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公开(公告)号：US20180085795A1
公开(公告)日：2018-03-29
申请号：US15709533
申请日：2017-09-20
摘要： A recover piping cleaning method is a method of cleaning a recovery piping into which a chemical liquid used for processing of a substrate is led via a processing cup, the recovery piping being arranged to lead the led chemical liquid into a predetermined chemical liquid recovery piping, the method including a piping cleaning step of cleaning the interior of the recovery piping by using a cleaning liquid by, while supplying the cleaning liquid to the recovery piping, leading the liquid led into the recovery piping into a drain piping which is different from the chemical liquid recovery piping, and a cleaning chemical liquid supplying step of, supplying the cleaning chemical liquid from a cleaning chemical liquid supply piping connected to the recovery piping to the recovery piping while leading the liquid led into the recovery piping into the drain piping.
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公开(公告)号：US20190067047A1
公开(公告)日：2019-02-28
申请号：US16041919
申请日：2018-07-23
发明人： Shigeki TANIZAWA , Nobuyuki MIYAJI , Makoto TAKAOKA , Naoki SAWAZAKI , Tsuyoshi OKUMURA , Atsuyasu MIURA
IPC分类号： H01L21/67
摘要： A substrate processing method includes a substrate holding step of holding a substrate horizontally, a processing liquid supply step of supplying a water-containing processing liquid to an upper surface of the substrate, a liquid film forming step of forming a liquid film of a low surface tension liquid, having a lower surface tension than water, that covers the upper surface by supplying the low surface tension liquid to the upper surface of the substrate to replace the processing liquid on the substrate with the low surface tension liquid, an opening forming step of supplying a gas to a center region of the liquid film to form an opening in the center region of the liquid film, an opening widening step of widening the opening in order to remove the liquid film, a substrate rotating step of rotating, in the opening widening step, the substrate around a predetermined rotational axis along a vertical direction, a gas supply position moving step of blowing, in the opening widening step, the gas toward a gas supply position that is set further inward than a peripheral edge of the opening on the upper surface of the substrate, and moving the gas supply position toward the peripheral edge of the upper surface of the substrate, and a liquid landing position moving step of supplying, in the opening widening step, the low surface tension liquid toward a liquid landing position that is set further outward than the peripheral edge of the opening on the upper surface of the substrate, and moving the liquid landing position toward the peripheral edge of the upper surface of the substrate.
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公开(公告)号：US20180029089A1
公开(公告)日：2018-02-01
申请号：US15656441
申请日：2017-07-21
IPC分类号： B08B3/14 , B08B3/08 , H01L21/687 , H01L21/67 , H01L21/02
摘要： A substrate processing method includes a chemical liquid supplying step of supplying a chemical liquid to a substrate, an elapsed period measuring step of measuring an after-the-end elapsed period, a recovery step of controlling the switching unit to be in a recovery guiding state, when, at a start of the chemical liquid supplying step, the after-the-end elapsed period is less than a predetermined first period, and a draining step of controlling the switching unit to be in a drain guiding state, in which the liquid led to the recovery space is led to the drain line, when, at the start of the chemical liquid supplying step, the after-the-end elapsed period is not less than the predetermined first period and then switching to the recovery guiding state based on establishment of a predetermined draining ending condition.
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4.发明申请公开(公告)号：US20190091640A1
公开(公告)日：2019-03-28
申请号：US16114253
申请日：2018-08-28
发明人： Hajime NISHIDE , Takashi IZUTA , Takatoshi HAYASHI , Katsuhiro FUKUI , Koichi OKAMOTO , Kazuhiro FUJITA , Atsuyasu MIURA , Kenji KOBAYASHI , Sei NEGORO , Hiroki TSUJIKAWA
摘要： A chemical liquid preparation method of preparing a chemical liquid for treating a film formed on a substrate, including a gas dissolving process in which an oxygen-containing gas and an inert-gas-containing gas are dissolved in the chemical liquid by supplying the oxygen-containing gas which contains oxygen gas and the inert-gas-containing gas which contains an inert gas to a chemical liquid, wherein in the gas dissolving process, a dissolved oxygen concentration in the chemical liquid is adjusted by setting a mixing ratio between the oxygen-containing gas and the inert-gas-containing gas supplied to the chemical liquid as a mixing ratio corresponding to a predetermined target dissolved oxygen concentration.
