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1.
公开(公告)号:US20230178168A1
公开(公告)日:2023-06-08
申请号:US18164100
申请日:2023-02-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunghye Cho , Kiheung Kim , Sungrae Kim , Junhyung Kim , Kijun Lee , Myungkyu Lee , Changyong Lee , Sanguhn Cha
IPC: G11C29/42 , G11C29/44 , G11C11/408 , G11C11/4091
CPC classification number: G11C29/42 , G11C29/4401 , G11C11/4087 , G11C11/4091 , G11C2029/1204
Abstract: A memory system includes a memory module having a plurality of memory devices therein. A memory controller is configured to transmit commands and addresses to the memory module in synchronization with a clock, input/output data to and from the memory module in synchronization with a data transfer clock, and perform system error correction operations on data read from the memory module. The plurality of memory devices perform on-die error correction operations, which are different from each other according to a physical location of the stored read data.
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公开(公告)号:US20230119555A1
公开(公告)日:2023-04-20
申请号:US17736154
申请日:2022-05-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungrae Kim , Sunghye Cho , Yeonggeol Song , Kijun Lee , Myungkyu Lee
Abstract: A semiconductor memory device includes a memory cell array, an on-die error correction code (ECC) engine, and a control logic circuit. The on-die ECC engine, based on an ECC, in a write operation, performs an ECC encoding on main data to generate first parity data, selectively replaces a portion of the first parity data with a poison flag to generate second parity data based on a poison mode signal, provides the main data to a normal cell region in a target page of the memory cell array, and provides the first parity data to a parity cell region in the target page or provides the poison flag and the second parity data to the parity cell region. The control logic circuit controls the on-die ECC engine and generates the poison mode signal, based on a command and an address from a memory controller.
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公开(公告)号:US20220405165A1
公开(公告)日:2022-12-22
申请号:US17535762
申请日:2021-11-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yeonggeol Song , Sungrae Kim , Kijun Lee , Sunggi Ahn , Yesin Ryu , Sukhan Lee
Abstract: A semiconductor memory device includes a buffer die and a plurality of memory dies. Each of the memory dies includes a memory cell array, an error correction code (ECC) engine and a test circuit. The memory cell array includes a plurality of memory cell rows, each including a plurality of volatile memory cells. The test circuit, in a test mode, generates a test syndrome and an expected decoding status flag indicating error status of the test syndrome, receives test parity data generated by the ECC engine based on the test syndrome and a decoding status flag indicating error status of the test parity data, and determines whether the ECC engine has a defect based on comparison of the test syndrome and the test parity data and a comparison of the expected decoding status flag and the decoding status flag.
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4.
公开(公告)号:US12235757B2
公开(公告)日:2025-02-25
申请号:US18318906
申请日:2023-05-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungrae Kim , Sungyong Cho , Minho Maeing , Gilyoung Kang , Hyeran Kim , Chisung Oh
Abstract: A memory system includes a host system having a memory controller therein, which is configured to generate a command address signal. The memory controller includes a first bit signal generator configured to generate a data signal as a plurality of data bits, a second bit signal generator configured to generate a command address bus inversion bit (CABIB) having a high or low logic level that is a function of a number of data bits within the data signal having a predetermined logic level, and a parity bit generator configured to set a parity signal to a first logic level when a total number of data bits within the data signal and the CABIB having a high logic level is an even number. A storage system is also provided, which is configured to write or read data in response to the command address signal received from the host system. The memory controller is configured to set the CABIB to a high logic level when: (i) “n”, which is a number of bits included in the command address signal, is a positive integer greater than one, and (ii) a number of data bits within the data signal having a low logic level is greater than or equal to (n/2)−1.
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公开(公告)号:US20240370335A1
公开(公告)日:2024-11-07
申请号:US18778475
申请日:2024-07-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungrae Kim , KIJUN LEE , MYUNGKYU LEE , YEONGGEOL SONG , Jinhoon Jang , SUNGHYE CHO , Isak Hwang
IPC: G06F11/10
Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first coedword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.
