公开(公告)号：US20130284794A1

公开(公告)日：2013-10-31

申请号：US13772208

申请日：2013-02-20

Applicant: SANYO Electric Co., Ltd.

Inventor： Takashi SUZUKI ,  Kouichi SAITOU ,  Yasuyuki YANASE

IPC: B23K20/24 ,  B23K20/02

CPC classification number: B23K20/24 ,  B23K20/023 ,  B23K20/10 ,  B23K20/16 ,  B23K20/233 ,  B23K2101/42 ,  B23K2103/12 ,  H01L24/77 ,  H01L24/84 ,  H01L2224/37012 ,  H01L2224/37147 ,  H01L2224/7701 ,  H01L2224/773 ,  H01L2224/77621 ,  H01L2224/84002 ,  H01L2224/84011 ,  H01L2224/841 ,  H01L2224/84203 ,  H01L2224/84897 ,  H01L2924/00014

Abstract: The metal bonding apparatus comprises: a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion; a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion so as to sandwich the solution between the first bonding portion and the second bonding portion, and in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; and a heating unit configured to heat the first bonding portion and the second bonding portion, wherein the first bonding portion and the second bonding portion are bonded by the pressure applied by the pressing unit and the heat from the heating unit.

Abstract translation: 金属接合装置包括：溶液供给单元，被配置为将能够以氧化铜作为主要成分洗脱氧化物的溶液供给到第一接合部和第二接合部中的至少一个; 压力单元，其构造成对所述第一接合部和所述第二接合部施加压力，以将所述溶液夹在所述第一接合部和所述第二接合部之间，并且在所述第一接合部和所述第二接合部之间的距离 结合部分减少; 以及加热单元，其构造成加热所述第一接合部和所述第二接合部，其中，所述第一接合部和所述第二接合部通过由所述加压单元施加的压力和来自所述加热单元的热而接合。

公开(公告)号：US20140063767A1

公开(公告)日：2014-03-06

申请号：US14075847

申请日：2013-11-08

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Kouichi SAITOU ,  Yoshio OKAYAMA ,  Mayumi NAKASATO

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/4827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/80 ,  H01L24/85 ,  H01L25/18 ,  H01L2224/0345 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/08168 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/80447 ,  H01L2224/8083 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2203/049 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit device according to one exemplary embodiment includes a ceramic substrate, a first conductive pattern provided on one face of the ceramic substrate, a second conductive pattern, formed mainly of Cu, which is provided on the other face of the ceramic substrate, and a semiconductor element provided on an island that constitutes the second conductive pattern. An electrode, whose outermost surface is formed mainly of Cu, is provided in the semiconductor element, and the interface between the island and the electrode is directly fixed by solid-phase bonding.

Abstract translation: 根据一个示例性实施例的电路装置包括陶瓷基板，设置在陶瓷基板的一个面上的第一导电图案，主要由Cu形成的第二导电图案，其设置在陶瓷基板的另一面上， 半导体元件设置在构成第二导电图案的岛上。 在半导体元件中设置有最外表面主要由Cu形成的电极，通过固相键直接固定岛和电极之间的界面。