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公开(公告)号：US20180061678A1
公开(公告)日：2018-03-01
申请号：US15670186
申请日：2017-08-07
CPC分类号： H01L21/67051 , B05B1/02 , B05B15/55 , B05B15/555 , H01L21/67028 , H01L21/67034 , H01L21/6715
摘要： The controller of a substrate processing apparatus carries out a liquid column forming step in which cleaning liquid is discharged through a lower surface nozzle when a spin chuck is not holding a substrate, to form a liquid column extending upward from the lower surface nozzle, and, in parallel with the liquid column forming step, a first dropping portion cleaning step in which an upper surface nozzle is reciprocated horizontally between a first position where a dropping portion of the upper surface nozzle does not contact the liquid column and a second position where the dropping portion of the upper surface nozzle does not contact the liquid column, so as to cause the upper surface nozzle to pass through a first middle position where the upper discharge port of the upper surface nozzle overlaps with the liquid column in a plan view.
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公开(公告)号：US20170294323A1
公开(公告)日：2017-10-12
申请号：US15630387
申请日：2017-06-22
发明人： Atsuyasu MIURA , Hidekazu ISHIKAWA
CPC分类号： H01L21/6708 , B01F1/0038 , B01F3/04503 , B01F3/04737 , B01F3/04744 , B01F5/0614 , B01F5/10 , B01F5/102 , B01F2003/04879 , B01F2003/04921 , C09K13/00 , H01L21/30617 , H01L21/67017 , H01L21/67051 , H01L21/67253
摘要： A substrate processing system includes a chemical liquid preparation unit preparing a chemical liquid to be supplied to a substrate and a processing unit which supplies the chemical liquid, prepared by the chemical liquid preparation unit, to the substrate. The chemical liquid preparation unit supplies an oxygen-containing gas, containing oxygen gas, to a TMAH-containing chemical liquid, containing TMAH (tetramethylammonium hydroxide), to make the oxygen-containing gas dissolve in the TMAH-containing chemical liquid.
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公开(公告)号：US20180207685A1
公开(公告)日：2018-07-26
申请号：US15925327
申请日：2018-03-19
发明人： Atsuyasu MIURA , Naoki SAWAZAKI
CPC分类号： H01L21/67028 , H01L21/02065 , H01L21/67051
摘要： A substrate processing method includes a substrate holding step of holding a substrate horizontally, a liquid droplet discharging step wherein liquid droplets of an organic solvent, formed by mixing the organic solvent and a gas, are discharged from a double-fluid nozzle toward a predetermined discharge region within an upper surface of the substrate, and a liquid film forming step, executed before the liquid droplet discharging step, of supplying the organic solvent to the double fluid nozzle without supplying the gas, so as to discharge the organic solvent in a continuous stream mode from the double-fluid nozzle to form a liquid film of the organic solvent covering the discharge region on the upper surface of the substrate.
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公开(公告)号：US20180025922A1
公开(公告)日：2018-01-25
申请号：US15648900
申请日：2017-07-13
CPC分类号： H01L21/67051 , B08B3/048 , B08B3/08 , B08B3/10 , H01L21/67017
摘要： A substrate processing apparatus includes a guard that catches liquid scattered outward from a spin chuck, a cup defining a liquid receiving groove to catch liquid that is guided downward by the guard, a guard elevating/lowering unit that moves the guard in an up/down direction, a cleaning liquid supplying unit that supplies cleaning liquid, discharged from a cleaning liquid nozzle, to the liquid receiving groove via the spin chuck and the guard, a cleaning liquid draining unit that drains the cleaning liquid in the liquid receiving groove, and a controller that controls the cleaning liquid supplying unit and the cleaning liquid draining unit to accumulate cleaning liquid in the liquid receiving groove and controls the guard elevating/lowering unit to cause a lower end portion of the cylindrical portion to be immersed in the cleaning liquid in the liquid receiving groove.
