公开(公告)号：US20190228975A1

公开(公告)日：2019-07-25

申请号：US16256194

申请日：2019-01-24

Applicant: Semsysco GmbH

Inventor： Franz Markut ,  Thomas Wirnsberger ,  Oliver Knoll ,  Andreas Gleissner ,  Harald Okorn-Schmidt ,  Philipp Engesser

IPC: H01L21/288 ,  C25D7/12 ,  C25D17/00 ,  C25D5/02 ,  C25D21/12

Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.

公开(公告)号：US20250146165A1

公开(公告)日：2025-05-08

申请号：US18833353

申请日：2022-12-09

Applicant: SEMSYSCO GMBH

Inventor： Andreas Gleissner ,  Georg Hofer ,  Franz Markut

IPC: C25D17/00 ,  C25D21/04 ,  C25D21/10 ,  C25D21/11

Abstract: The disclosure relates to a system for a chemical and/or electrolytic surface treatment of a substrate comprises a catholyte chamber, an anolyte chamber, a distribution body, and a catholyte outlet. The distribution body is arranged in the catholyte chamber and the catholyte chamber is separated from the anolyte chamber by means of a membrane, wherein the membrane is tilted relative to the distribution body. The distribution body comprises jet openings for distributing a catholyte onto the substrate to be treated and drain openings for draining the catholyte out of a reaction space between the distribution body and the substrate. The catholyte outlet is arranged at the catholyte chamber in an eccentric position.

公开(公告)号：US11164748B2

公开(公告)日：2021-11-02

申请号：US16256194

申请日：2019-01-24

Applicant: Semsysco GmbH

Inventor： Franz Markut ,  Thomas Wirnsberger ,  Oliver Knoll ,  Andreas Gleissner ,  Harald Okorn-Schmidt ,  Philipp Engesser

IPC: H01L21/288 ,  C25D17/00 ,  C25D21/12 ,  C25D5/02 ,  C25D7/12 ,  C25D5/34 ,  C25D21/04 ,  C25D5/00 ,  H01L21/768 ,  H05K3/42 ,  B05C3/00 ,  B05C3/02 ,  B05C9/14

Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.

公开(公告)号：US11908698B2

公开(公告)日：2024-02-20

申请号：US17491692

申请日：2021-10-01

Applicant: SEMSYSCO GMBH

Inventor： Franz Markut ,  Thomas Wirnsberger ,  Oliver Knoll ,  Andreas Gleissner ,  Harald Okorn-Schmidt ,  Philipp Engesser

IPC: C25D5/34 ,  H01L21/288 ,  C25D7/12 ,  C25D5/02 ,  C25D17/00 ,  C25D21/04 ,  C25D5/00 ,  H01L21/768 ,  H05K3/42 ,  B05C3/00 ,  B05C3/02 ,  B05C9/14 ,  C25D21/12

CPC classification number: H01L21/2885 ,  B05C3/005 ,  B05C3/02 ,  B05C9/14 ,  C25D5/003 ,  C25D5/02 ,  C25D5/34 ,  C25D7/123 ,  C25D17/001 ,  C25D21/04 ,  C25D21/12 ,  H01L21/76877 ,  H05K3/42

Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps:



Providing a substrate with a substrate surface comprising at least one recess,
applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas,
applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and
plating the recess.

公开(公告)号：US20220020591A1

公开(公告)日：2022-01-20

申请号：US17491692

申请日：2021-10-01

Applicant: SEMSYSCO GMBH

Inventor： Franz Markut ,  Thomas Wirnsberger ,  Oliver Knoll ,  Andreas Gleissner ,  Harald Okom-Schmidt ,  Philipp Engesser

IPC: H01L21/288 ,  C25D7/12 ,  C25D5/02 ,  C25D17/00 ,  C25D5/34 ,  C25D21/04 ,  C25D5/00 ,  H01L21/768 ,  H05K3/42 ,  B05C3/00 ,  B05C3/02 ,  B05C9/14 ,  C25D21/12

Abstract: The teaching relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate includes the following:
a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.

公开(公告)号：US11105014B2

公开(公告)日：2021-08-31

申请号：US16044167

申请日：2018-07-24

Applicant: Semsysco GmbH

Inventor： Andreas Gleissner ,  Franz Markut ,  Herbert Ötzlinger

IPC: C25B15/08 ,  C25D21/12 ,  C25D17/00 ,  C25D7/12 ,  C25F3/12 ,  C25F3/30 ,  H01L21/288 ,  H01L21/3063

Abstract: An exemplary distribution system, apparatus and method can be provide for chemical and/or electrolytic surface treatment of a substrate in a process fluid. The distribution system can comprise a distribution body and a control unit. The distribution body can be configured to direct a flow of the process fluid and/or an electrical current to the substrate. The distribution body can comprise at least a first distribution element and a second distribution element. The control unit/device can be configured to control the first distribution element and the second distribution element separately from one another.