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公开(公告)号:US12088291B2
公开(公告)日:2024-09-10
申请号:US18372726
申请日:2023-09-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changkyo Lee , Dongkeon Lee , Jinhoon Jang , Kyungsoo Ha , Kiseok Oh , Kyungryun Kim
IPC: H03K19/00 , G06F3/06 , G11C7/10 , H03K19/0175 , H03K19/018
CPC classification number: H03K19/0005 , G06F3/0604 , G06F3/061 , G11C7/1051 , G11C7/1084 , H03K19/017545 , H03K19/01825
Abstract: A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
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公开(公告)号:US11799478B2
公开(公告)日:2023-10-24
申请号:US17974873
申请日:2022-10-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changkyo Lee , Dongkeon Lee , Jinhoon Jang , Kyungsoo Ha , Kiseok Oh , Kyungryun Kim
IPC: H03K19/00 , G06F3/06 , G11C7/10 , H03K19/0175 , H03K19/018
CPC classification number: H03K19/0005 , G06F3/061 , G06F3/0604 , G11C7/1051 , G11C7/1084 , H03K19/01825 , H03K19/017545
Abstract: A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
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公开(公告)号:US11783880B2
公开(公告)日:2023-10-10
申请号:US17496003
申请日:2021-10-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jin-Hoon Jang , Kyungryun Kim , Young Ju Kim , Seung-Jun Lee , Youngbin Lee , Yeonkyu Choi
CPC classification number: G11C8/18 , G11C7/1045 , G11C7/1066 , G11C7/1093
Abstract: Disclosed is an operating method of a memory device communicating with a memory controller, which includes receiving a first command from the memory controller, the first command indicating initiation of synchronization of a data clock signal and defining a clock section corresponding to the synchronization, preparing a toggling of the data clock signal during a preparation time period, processing a first data stream based on the data clock signal toggling at a reference frequency, and processing a second data stream based on the data clock toggling at the reference frequency and extended for a period of the defined first clock section.
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公开(公告)号:US20230124660A1
公开(公告)日:2023-04-20
申请号:US17938651
申请日:2022-10-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jinhoon Jang , Kyungryun Kim
IPC: G06F3/06
Abstract: A semiconductor memory device includes a memory cell array and a plurality of data input/output (I/O) pins. The plurality of data I/O pins is configured to receive write data to be stored in the memory cell array or to output read data stored in the memory cell array. The semiconductor memory device is configured to perform a burst operation in which a single data set comprising a plurality of data bits is input or output through the plurality of data I/O pins based on a single command received from an external memory controller. A number of the plurality of data I/O pins corresponds to an integer that is not a power-of-two. A burst length representing a unit of the burst operation corresponds to an integer that is not a power-of-two.
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公开(公告)号:US09613711B2
公开(公告)日:2017-04-04
申请号:US15193134
申请日:2016-06-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungryun Kim , Taehoon Kim , Sangkwon Moon
CPC classification number: G11C16/28 , G11C16/26 , G11C16/32 , G11C16/3495
Abstract: A method controlling the execution of a reliability verification operation in a storage device including a nonvolatile memory device includes; determining whether a read count for a designated unit within the nonvolatile memory device exceeds a count value limit, and upon determining that the read count exceeds the count value limit, executing the reliability verification operation directed to the designated unit, wherein the count value limit is based on at least one of read count information, page bitmap information and environment information stored in the storage device.
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公开(公告)号:US12205668B2
公开(公告)日:2025-01-21
申请号:US17722805
申请日:2022-04-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaemin Choi , Yonghun Kim , Jaewoo Jeong , Kyungryun Kim , Yoochang Sung , Changsik Yoo
IPC: G11C7/10
Abstract: A semiconductor device includes: a plurality of pads connected to a memory device receiving a data signal using first to fourth clock signals having different phases; a data transmission/reception circuit inputting and outputting the data signal to a plurality of data pads of the plurality of pads and including a data delay cell adjusting a phase of the data signal; a clock output circuit outputting first to fourth clock signals to a plurality of clock pads of the plurality of pads and including first to fourth clock delay cells adjusting phases of the first to fourth clock signals; and a controller adjusting a delay amount of at least one of the first to fourth clock delay cells and the data delay cell so that each of the first to fourth clock signals is aligned with the data signal in the memory device.
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公开(公告)号:US12062404B2
公开(公告)日:2024-08-13
申请号:US18239548
申请日:2023-08-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Minho Choi , Jaeseong Lim , Kyungryun Kim , Daehyun Kim , Wonil Bae , Hohyun Shin , Sanghoon Jung , Hyongryol Hwang
Abstract: A voltage trimming circuit including: a first resistance circuit having a first resistance value determined by up codes and down codes; a second resistance circuit having a second resistance value determined by the up codes and the down codes; and a comparator to output a voltage detection signal by comparing a voltage level of a reference voltage trimming node to that of a feedback node, wherein the voltage detection signal adjusts the up and down codes, which increase the first resistance value and decrease the second resistance value when the voltage level of the reference voltage trimming node is higher than that of the feedback node, and adjusts the up and down codes, which decrease the first resistance value and increase the second resistance value when the voltage level of the reference voltage trimming node is lower than that of the feedback node.
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公开(公告)号:US20220140829A1
公开(公告)日:2022-05-05
申请号:US17577141
申请日:2022-01-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Changkyo Lee , Dongkeon Lee , Jinhoon Jang , Kyungsoo Ha , Kiseok Oh , Kyungryun Kim
IPC: H03K19/00 , G06F3/06 , G11C7/10 , H03K19/0175 , H03K19/018
Abstract: A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
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公开(公告)号:US10553273B2
公开(公告)日:2020-02-04
申请号:US16032822
申请日:2018-07-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jang-Woo Ryu , Kyungryun Kim , Soo Hwan Kim , Huikap Yang
IPC: G11C7/00 , G11C11/4091 , G11C7/06 , G11C7/18 , G11C8/08 , G11C11/4097 , G11C11/4093
Abstract: A semiconductor memory device includes a cell array that includes a first row block and a second row block, a bit line sense amplifier block that senses data stored in the first row block or the second row block, a local sense amplifier that latches the sensed data transferred from the bit line sense amplifier block, and a switch that connects the local sense amplifier with a selected one of a first global data line and a second global data line in response to a select signal. The second row block may be placed at an edge of the cell array, and the switch connects the local sense amplifier with the first global data line when the first row block is activated and connects the local sense amplifier with the second global data line when the second row block is activated.
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公开(公告)号:US12073914B2
公开(公告)日:2024-08-27
申请号:US17869061
申请日:2022-07-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungryun Kim
CPC classification number: G11C7/109 , G11C7/1084 , G11C7/1096 , G11C7/22
Abstract: A memory device includes: a memory bank including a plurality of memory cells; and a memory interface circuit configured to store data in the plurality of memory cells based on a command/address signal and a data signal, wherein the memory interface circuit includes: first, second, third and fourth pads configured to receive first, second, third and fourth clock signals, respectively; a first buffer circuit configured to sample the command/address signal in response to an activation time of the first and third clock signals which have opposite phases from each other; and a second buffer circuit configured to sample the data signal in response to the activation time of the first clock signal, an activation time of the second clock signal, the activation time of the third clock signal and an activation time of the fourth clock signal.
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