公开(公告)号：US20200209754A1

公开(公告)日：2020-07-02

申请号：US16725191

申请日：2019-12-23

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Seunghyun KIM ,  Yushin PARK ,  Hyungseok PARK ,  Sunghwan KIM ,  Hyeonil JUNG

IPC: G03F7/11 ,  C09D161/12

Abstract: A hardmask composition, a hardmask layer, and a method of forming patterns, the composition including a solvent; and a polymer including a structural unit represented by Chemical Formula 1, wherein, in Chemical Formula 1, A is a substituted or unsubstituted dihydroxypyrene moiety, and E is a substituted or unsubstituted pyrenyl group.

公开(公告)号：US20240255842A1

公开(公告)日：2024-08-01

申请号：US18411690

申请日：2024-01-12

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Sangmi KIM ,  Sunghwan KIM

IPC: G03F1/68

CPC classification number: G03F1/68

Abstract: A hardmask composition, a hardmask layer including a cured product of the aforementioned hardmask composition, and a method of forming patterns that includes using the hardmask layer including a cured product of the aforementioned hardmask composition, the hardmask composition including a solvent and a compound represented by Chemical Formula 1:

公开(公告)号：US20200024384A1

公开(公告)日：2020-01-23

申请号：US16509804

申请日：2019-07-12

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Sunghwan KIM ,  Yushin PARK ,  Hyeonil JUNG

IPC: C08G8/04 ,  C09D161/06 ,  G03F7/11

Abstract: A polymer, an organic layer composition including the polymer, and a method of forming a pattern using the organic layer composition, the polymer including a reaction product of a first compound represented by Chemical Formula 1 and a second compound represented by Chemical Formula 2: (CHO)n1—Ar1—X—Ar2—(CHO)n2  [Chemical Formula 1] wherein, in Chemical Formula 1, X is O, S, or NR, in which R is a hydrogen, or a substituted or unsubstituted C1 to C30 alkyl group, Ar1 and Ar2 are independently a substituted or unsubstituted C6 to C30 aromatic ring group, and n1 and n2 are independently an integer of 1 to 3; Ar3—(OH)m  [Chemical Formula 2] wherein, in Chemical Formula 2, Ar3 is a substituted or unsubstituted C10 to C30 fused aromatic ring group in which at least two rings are fused, and m is an integer of 1 to 3.

公开(公告)号：US20240343938A1

公开(公告)日：2024-10-17

申请号：US18584200

申请日：2024-02-22

Applicant: Samsung SDI Co., Ltd.

Inventor： Sunghwan KIM

IPC: C09D165/00 ,  C08G61/12 ,  H01L21/027 ,  H01L21/3213

CPC classification number: C09D165/00 ,  C08G61/12 ,  H01L21/0271 ,  H01L21/32139 ,  C08G2261/11 ,  C08G2261/1422 ,  C08G2261/312 ,  C08G2261/314 ,  C08G2261/316

Abstract: A hardmask composition, a hardmask layer including a cured product of the hardmask composition, and a method of forming patterns using the hardmask layer including a cured product of the hardmask composition, the hardmask composition including a compound represented by Chemical Formula 1, below; and a solvent,

公开(公告)号：US20170115572A1

公开(公告)日：2017-04-27

申请号：US15264654

申请日：2016-09-14

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Seulgi JEONG ,  Minsoo KIM ,  Sunghwan KIM ,  Hyunji SONG ,  Sunhae KANG ,  Youngmin KIM ,  Yoona KIM ,  Jinhyung KIM ,  Younhee NAM ,  Jaeyeol BAEK ,  Byeri YOON ,  Chungheon LEE ,  Seunghee HONG ,  Sunmin HWANG

