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1.发明申请公开(公告)号：US20190041755A1
公开(公告)日：2019-02-07
申请号：US16073861
申请日：2017-02-03
发明人： Yuji TANAKA , Masaya ASAI , Masahiko HARUMOTO , Koji KANEYAMA
摘要： A substrate having a film of a coating liquid containing metal is held by a spin chuck, the film having been exposed in a predetermined pattern. A slit nozzle supplies a development liquid to a surface to be processed of the substrate supported by the spin chuck. A cleaning liquid for removing or dissolving metal is supplied by a cleaning nozzle to the surface to be processed of the substrate to which the development liquid has been supplied.
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公开(公告)号：US20190004427A1
公开(公告)日：2019-01-03
申请号：US15737805
申请日：2016-04-15
发明人： Yuji TANAKA , Masaya ASAI , Masahiko HARUMOTO , Koji KANEYAMA
CPC分类号： G03F7/162 , G03F7/168 , G03F7/30 , G03F7/3021 , G03F7/3092 , G03F7/322 , G03F7/325 , H01L21/027 , H01L21/0276
摘要： A substrate processing apparatus includes a spin chuck that holds a substrate, a processing liquid supply unit that supplies a first processing liquid having first specific gravity and a second processing liquid having second specific gravity smaller than the first specific gravity to a surface to be processed of the substrate held by the spin chuck, a collection tank that stores the used first and second processing liquids that have been supplied to the substrate, and a processing liquid separating mechanism that separates the first processing liquid and the second processing liquid based on specific gravity, the first and second processing liquids being stored in the collection tank.
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3.发明申请公开(公告)号：US20180253012A1
公开(公告)日：2018-09-06
申请号：US15902037
申请日：2018-02-22
发明人： Tomohiro MATSUO , Yasuhiro FUKUMOTO , Takafumi OKI , Masaya ASAI , Masahiko HARUMOTO , Yuji TANAKA , Chisayo NAKAYAMA
IPC分类号： G03F7/20 , H01L21/027 , G03F7/16
CPC分类号： G03F7/7055 , G03F7/0002 , G03F7/168 , G03F7/2004 , G03F7/70008 , G03F7/70558 , G03F7/70858 , G03F7/70933 , H01L21/0274 , H01L21/31133 , H01L21/67115 , H01L21/67253 , H01L21/67748 , H01L21/68742
摘要： An atmosphere in a processing chamber in which a substrate is stored is discharged by a suction device. At a time point at which oxygen concentration in the processing chamber is lowered to predetermined exposure starting concentration, emission of vacuum ultraviolet rays from a light source to the substrate is started. The emission of the vacuum ultraviolet rays to the substrate is stopped at a time point at which the exposure amount of the substrate increases to a predetermined set exposure amount. The exposure starting concentration is defined in advance to be higher than 1% and lower than oxygen concentration in the air, and is defined in advance such that ozone generated from oxygen atoms by the emission of the vacuum ultraviolet rays do not damage the film on the surface to be processed of the substrate.
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4.发明申请公开(公告)号：US20180253011A1
公开(公告)日：2018-09-06
申请号：US15900889
申请日：2018-02-21
发明人： Tomohiro MATSUO , Yasuhiro FUKUMOTO , Takafumi OKI , Masaya ASAI , Masahiko HARUMOTO , Yuji TANAKA , Chisayo NAKAYAMA
摘要： Vacuum ultraviolet rays are emitted to a surface to be processed of a substrate to be processed by a light source. During an emission period in which the vacuum ultraviolet rays are emitted from the light source to the substrate, part of the vacuum ultraviolet rays is received by an illuminometer, and illuminance of the received vacuum ultraviolet rays is measured. A light receiving surface of the illuminometer is located at a constant height that is based on the surface to be processed of the substrate during the emission period of the vacuum ultraviolet rays. An exposure amount of the substrate is calculated based on the illuminance measured by the illuminometer. Emission of the vacuum ultraviolet rays from the light source to the substrate is stopped based on the calculated exposure amount of the substrate.
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5.发明申请公开(公告)号：US20180147599A1
公开(公告)日：2018-05-31
申请号：US15579505
申请日：2016-04-15
发明人： Yuji TANAKA , Masaya ASAI , Masahiko HARUMOTO , Koji KANEYAMA
CPC分类号： B05D1/005 , B05C11/08 , B05C11/10 , B05C11/1039 , B05D3/007 , C23F1/00 , C23F1/08 , H01L21/67051 , H01L21/6708 , H01L21/67167 , H01L21/67173 , H01L21/67178 , H01L21/67742 , H01L21/68707
摘要： A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.
