公开(公告)号：US20150048522A1

公开(公告)日：2015-02-19

申请号：US14291698

申请日：2014-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soojae PARK ,  Hyunsuk CHUN

IPC: H01L23/00 ,  H01L25/07

CPC classification number: H01L23/562 ,  H01L23/16 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/06135 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on the first semiconductor chip to expose at least a portion of the first semiconductor chip, and a stress-relieving structure provided at an edge of the first semiconductor chip and configured to relieve stress applied between the first semiconductor chip and the second semiconductor chip.

Abstract translation: 半导体封装包括封装基板，安装在封装基板上的第一半导体芯片，安装在第一半导体芯片上以暴露第一半导体芯片的至少一部分的第二半导体芯片，以及设置在边缘的应力消除结构 并且被配置为减轻施加在第一半导体芯片和第二半导体芯片之间的应力。

公开(公告)号：US20150115468A1

公开(公告)日：2015-04-30

申请号：US14457493

申请日：2014-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunsuk CHUN ,  SOOJAE PARK ,  SEUNGBAE LEE ,  SANGSU HA

IPC: H05K1/18 ,  H01L23/522 ,  H05K1/11 ,  H01L25/065

CPC classification number: H05K1/18 ,  H01L23/5226 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/13014 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81121 ,  H01L2224/81141 ,  H01L2224/81815 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H05K1/11 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided is a semiconductor package including a wiring substrate having top and bottom surfaces facing each other. A first semiconductor chip is disposed on the wiring substrate in a flip-chip manner. The first semiconductor chip has a first surface facing the top surface of the wiring substrate and a second surface opposite to the first surface. First connection members are disposed between the wiring substrate and the first semiconductor chip. The first connection members include first and second contact members each including one or more magnetic materials. The first contact members include portions disposed in the second contact members. The one or more magnetic material of the first contact members have an opposite polar orientation to that of the second contact members.

Abstract translation: 提供一种半导体封装，其包括具有彼此面对的顶表面和底表面的布线基板。 第一半导体芯片以倒装芯片的方式设置在布线基板上。 第一半导体芯片具有面对布线基板的上表面的第一表面和与第一表面相对的第二表面。 第一连接构件设置在布线基板和第一半导体芯片之间。 第一连接构件包括每个包括一个或多个磁性材料的第一和第二接触构件。 第一接触构件包括设置在第二接触构件中的部分。 第一接触构件的一个或多个磁性材料具有与第二接触构件相反的极性取向。