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公开(公告)号:US20220028431A1
公开(公告)日:2022-01-27
申请号:US17356080
申请日:2021-06-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyungjin Kim , Yongjun Kim , Yonghun Kim , Minsu Ahn , Reum Oh , Jinyong Choi
IPC: G11C5/06 , G11C5/02 , H01L25/065 , H01L23/538
Abstract: A semiconductor device includes a cell area in which a plurality of memory cells are arranged in an array structure, and a peripheral area in which circuits configured to drive the memory cells are arranged, the peripheral area being next to the cell area. The cell area is divided into a plurality of banks, and the plurality of banks comprise first banks having a base size and second banks having a size of 1/(2*n) (wherein n is an integer greater than or equal to 1) of the base size. The plurality of banks are arranged in a first direction and a second direction perpendicular to the first direction, and the semiconductor device has a shape of a rectangular chip which is elongated in the second direction.
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公开(公告)号:US12205668B2
公开(公告)日:2025-01-21
申请号:US17722805
申请日:2022-04-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaemin Choi , Yonghun Kim , Jaewoo Jeong , Kyungryun Kim , Yoochang Sung , Changsik Yoo
IPC: G11C7/10
Abstract: A semiconductor device includes: a plurality of pads connected to a memory device receiving a data signal using first to fourth clock signals having different phases; a data transmission/reception circuit inputting and outputting the data signal to a plurality of data pads of the plurality of pads and including a data delay cell adjusting a phase of the data signal; a clock output circuit outputting first to fourth clock signals to a plurality of clock pads of the plurality of pads and including first to fourth clock delay cells adjusting phases of the first to fourth clock signals; and a controller adjusting a delay amount of at least one of the first to fourth clock delay cells and the data delay cell so that each of the first to fourth clock signals is aligned with the data signal in the memory device.
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公开(公告)号:US20230377667A1
公开(公告)日:2023-11-23
申请号:US18319584
申请日:2023-05-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaewoo Lee , Yonghun Kim , Kihan Kim , ChangSik Yoo
CPC classification number: G11C29/12015 , G11C29/36 , G11C29/1201
Abstract: A semiconductor device includes: a data clock signal generator circuit configured to output a plurality of data clock signals that have different phases and that are used to generate a plurality of internal data clock signals of a memory device; a data transmitter configured to generate a data signal based on a test pattern transitioned once, delay the data signal once transitioned according to a delay value, and output the data signal to the memory device; a data receiver configured to receive an output signal from the memory device that includes first sampling data, the first sampling data being obtained by sampling the data signal based on a first internal data clock signal from the plurality of internal data clock signals; and a training circuit configured to change the delay value and determine a final value of the delay value based on the first sampling data.
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公开(公告)号:US11804841B2
公开(公告)日:2023-10-31
申请号:US17569041
申请日:2022-01-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaemin Choi , Yonghun Kim , Jinhyeok Baek , Yoochang Sung , Changsik Yoo , Jeongdon Ihm
IPC: H03K19/003 , G11C7/22 , G11C5/14 , H03K19/0185 , G11C7/10 , G11C8/06
CPC classification number: H03K19/00384 , G11C5/147 , G11C7/22 , H03K19/018521 , G11C7/1057 , G11C7/1084 , G11C8/06
Abstract: An interface circuit includes: a buffer circuit configured to receive an input signal and to generate an output signal having a delay time, the delay time being determined based on a current level of a bias current and a voltage level of a power supply voltage; and a bias generation circuit configured to vary a voltage level of a bias control voltage so that the delay time is constant by compensating for a change in the voltage level of the power supply voltage, the bias generation circuit being further configured to provide the bias control voltage to the buffer circuit.
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公开(公告)号:US11948621B2
公开(公告)日:2024-04-02
申请号:US17839639
申请日:2022-06-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaewoo Jeong , Yonghun Kim , Jaemin Choi , Yoochang Sung , Changsik Yoo
IPC: G11C11/4076
CPC classification number: G11C11/4076
Abstract: A memory device includes a first rank having first memory banks and a first quad skew adjustment circuit and a second rank having second memory banks and a second quad skew adjustment circuit, wherein each of the first quad skew adjustment circuit and the second quad skew adjustment circuit is configured to: receive a 4-phase clock through first channels; detect internal quad skew of the 4-phase clock; correct skew of the 4-phase clock according to the detected quad skew; and output mode register information corresponding to the detected quad skew through a second channel.