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6.发明申请公开(公告)号：US20180050368A1
公开(公告)日：2018-02-22
申请号：US15669202
申请日：2017-08-04
发明人： Masahiko HARUMOTO , Masaya ASAI , Yuji TANAKA , Koji KANEYAMA
CPC分类号： B05D1/60 , B05D3/007 , G03F7/0002 , H01L21/02118 , H01L21/02282 , H01L21/02318 , H01L21/0273 , H01L21/67103 , H01L21/68742
摘要： A heating plate is stored in a chamber. With a solvent containing gas present in the chamber, a substrate on which a DSA film is formed is held at a position further upward than the heating plate. Thus, neutralization of an atmosphere is performed at a temperature at which microphase separation does not occur. Thereafter, with the solvent containing gas present in the chamber, the substrate is held on an upper surface of the heating plate. Thus, thermal processing is performed on the DSA film on the substrate.
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公开(公告)号：US20180315623A1
公开(公告)日：2018-11-01
申请号：US15772229
申请日：2016-10-27
发明人： Yuji TANAKA , Masaya ASAI , Masahiko HARUMOTO , Koji KANEYAMA
CPC分类号： H01L21/027 , H01L21/304
摘要： A substrate is held and rotated by a spin chuck, and a coating liquid is discharged to the substrate. The coating liquid that is splashed outwardly from the substrate is received by an outer cup. A cleaning liquid that has been discharged from a cup cleaning nozzle is discharged to an inner peripheral surface of the outer cup through a first guide to clean the outer cup. Thus, the coating liquid, its solidified matter and the like adhering to the outer cup are dissolved and removed from the outer cup. Subsequently, a metal removal liquid that has been discharged from the cup cleaning nozzle is discharged to an inner peripheral surface of the outer cup through a second guide. Thus, a metallic component remaining on the outer cup is dissolved and removed from the outer cup.
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公开(公告)号：US20180231894A1
公开(公告)日：2018-08-16
申请号：US15856486
申请日：2017-12-28
CPC分类号： G03F7/40 , G03F7/0002
摘要： Disclosed is a substrate treating method for performing a heat treatment of a substrate having a treated film formed thereon in a heat treating space of a heat treating chamber. The method includes an exhaust step of exhausting gas within the heat treating space formed by a cover enclosing surroundings of a heat treating plate; an inert gas supply step of supplying inert gas from an upper portion of the heat treating space into the heat treating space and supplying inert gas into a gap between an outer peripheral surface of the heat treating plate and an inner wall of the cover; and a heat treating step of performing the heat treatment of the substrate in the heat treating space. The heat treating step is performed after the exhaust step and the inert gas supply step.
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公开(公告)号：US20180230599A1
公开(公告)日：2018-08-16
申请号：US15854011
申请日：2017-12-26
发明人： Yuji TANAKA , Chisayo NAKAYAMA , Masahiko HARUMOTO , Masaya ASAI , Yasuhiro FUKUMOTO , Tomohiro MATSUO , Takeharu ISHII
IPC分类号： C23C16/56 , H01L21/67 , H01L21/687
CPC分类号： C23C16/56 , C23C16/4408 , H01L21/67098 , H01L21/67109 , H01L21/67126 , H01L21/6719 , H01L21/67248 , H01L21/68742
摘要： Disclosed is a substrate treating method for performing a heat treatment of a substrate having a treated film formed thereon in a heat treating space of a heat treating chamber. The method includes an exhaust step of performing exhaust of gas within the heat treating space, an inert gas supply step of supplying inert gas into the heat treating space, and a heat treating step of performing the heat treatment of the substrate in the heat treating space.
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10.发明申请公开(公告)号：US20180076056A1
公开(公告)日：2018-03-15
申请号：US15696611
申请日：2017-09-06
发明人： Masahiko HARUMOTO , Koji KANEYAMA , Yuji TANAKA , Masaya ASAI
IPC分类号： H01L21/67 , H01L21/687 , H01L21/311 , H01L21/02
CPC分类号： H01L21/31133 , H01L21/02118 , H01L21/02348 , H01L21/6708 , H01L21/67225 , H01L21/68764
摘要： During a first period, pure water used as a low-volatile liquid is supplied onto a substrate while the substrate is rotated. After discharge of the low-volatile liquid is stopped, the low-volatile liquid remains in a large region on a DSA film. The low-volatile liquid is held on the DSA film without reacting with the DSA film. During a subsequent second period, an organic solvent is supplied to the substrate while the substrate is rotated. The organic solvent supplied to the substrate is mixed with the low-volatile liquid remaining on the DSA film. In this case, volatilization of the organic solvent is inhibited on the DSA film.
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