IPC: G03F7/11 ,  G03F7/09 ,  G03F7/40 ,  G03F7/20 ,  G03F7/32

Abstract: A method of producing a layer structure and a method of forming a pattern, the method of producing a layer structure including coating a first composition on a substrate that has a pattern thereon; curing the coated first composition to form a first organic layer; applying a liquid material to the first organic layer to remove a part of the first organic layer; and coating a second composition on remaining parts of the first organic layer; and curing the coated second composition on the remaining parts of the first organic layer to form a second organic layer: wherein the first composition and the second composition each independently include a solvent, and a polymer including a structural unit represented by Chemical Formula 1, *A1-B1*.  [Chemical Formula 1]

公开(公告)号：US20250051604A1

公开(公告)日：2025-02-13

申请号：US18428227

申请日：2024-01-31

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Sunghwan KIM ,  Sanghee PARK ,  Hyejeong KIM ,  Seil CHOI ,  Soohee KIM

IPC: C09D165/00 ,  C08G61/12 ,  G03F7/16 ,  H01L21/027

Abstract: A hardmask composition, a hardmask layer manufactured from the hardmask composition, and a method of forming patterns using the hardmask layer manufactured from the hardmask composition, the hardmask composition includes a polymer including a structural unit represented by the following Chemical Formula 1; and a solvent,

公开(公告)号：US20240294795A1

公开(公告)日：2024-09-05

申请号：US18408858

申请日：2024-01-10

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Huiseon CHOE ,  Sunghwan KIM

IPC: C09D165/00 ,  G03F7/11

CPC classification number: C09D165/00 ,  G03F7/11

Abstract: A hardmask composition, a hardmask layer including a cured product of the hardmask composition, and a method of forming patterns using the hardmask layer including a cured product of the hardmask composition, the hardmask composition including a compound represented by Chemical Formula 1; and a solvent,

公开(公告)号：US20220315790A1

公开(公告)日：2022-10-06

申请号：US17696011

申请日：2022-03-16

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Sunghwan KIM ,  Yushin PARK ,  Sunyoung YANG ,  Yongsik YOO

IPC: C09D161/02 ,  C08G6/00 ,  G03F7/11

Abstract: A hardmask composition, a hardmask layer, and a method of forming patterns, the hardmask composition including a polymer and a solvent, wherein the polymer includes a structural unit represented by Chemical Formula 1:

公开(公告)号：US20200017678A1

公开(公告)日：2020-01-16

申请号：US16455942

申请日：2019-06-28

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Jaebum LIM ,  Sunyoung YANG ,  Sunghwan KIM ,  Seunghyun KIM ,  Yushin PARK

IPC: C08L65/02 ,  H01L21/027 ,  H01L21/3213 ,  G03F7/11

Abstract: A hardmask composition, a hardmask layer, and a method of forming patterns, the composition including a solvent; and a polymer that includes a substituted biphenylene structural unit, wherein one phenylene of the biphenylene of the substituted biphenylene structural unit is substituted with at least one of a hydroxy-substituted C6 to C30 aryl group, and a hydroxy-substituted C3 to C30 heteroaryl group.

公开(公告)号：US20190233576A1

公开(公告)日：2019-08-01

申请号：US16339451

申请日：2017-07-21

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Hyeonil JUNG ,  Sunghwan KIM ,  Seunghyun KIM ,  Yushin PARK ,  Jaebum LIM

IPC: C08G61/12 ,  H01L21/033 ,  H01L21/027 ,  H01L21/02 ,  C08G61/10 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26 ,  C09D165/00

CPC classification number: C08G61/124 ,  C08G61/02 ,  C08G61/10 ,  C08G61/12 ,  C08G2261/11 ,  C08G2261/1414 ,  C08G2261/1422 ,  C08G2261/148 ,  C08G2261/228 ,  C08G2261/314 ,  C08G2261/3241 ,  C09D165/00 ,  G03F7/00 ,  G03F7/09 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/26 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/027 ,  H01L21/0276 ,  H01L21/033 ,  H01L21/0332 ,  H01L21/3081 ,  H01L21/31144 ,  H01L21/32139

Abstract: Disclosed are a polymer including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, an organic layer composition including the polymer, and a method of forming patterns using the organic layer composition. The Chemical Formulae 1 and 2 are the same as defined in the specification.