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    DISPLAY MODULE
    1.
    发明公开
    DISPLAY MODULE 审中-公开

    公开(公告)号：US20230178012A1

    公开(公告)日：2023-06-08

    申请号：US18154364

    申请日：2023-01-13

    申请人： SAMSUNG ELECTRONICS CO., LTD. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

    发明人： Jinho KIM ,  Yong-Sang KIM ,  Donggun OH ,  Eun Kyo JUNG ,  Jungwoo LEE

    IPC分类号： G09G3/32

    CPC分类号： G09G3/32 ,  G09G2310/0267 ,  G09G2330/021 ,  G09G2320/0633 ,  G09G2310/08

    摘要： A display module comprises: a display panel; and a driving unit configured to apply a first control signal for setting a PWM data voltage to sub-pixels, included in each row-line of the display panel for each image frame, to the sub-pixels in a row-line order, and apply a second control signal for controlling the light emission of sub-pixels, included in each row-line, to the sub-pixel in a row-line order, wherein the sub-pixels included in each row-line emit light for a time corresponding to the PWM data voltage set according to the first control signal, based on the second control signal applied to the light emission section corresponding to the image frame, and do not emit light for a preset time based on second control signal applied in a period between consecutive image frame periods.

    MULTI-LAYER CAPACITOR PACKAGE AND PACKAGE HOUSING
    3.
    发明申请
    MULTI-LAYER CAPACITOR PACKAGE AND PACKAGE HOUSING 有权
    多层电容器封装和封装外壳

    公开(公告)号：US20160300663A1

    公开(公告)日：2016-10-13

    申请号：US15063753

    申请日：2016-03-08

    申请人： RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

    发明人： Su-Jeong SEO ,  Tae-Yoo KIM ,  Jung-Kab PARK ,  Young-Il SONG ,  Jin-Ha SHIN ,  Jungwoo LEE ,  Younglae CHO ,  Byung-Wook AHN ,  Jung-Ho PARK ,  Sook-Young YUN ,  Seung-Bin BAEG ,  Young-il NA

    IPC分类号： H01G4/30 ,  H01G4/224 ,  H01G4/005

    CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/224 ,  H01G4/232

    摘要： Disclosed is a multi-layer capacitor package comprising: a multi-layer capacitor; connection electrodes coupled to capacitor electrodes respectively, wherein the connection electrodes in each group of the connection electrodes vertically overlap with each other, and first and second groups of the connection electrodes are horizontally spaced from each other; a package housing configured to receive therein the multi-layer capacitor; and first and second internal electrodes received in the housing to be coupled to the first and second groups of the connection electrodes respectively, wherein the first and second internal electrodes are horizontally spaced from each other.

    摘要翻译： 公开了一种多层电容器封装，包括：多层电容器; 连接电极分别连接到电容器电极，其中每组连接电极中的连接电极彼此垂直重叠，并且第一和第二组连接电极彼此水平间隔开; 封装壳体，其构造成在其中容纳所述多层电容器; 以及容纳在所述壳体中以分别耦合到所述第一和第二组连接电极的第一和第二内部电极，其中所述第一和第二内部电极彼此水平间隔开。

    METHOD OF MANUFACTURING GRAPHENE-COATED COMPOSITE POWDER
    4.
    发明申请
    METHOD OF MANUFACTURING GRAPHENE-COATED COMPOSITE POWDER 有权
    制造石墨包覆复合粉末的方法

    公开(公告)号：US20150287491A1

    公开(公告)日：2015-10-08

    申请号：US14668153

    申请日：2015-03-25

    申请人： RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

    发明人： Sujeong SUH ,  Youngil SONG ,  Jungwoo LEE

    IPC分类号： H01B1/02 ,  B22F9/14 ,  B22F1/02 ,  H01B1/04

    CPC分类号： H01B1/02 ,  B22F1/02 ,  B22F9/14 ,  H01B1/04

    摘要： A method of manufacturing a composite powder using wire explosion and a composite powder prepared by such a method are provided. The method of manufacturing a composite powder may involve coating a metal wire with a carbon-based material, and performing wire explosion on the metal wire coated with the carbon-based material in a solution. The prepared composite powder may include a metal core and a multilayer graphene film that coats a surface of the metal core.

    摘要翻译： 提供使用线爆炸制造复合粉末的方法和通过这种方法制备的复合粉末。 制造复合粉末的方法可以包括用碳基材料涂覆金属线，并且在溶液中涂覆有碳基材料的金属线上进行金属丝爆炸。 所制备的复合粉末可以包括金属芯和涂覆金属芯的表面的多层石墨烯膜。

    LIGHT SOURCE MODULE AND DISPLAY PANEL USING THE SAME
    9.
    发明申请
    LIGHT SOURCE MODULE AND DISPLAY PANEL USING THE SAME 有权

    公开(公告)号：US20230073808A1

    公开(公告)日：2023-03-09

    申请号：US17986009

    申请日：2022-11-14

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Chigoo KANG ,  Seogho LIM ,  Ilseop WON ,  Jungwoo LEE

    IPC分类号： H01L33/58 ,  H01L27/15 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H01L33/38 ,  H01L33/10 ,  G02F1/13357 ,  H01L27/146 ,  F21V5/04 ,  G02B19/00

    摘要： A light source module includes a circuit board, light emitting diode chips on an upper surface of the circuit board, the light emitting diode chips being spaced apart and each emitting blue light and having a first surface facing the upper surface of the circuit board, a second surface opposite the first surface, and first and second electrodes on the first surface, a first multilayer reflective structure on the second surface and including a plurality of alternately stacked insulating layers having different refractive indices, and a lens respectively covering each of the light emitting diode chips and contacting the upper surface of the circuit board at an acute contact angle, the lens having a thickness of 2.5 mm or less from the upper surface of the circuit board, and a contact region with the upper surface of the circuit board with a diameter of 1 mm to 3 mm.