SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20200294848A1

    公开(公告)日:2020-09-17

    申请号:US16832442

    申请日:2020-03-27

    Abstract: A semiconductor device having a semiconductor element (a thin film transistor, a thin film diode, a photoelectric conversion element of silicon PIN junction, or a silicon resistor element) which is light-weight, flexible (bendable), and thin as a whole is provided as well as a method of manufacturing the semiconductor device. In the present invention, the element is not formed on a plastic film. Instead, a flat board such as a substrate is used as a form, the space between the substrate (third substrate (17)) and a layer including the element (peeled layer (13)) is filled with coagulant (typically an adhesive) that serves as a second bonding member (16), and the substrate used as a form (third substrate (17)) is peeled off after the adhesive is coagulated to hold the layer including the element (peeled layer (13)) by the coagulated adhesive (second bonding member (16)) alone. In this way, the present invention achieves thinning of the film and reduction in weight.

    Semiconductor device and method of manufacturing the same

    公开(公告)号:US10607883B2

    公开(公告)日:2020-03-31

    申请号:US15479311

    申请日:2017-04-05

    Abstract: A semiconductor device having a semiconductor element (a thin film transistor, a thin film diode, a photoelectric conversion element of silicon PIN junction, or a silicon resistor element) which is light-weight, flexible (bendable), and thin as a whole is provided as well as a method of manufacturing the semiconductor device. In the present invention, the element is not formed on a plastic film. Instead, a flat board such as a substrate is used as a form, the space between the substrate (third substrate (17)) and a layer including the element (peeled layer (13)) is filled with coagulant (typically an adhesive) that serves as a second bonding member (16), and the substrate used as a form (third substrate (17)) is peeled off after the adhesive is coagulated to hold the layer including the element (peeled layer (13)) by the coagulated adhesive (second bonding member (16)) alone. In this way, the present invention achieves thinning of the film and reduction in weight.

    Light Emitting Device
    8.
    发明申请
    Light Emitting Device 审中-公开
    发光装置

    公开(公告)号:US20170018736A1

    公开(公告)日:2017-01-19

    申请号:US15219637

    申请日:2016-07-26

    Abstract: An objective is to increase the reliability of a light emitting device structured by combining TFTs and organic light emitting elements. A TFT (1201) and an organic light emitting element (1202) are formed on the same substrate (1203) as structuring elements of a light emitting device (1200). A first insulating film (1205) which functions as a blocking layer is formed on the substrate (1203) side of the TFT (1201), and a second insulating film (1206) is formed on the opposite upper layer side as a protective film. In addition, a third insulating film (1207) which functions as a barrier film is formed on the lower layer side of the organic light emitting element (1202). The third insulating film (1207) is formed by an inorganic insulating film such as a silicon nitride film, a silicon oxynitride film, an aluminum nitride film, an aluminum oxide film, or an aluminum oxynitride film. A fourth insulating film (1208) and a partitioning layer (1209) formed on the upper layer side of the organic light emitting element (1202) are formed using similar inorganic insulating films.

    Abstract translation: 目的是提高通过组合TFT和有机发光元件而构成的发光器件的可靠性。 在与发光器件(1200)的结构元件相同的衬底(1203)上形成TFT(1201)和有机发光元件(1202)。 在TFT(1201)的基板(1203)侧形成有用作阻挡层的第一绝缘膜(1205),在相对的上层侧形成作为保护膜的第二绝缘膜(1206)。 此外,在有机发光元件(1202)的下层侧形成用作阻挡膜的第三绝缘膜(1207)。 第三绝缘膜(1207)由诸如氮化硅膜,氮氧化硅膜,氮化铝膜,氧化铝膜或氮氧化铝膜的无机绝缘膜形成。 使用类似的无机绝缘膜形成在有机发光元件(1202)的上层侧上形成的第四绝缘膜(1208)和分隔层(1209)。

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