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公开(公告)号：US20160184870A1
公开(公告)日：2016-06-30
申请号：US14978693
申请日：2015-12-22
发明人： Atsuyasu MIURA , Naoki SAWAZAKI
CPC分类号： H01L21/67028 , H01L21/02065 , H01L21/67051
摘要： A substrate processing method includes a substrate holding step of holding a substrate horizontally, a liquid droplet discharging step of making liquid droplets of an organic solvent, formed by mixing the organic solvent and a gas, be discharged from a double-fluid nozzle toward a predetermined discharge region within an upper surface of the substrate, and a liquid film forming step, executed before the liquid droplet discharging step, of supplying the organic solvent to the double fluid nozzle without supplying the gas to discharge the organic solvent in a continuous stream mode from the double-fluid nozzle to form a liquid film of the organic solvent covering the discharge region on the upper surface of the substrate.
摘要翻译： 基板处理方法包括：水平保持基板的基板保持工序;通过混合有机溶剂和气体而形成的有机溶剂的液滴的液滴排出工序，从双流体喷嘴朝预定的方向排出; 以及在液滴排出步骤之前执行的液膜形成步骤，将有机溶剂供应到双流体喷嘴，而不供应气体以连续流模式从有机溶剂中排出 双液喷嘴，形成覆盖基板上表面上的排出区域的有机溶剂的液膜。
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公开(公告)号：US20240342672A1
公开(公告)日：2024-10-17
申请号：US18755680
申请日：2024-06-27
发明人： Hajime NISHIDE , Takashi IZUTA , Takatoshi HAYASHI , Katsuhiro FUKUI , Koichi OKAMOTO , Kazuhiro FUJITA , Atsuyasu MIURA , Kenji KOBAYASHI , Sei NEGORO , Hiroki TSUJIKAWA
IPC分类号： B01F35/82 , B01F23/231 , B01F23/237 , B01F35/21 , B01F35/22 , G05D11/00 , G05D21/02 , H01L21/306 , H01L21/3213 , H01L21/67 , B01F101/58
CPC分类号： B01F35/82 , B01F23/231 , B01F23/237611 , B01F23/237612 , B01F23/23765 , B01F35/2132 , B01F35/2202 , G05D11/00 , G05D21/02 , H01L21/30608 , H01L21/32134 , H01L21/67017 , H01L21/67028 , H01L21/67051 , H01L21/67075 , H01L21/6708 , B01F2101/58
摘要： A chemical liquid preparation method of preparing a TMAH-containing chemical liquid, including, a correspondence relationship preparing step of preparing a correspondence relationship between a supply flow rate ratio between an oxygen-containing gas and an inert-gas-containing gas and a convergent dissolved oxygen concentration in the TMAH-containing chemical liquid that is converged to when the oxygen-containing gas and the inert-gas-containing gas are supplied into the TMAH-containing chemical liquid; a concentration setting step of setting a target dissolved oxygen concentration in the TMAH-containing chemical liquid; a supply-flow-rate-ratio acquiring step of acquiring the supply flow rate ratio between the oxygen-containing gas and the inert-gas-containing gas corresponding to the target dissolved oxygen concentration in accordance with the correspondence relationship prepared in the correspondence relationship preparing step; and a gas supplying step of supplying the oxygen-containing gas and the inert-gas-containing gas with the supply flow rate ratio acquired in the supply-flow-rate-ratio acquiring step.
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