H01L25/18 ,  H01L27/12 ,  H01L33/50 ,  H01L25/00 ,  H01L23/00 ,  H01L27/15

Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.

公开(公告)号：US11075326B2

公开(公告)日：2021-07-27

申请号：US16913201

申请日：2020-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun Sim ,  Yong Il Kim ,  Ha Nul Yoo ,  Ji Hye Yeon ,  Jun Bu Youn ,  Ji Hoon Yun ,  Su Hyun Jo

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

公开(公告)号：US10797040B2

公开(公告)日：2020-10-06

申请号：US16798027

申请日：2020-02-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hye Yeon ,  Su Hyun Jo ,  Sung Hyun Sim ,  Ha Nul Yoo ,  Yong Il Kim ,  Han Kyu Seong

IPC: H01L29/00 ,  H01L27/12 ,  H01L33/50 ,  H01L25/00 ,  H01L23/00 ,  H01L25/18 ,  H01L27/15

Abstract: A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.

公开(公告)号：US10566318B2

公开(公告)日：2020-02-18

申请号：US16008276

申请日：2018-06-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Gun Lee ,  Yong Il Kim ,  Hye Seok Noh ,  Han Kyu Seong ,  Sung Hyun Sim ,  Ha Nul Yoo

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L27/12 ,  H01L33/60 ,  H01L33/06 ,  H01L33/32 ,  H01L33/30 ,  H01L33/40

Abstract: A light emitting device package includes a first wavelength conversion portion and a second wavelength conversion portion to provide a wavelength of incident light to provide light having a converted wavelength, a light-transmissive partition structure extending along side surfaces of the first and second wavelength conversion portions along a thickness direction to separate the first and second wavelength conversion portions part from each other along a direction crossing the thickness direction, and a cell array including a first light emitting device, a second light emitting device and a third light emitting device, overlapping the first wavelength conversion portion, the second wavelength conversion portion and the light-transmissive partition structure, respectively, along the thickness direction.

公开(公告)号：US10438994B2

公开(公告)日：2019-10-08

申请号：US15992316

申请日：2018-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Hye Yeon ,  Sung Hyun Sim ,  Ha Nul Yoo ,  Dong Gun Lee

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L33/46 ,  H01L33/22 ,  H01L33/00 ,  H01L25/16 ,  H01L33/64

Abstract: A method of fabricating a light emitting device package including forming a cell array that includes semiconductor light-emitters including first and second conductivity-type semiconductor layers and an active layer on a substrate, and a separation region, the cell array having a first surface contacting the substrate; exposing the first surface of the separation region by removing the substrate; forming a seed layer on the first surface in the separation region; forming a photoresist pattern on the light-emitters such that the photoresist pattern exposes the seed layer; forming a partition structure that separates the light-emitters by plating a region exposed by the photoresist pattern; forming light emitting windows of the partition structure by removing the photoresist pattern such that the light-emitters are exposed at lower ends of the light emitting windows; and forming wavelength converters by filling the light emitting windows with a wavelength conversion material.