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公开(公告)号:US11881277B2
公开(公告)日:2024-01-23
申请号:US17718422
申请日:2022-04-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungrae Kim , Myungkyu Lee , Kijun Lee , Sunghye Cho
CPC classification number: G11C29/44 , G06F11/1016 , G11C15/04 , G11C17/165 , H03M13/1108 , H03M13/1168 , H03M13/1575
Abstract: An operating method of a memory device includes storing position information regarding a codeword including an erasure and erasure information including position information regarding the erasure in a memory region, loading the position information regarding the codeword to a row decoder and a column decoder, determining whether a read address corresponding to a read instruction is identical to the position information regarding the codeword including the erasure, in response to the read instruction from a host, transmitting the position information of the erasure to an error correction code (ECC) decoder, when the read address is identical to the position information regarding the codeword including the erasure, and correcting, by the ECC decoder, an error in a codeword received from a memory cell array using the position information regarding the erasure.
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公开(公告)号:US20230367672A1
公开(公告)日:2023-11-16
申请号:US18226622
申请日:2023-07-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungrae Kim , Kijun Lee , Myungkyu Lee , Yeonggeol Song , Jinhoon Jang , Sunghye Cho , Isak Hwang
IPC: G06F11/10
CPC classification number: G06F11/1068
Abstract: A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first codeword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.
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公开(公告)号:US20230168819A1
公开(公告)日:2023-06-01
申请号:US17842981
申请日:2022-06-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yeonggeol Song , Sungrae Kim , Kijun Lee , Myungkyu Lee , Eunae Lee , Sunghye Cho
CPC classification number: G06F3/0626 , G06F3/064 , G06F3/0679 , G06F11/1068
Abstract: A semiconductor memory device includes a buffer die and a plurality of memory dies. An error correction code (ECC) engine in one of the memory dies performs an RS encoding on a main data to generate a parity data and performs a RS decoding, using a parity check matrix, on the main data and the parity data. The parity check matrix includes sub matrixes and each of the sub matrixes corresponds to two different symbols. Each of the sub matrixes includes two identity sub matrixes and two same alpha matrixes, the two identity sub matrixes are disposed in a first diagonal direction of the sub matrix and the two same alpha matrixes are disposed in a second diagonal direction. A number of high-level value elements in a y-th row of the parity check matrix is the same as a number of high-level value elements in a (y+p)-th row.
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公开(公告)号:US12212339B2
公开(公告)日:2025-01-28
申请号:US17984430
申请日:2022-11-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Myungkyu Lee , Kijun Lee , Sunghye Cho , Sungrae Kim
Abstract: An error correction circuit, including an error correction code (ECC) encoder configured to generate parity data corresponding to main data based on a parity generation matrix, and to output a codeword including the main data and the parity data to a plurality of memory devices; and an ECC decoder configured to: read the codeword from the plurality of memory devices, generate a syndrome corresponding to the codeword based on a parity check matrix, detect an error pattern based on the syndrome, generate a plurality of estimation syndromes corresponding to the error pattern using a plurality of partial sub-matrices included in the parity check matrix, and correct an error included in the read codeword based on a result of a comparison between the syndrome and the plurality of estimation syndromes.
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公开(公告)号:US12057184B2
公开(公告)日:2024-08-06
申请号:US18164100
申请日:2023-02-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunghye Cho , Kiheung Kim , Sungrae Kim , Junhyung Kim , Kijun Lee , Myungkyu Lee , Changyong Lee , Sanguhn Cha
IPC: G11C29/42 , G11C11/408 , G11C11/4091 , G11C29/44 , G11C29/12
CPC classification number: G11C29/42 , G11C11/4087 , G11C11/4091 , G11C29/4401 , G11C2029/1202 , G11C2029/1204
Abstract: A memory system includes a memory module having a plurality of memory devices therein. A memory controller is configured to transmit commands and addresses to the memory module in synchronization with a clock, input/output data to and from the memory module in synchronization with a data transfer clock, and perform system error correction operations on data read from the memory module. The plurality of memory devices perform on-die error correction operations, which are different from each other according to a physical location of the stored read data.
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