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公开(公告)号:US20230035176A1
公开(公告)日:2023-02-02
申请号:US17839639
申请日:2022-06-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaewoo Jeong , Yonghun Kim , Jaemin Choi , Yoochang Sung , Changsik Yoo
IPC: G11C11/4076
Abstract: A memory device includes a first rank having first memory banks and a first quad skew adjustment circuit and a second rank having second memory banks and a second quad skew adjustment circuit, wherein each of the first quad skew adjustment circuit and the second quad skew adjustment circuit is configured to: receive a 4-phase clock through first channels; detect internal quad skew of the 4-phase clock; correct skew of the 4-phase clock according to the detected quad skew; and output mode register information corresponding to the detected quad skew through a second channel.
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公开(公告)号:US20240212725A1
公开(公告)日:2024-06-27
申请号:US18468227
申请日:2023-09-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Garam Choi , Yonghun Kim , Kihan Kim
IPC: G11C7/10
CPC classification number: G11C7/1048 , G11C2207/2254
Abstract: Provided are a memory device and a method for training per-pin operation parameters. A memory device includes a plurality of on-die termination (ODT) circuits, an impedance control (ZQ) calibration circuit configured to output a first code signal and a second code signal, and a per-pin calibration circuit. The per-pin calibration circuit may be configured to select one signal pin from among the plurality of signal pins, to compare a first input voltage level of the selected signal pin with a second input voltage level of each of the other ones of the plurality of signal pins, to generate a per-pin ODT code signal for each of the plurality of signal pins, to combine the per-pin ODT code signal with the first code signal or the second code signal, and to provide the combined per-pin ODT code signal to the respective ODT circuits.
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公开(公告)号:US20240119997A1
公开(公告)日:2024-04-11
申请号:US18221598
申请日:2023-07-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: GARAM CHOI , Yonghun Kim , Jaewoo Lee , Kihan Kim , Hojun Chang
IPC: G11C11/4093 , G11C11/4074 , G11C11/4076
CPC classification number: G11C11/4093 , G11C11/4074 , G11C11/4076
Abstract: A semiconductor chip includes a write clock buffer, a voltage regulator, a process calibration circuit and a temperature calibration circuit. The voltage regulator generates plural regulated voltages. The process calibration circuit output one of the regulated voltages as a bias voltage of the write clock buffer, depending on a process variation of the semiconductor chip. The temperature calibration circuit track a temperature variation of the semiconductor chip in real time, performs analog calibration on the bias voltage from the process calibration circuit in real time depending on a result of the tracking, and outputs the analog-calibrated bias voltage to the write clock buffer.
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公开(公告)号:US20230377621A1
公开(公告)日:2023-11-23
申请号:US18189580
申请日:2023-03-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaewoo Lee , Yonghun Kim , Kihan Kim , ChangSik Yoo
CPC classification number: G11C7/222 , G11C7/1066 , G11C29/023 , G11C7/1093 , G11C2207/2254
Abstract: A semiconductor device includes: a clock generation circuit configured to output a plurality of clock signals that have different phases to a memory device, an internal clock signal of the memory device being generated responsive to the plurality of clock signals; and a training circuit configured to receive an output signal output based on the internal clock signal from the memory device, to adjust a value of a code used to generate the internal clock signal by adjusting the phase of at least one clock signal among the plurality of clock signals, to determine a final value of the code based on a duty cycle of the output signal, which is changed according to the adjustment of the value of the code, and to write the final value to the memory device.
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公开(公告)号:US11538506B2
公开(公告)日:2022-12-27
申请号:US17356080
申请日:2021-06-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyungjin Kim , Yongjun Kim , Yonghun Kim , Minsu Ahn , Reum Oh , Jinyong Choi
IPC: G11C5/06 , G11C5/02 , H01L23/538 , H01L25/065
Abstract: A semiconductor device includes a cell area in which a plurality of memory cells are arranged in an array structure, and a peripheral area in which circuits configured to drive the memory cells are arranged, the peripheral area being next to the cell area. The cell area is divided into a plurality of banks, and the plurality of banks comprise first banks having a base size and second banks having a size of 1/(2*n) (wherein n is an integer greater than or equal to 1) of the base size. The plurality of banks are arranged in a first direction and a second direction perpendicular to the first direction, and the semiconductor device has a shape of a rectangular chip which is elongated in the second direction.
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